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KR970015702A - 전자공업용 접착제로서의 예비 세라믹 중합체의 용도 - Google Patents

전자공업용 접착제로서의 예비 세라믹 중합체의 용도 Download PDF

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Publication number
KR970015702A
KR970015702A KR1019960041534A KR19960041534A KR970015702A KR 970015702 A KR970015702 A KR 970015702A KR 1019960041534 A KR1019960041534 A KR 1019960041534A KR 19960041534 A KR19960041534 A KR 19960041534A KR 970015702 A KR970015702 A KR 970015702A
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KR
South Korea
Prior art keywords
silicon
substrate
electronic component
ceramic
polymer
Prior art date
Application number
KR1019960041534A
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English (en)
Inventor
클레이튼 알. 베어링거
로버트 찰스 케밀레티
그리쉬 찬드라
로렌 앤드류 할러스카
테레사 아일린 젠틀
Original Assignee
루이스 노만 에드워드
다우 코닝 코포레이션
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Application filed by 루이스 노만 에드워드, 다우 코닝 코포레이션 filed Critical 루이스 노만 에드워드
Publication of KR970015702A publication Critical patent/KR970015702A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • H01L2924/01—Chemical elements
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Abstract

본 발명은 전자부품과 기판 사이에 예비 세라믹 중합체 층을 도포하여 이들을 상호 접착시킨 다음 가열하여 예비 세라믹 중합체를 세라믹으로 전환시킴을 포함하여, 전자부품을 기판에 접착시키는 방법에 관한 것이다. 본 발명의 방법은 환경에 의해 영향을 받지 않는 강력한 결합을 형성한다. 본 발명은 캐리어(carrier) 또는 회로판에 대한 집적회로의 접착에 유용하다.

Description

전자공업용 접착제로서의 예비 세라믹 중합체의 용도
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 각각 서로 접착될 표면을 갖는 전자부품과 기판을 제공하는 단계, 접착될 표면들 사이에 규소 함유 예비 세라믹 중합체를 포함하는 조성물 층을 도포하는 단계, 피접착 표면들을 결합시켜 전자부품, 기판 및 이들 사이에 도포된 규소 함유 예비 세라믹 중합체를 포함하는 어셈블리(assembly)를 형성하는 단계 및 어셈블리를 예비 세라믹 중합체를 세라믹으로 전환시키기에 충분한 온도로 가열하는 단계를 포함하여, 전자부품을 기판에 접착하는 방법.
  2. 제1항에 있어서, 전자부품이 집적회로 칩이고 기판이 회로판 및 칩 캐리어(carrier)로부터 선택되는 방법.
  3. 제1항에 있어서, 전자부품이 집적회로 칩 캐리어이고 기판이 회로판인 방법.
  4. 제1항에 있어서, 규소 함유 예비 세라믹 중합체가 폴리실록산, 폴리실라잔, 폴리실란 및 폴리카보실란으로 이루어진 그룹으로부터 선택되는 방법.
  5. 제1항에 있어서, 규소 함유 예비 세라믹 중합체가 하이드로겐 실세스퀴옥산 수지인 방법.
  6. 제1항에 있어서, 규소 함유 예비 세라믹 중합체가 하이드로폴리실라잔 수지인 방법.
  7. 제1항에 있어서, 규소 함유 예비 세라믹 중합체를 포함하는 조성물이 용매를 함유하는 방법.
  8. 제1항에 있어서, 규소 함유 예비 세라믹 중합체를 포함하는 조성물이 충전제를 함유하는 방법
  9. 제1항에 있어서, 어셈블 리가 150 내지 600℃의 온도에서 5분 내지 6시간 동안 가열되는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960041534A 1995-09-25 1996-09-23 전자공업용 접착제로서의 예비 세라믹 중합체의 용도 KR970015702A (ko)

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