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KR970701160A - 세라믹 복합체의 제조방법(Verfahren zur herstellung von keramischen verbundkorpern) - Google Patents

세라믹 복합체의 제조방법(Verfahren zur herstellung von keramischen verbundkorpern)

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Publication number
KR970701160A
KR970701160A KR1019960704386A KR19960704386A KR970701160A KR 970701160 A KR970701160 A KR 970701160A KR 1019960704386 A KR1019960704386 A KR 1019960704386A KR 19960704386 A KR19960704386 A KR 19960704386A KR 970701160 A KR970701160 A KR 970701160A
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South Korea
Prior art keywords
ceramic
layers
sheet
composite
plastic carrier
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KR1019960704386A
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English (en)
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KR100399670B1 (ko
Inventor
린데만 게르트
쉬나이더 게르하트
슈타크 엘리사베트
홀즈슈흐 랄프
Original Assignee
베렌스; 뢰저
로베르트 보쉬 게엠베하
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Publication of KR970701160A publication Critical patent/KR970701160A/ko
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Publication of KR100399670B1 publication Critical patent/KR100399670B1/ko

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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/963—Surface properties, e.g. surface roughness
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/341—Silica or silicates
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/346—Titania or titanates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
    • C04B2237/348—Zirconia, hafnia, zirconates or hafnates
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C—CHEMISTRY; METALLURGY
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)

Abstract

본 발명은 1층간에 개량된 접착 및 층내에 개량된 균질성을 가지는 2층이상으로 이루어지는 세라믹 복합체를 제조하기 위해서,
(1) 미세한 세라믹 원료분말, 유기시트 형성제 및 용제를 함유하는 세라믹 슬립으로 이루어지는 층을, 그 표면이 세라믹 기판 시트의 원하는 거칠기특성에 상응하는 거칠기를 가지며, 또한 실린화되어 있는, 플라스틱 캐리어 시트상에 담당유지하고, 용제를 증발하고, 또한 세라믹시트를 플라스틱 캐리어 시트로부터 벗기는 것에 의해 최적인 거칠기특성을 가지는 세라믹 기판 시트를 제조하고,
(2) 세라믹 기판 시트 또는 그것으로부터 뚫려진 기판카드의, 플라스틱 캐리어 시트와 접촉한 면상에, 제2의 적어도 미세한 세라믹 원료분말에 관하여 다른 조성의 세라믹 슬립으로 이루어지는 층을 담당유지하고, 활용제를 증발시키고, 또한
(3) 발생한, 2층 이상으로 이루어지는 그린체를 유기성분제거를 위해 가열하고, 이층을 공소결(共燒結)하여 복합체로 하는 세라믹 복합체의 제조방법에 관한 것이다. 이 세막 복합체는 전기 또는 전자부품 또는 기능소자이거나, 또는 그와 같은 부품 또는 기능소자의 구성부분으로서 사용된다.

Description

세라믹 복합체의 제조방법(Verfahren zur herstellung von keramischen verbundkorpern)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 층간에 개량된 접착 및 층내에 개량된 균질성을 가지는 2층이상으로 이루어지는 세라믹 복합체의 제조방법에 있어서,
    (1) 미세한 세라믹 원료분말, 유기시트 형성제 및 용제를 함유하는 세라믹 슬립으로 이루어지는 층을, 그 표면이 세라믹 기판 시트의 원하는 거칠기특성에 상응하는 거칠기를 가지며, 또한 실리화되어 있는, 플라스틱 캐리어 시트상에 담당유지되어, 용제를 증발하고, 또한 세라믹시트를 플라스틱 캐리어 시트로부터 벗기는 것에 의해 최적인 거칠기특성을 가지는 세라믹 기판 시트를 제조하고,
    (2) 세라믹 기판 시트 또는 그것으로부터 구멍을 뚫은 기판카드의, 플라스틱 캐리어 시트와 접촉한 면상에, 제2의 적어도 미세한 세라믹 원료분말에 관하여 다른 조성의 세라믹 슬립으로 이루어지는 층을 담당유지하고, 또한 용제를, 증발시키고, 또한
    (3) 발생한, 2층 이상으로 이루어지는 그린체를 유기성분제거를 위해 가열하고, 이층을 공소결하여 복합체로 하는 것을 특징으로 하는 세라믹 복합체의 제조방법.
  2. 제1항에 있어서; 플라스틱 캐리어 시트가 표면을 실란화한 폴리에스테르로 이루어지거나 또는 적어도 실란화한 폴리에스테르 표면을 가지는 것을 특징으로 하는 세라믹 복합체의 제조방법.
  3. 소결에 의해 서로 결합한 2개 이상의 층을 가지는 복합시스템에 있어서, 복합시스템이 전기 또는 전자부품 또는 기능소자이거나, 또는 그와 같은 부품 또는 기능소자의 구성부분이고, 소결로 결합한 층은 제1항 또는 제2항의 방법에 의해 제조된 것을 특징으로 하는 복합체시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960704386A 1994-12-24 1995-11-25 세라믹복합체의제조방법 KR100399670B1 (ko)

