KR860003626A - 저점도 에폭시수지 조성물 - Google Patents
저점도 에폭시수지 조성물 Download PDFInfo
- Publication number
- KR860003626A KR860003626A KR1019850007297A KR850007297A KR860003626A KR 860003626 A KR860003626 A KR 860003626A KR 1019850007297 A KR1019850007297 A KR 1019850007297A KR 850007297 A KR850007297 A KR 850007297A KR 860003626 A KR860003626 A KR 860003626A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- mentioned
- composition according
- diluent
- mixtures
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims 12
- 239000003822 epoxy resin Substances 0.000 title claims 3
- 229920000647 polyepoxide Polymers 0.000 title claims 3
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims 14
- 239000003085 diluting agent Substances 0.000 claims 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 4
- 230000003197 catalytic effect Effects 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims 2
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- 229920002554 vinyl polymer Polymers 0.000 claims 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 claims 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 claims 1
- HIACAHMKXQESOV-UHFFFAOYSA-N 1,2-bis(prop-1-en-2-yl)benzene Chemical compound CC(=C)C1=CC=CC=C1C(C)=C HIACAHMKXQESOV-UHFFFAOYSA-N 0.000 claims 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 claims 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 claims 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N acetoacetic acid Chemical compound CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2911—Mica flake
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2936—Wound or wrapped core or coating [i.e., spiral or helical]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
Claims (15)
- 분자당 적어도 두개의 에폭사이드 그룹을 갖는 1,2-에폭시수지 약 50 내지 약 95%; 스티렌, α-메틸스티렌, 또는 비닐톨루엔, 3급-부틸스티렌, 디비닐벤젠 및 디이소프로펜일벤젠 각각의 이성체 또는 이성체혼합물, 또는 이들의 혼합물중에서 선택된 반응성희석제 약 3내지 약 33%; 및 소-유효량의 페놀계 촉진제 및 불안정한 할로겐이 제거될 촉매적 경화제로 주로 구성됨을 특징으로 하는, 우수한 열안정성을 갖는 열경화성수지 조성물.
- 제1항에 있어서, 언급된 회석제가 오르토-, 메타-, 파라-3급-부틸스티렌 또는 상기 이성체의 혼합물인 수지 조성물.
- 제1항에 있어서, 언급된 회석제가 오르토-, 메타-, 파라-비닐 톨루엔 또는 상기 이성체의 혼합물인 수지 조성물.
- 제1항에 있어서, 언급된 회석제가 7.5내지 25%의 양으로 존재하는 수지 조성물.
- 제4항에 있어서, 언급된 회석제가 오르토-, 메타-, 파라-3급-부틸스티렌 또는 상기 이성체의 혼합물인 수지 조성물.
- 제4항에 있어서, 언급된 회석제가 오르토-, 메타-, 파라-비닐 톨루엔 또는 상기 이성체의 혼합물인 수지 조성물.
- 제4항에 있어서, 언급된 회석제가 스티렌인 수지 조성물.
- 제4항에 있어서, 언급된 회석제가 오르토-, 메타-, 파라-디이소프로펜일벤젠 또는 상기 이성체의 혼합물인 수지 조성물.
- 제1항에 있어서, 점도가 25oC에서 약 3000cps 이하인 수지 조성물.
- 제1항에 있어서, 언급된 페놀계 촉진제가 에폭시수지의 약 0.1 내지 15중량%이며, 언급된 촉매적 경화제가 0.025 내지 5.0중량%의 아세틸아세톤산 금속염, 0.05내지 10중량%의 유기티탄산염 또는 이의 혼합물로부터 선택되는 수지 조성물.
- 제1항에 있어서, 언급된 촉매적 경화제가 아세틸아세톤산 알루미늄, 아세틸아세톤산 지르코늄, 아세틸아세톤산 티탄 또는 이의 혼합물로부터 선택된 아세틸아세톤산 금속염인 수지 조성물.
- 제11항에 있어서, 언급된 촉매적 경화제가 테트라옥틸렌글리콜 티탄산염, 테트라부틸틱탄산염 또는 이의 혼합물로부터 선택된 유기 티탄산염인 수지 조성물.
- 제11항에 있어서, 언급된 페놀계 촉진제가, 카테콜, 레조르시눌, 페놀노보락수지 또는 이의 혼합물로부터 선택되는 수지 조성물.
- 신장된 도체, 및 이 도체상에 감긴, 제1항의 열경화성 수지 조성물로 함침된 테이프로 이루어진 제품.
- 제1항의 열결화성수지 조성물로 피복된 신장 전도체를 갖는 제품.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US658,102 | 1984-10-05 | ||
US06/658,102 US4603182A (en) | 1984-10-05 | 1984-10-05 | Low viscosity epoxy resin compositions |
US658102 | 1991-02-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR860003626A true KR860003626A (ko) | 1986-05-28 |
KR930002943B1 KR930002943B1 (ko) | 1993-04-15 |
Family
ID=24639906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019850007297A KR930002943B1 (ko) | 1984-10-05 | 1985-10-04 | 저점도 에폭시 수지 조성물 |
Country Status (12)
Country | Link |
---|---|