Applications Claiming Priority (2)

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DEP4446533.5 1994-12-24
DE4446533A DE4446533C1 (de) 1994-12-24 1994-12-24 Verfahren zur Herstellung von keramischen Verbundkörpern und deren Verwendung

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KR970701160A true KR970701160A (ko) 1997-03-17
KR100399670B1 KR100399670B1 (ko) 2003-12-31

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EP (1) EP0750597B1 (ko)
JP (1) JPH09509644A (ko)
KR (1) KR100399670B1 (ko)
DE (2) DE4446533C1 (ko)
ES (1) ES2136313T3 (ko)
WO (1) WO1996020145A1 (ko)

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DE19645949C2 (de) * 1996-11-07 1999-05-12 Karlsruhe Forschzent Verfahren zur Herstellung einer dauerplastischen, keramischen Modelliermasse und deren Verwendung
DE19838800C1 (de) * 1998-05-06 2000-03-16 Fraunhofer Ges Forschung Batterieseparator auf Basis von keramisch beschichtetem Trägermaterial
DE19928918B4 (de) * 1999-06-24 2004-06-03 Robert Bosch Gmbh Keramischer Schlicker und Verfahren zur Herstellung keramischer Grünkörper mit dem Schlicker
DE10030106B4 (de) * 2000-06-19 2006-04-27 Roosen, Andreas, Prof. Dr.-Ing. Verfahren zur Herstellung von geschichteten Verbundwerkstoffen oder monolithischen Strukturen
DE10038987A1 (de) * 2000-08-10 2002-02-28 Bosch Gmbh Robert Keramische Schicht, keramischer Schichtkörper mit derartigen Schichten und Verfahren zu deren Herstellung
DE10043202A1 (de) * 2000-09-01 2002-03-28 Epcos Ag Keramikschlicker, Verfahren zur Herstellung einer keramischen Grünfolie und Verwendung des Verfahrens
DE10358911B3 (de) * 2003-12-16 2005-07-28 Friwo Mobile Power Gmbh Flexibler Flachleiter mit integriertem Ausgangsfilter
ITMI20040344A1 (it) * 2004-02-26 2004-05-26 Fait Plast S P A Metodo per ottenere la reticolazione di una composizione termoplastica e pellicola termoplastica cosi'prodotta
DE102006043216A1 (de) * 2006-06-02 2007-12-06 Inoviscoat Gmbh Verbundmaterial und Verfahren zum Herstellen eines derartigen Verbundmaterials
DE102022114925A1 (de) 2022-06-14 2023-12-14 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zur Herstellung eines Festkörperseparators für eine Batteriezelle

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FR2238688A1 (en) * 1973-07-27 1975-02-21 Hitachi Ltd Sintered laminated integrated circuit unit - mfd. from ceramic, and printed conducting assemblies on a ceramic substrate
CH626314A5 (en) * 1976-09-02 1981-11-13 Gail Tonwerke Wilhelm Ceramic veneer
US4670299A (en) * 1984-11-01 1987-06-02 Fujitsu Limited Preparation of lower alkyl polysilsesquioxane and formation of insulating layer of silylated polymer on electronic circuit board
NL8900388A (nl) * 1989-02-17 1990-09-17 Philips Nv Werkwijze voor het verbinden van twee voorwerpen.
JPH04296086A (ja) * 1991-01-18 1992-10-20 Du Pont Japan Ltd セラミック多層基板用グリーンシートと、その製造方　法、および該グリーンシートを用いたセラミック多層基板の製造方法
JP3593707B2 (ja) * 1993-03-19 2004-11-24 住友電気工業株式会社 窒化アルミニウムセラミックスとその製造方法

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WO1996020145A1 (de) 1996-07-04
DE4446533C1 (de) 1996-03-14
EP0750597B1 (de) 1999-08-18
DE59506643D1 (de) 1999-09-23
KR100399670B1 (ko) 2003-12-31
JPH09509644A (ja) 1997-09-30
EP0750597A1 (de) 1997-01-02
ES2136313T3 (es) 1999-11-16

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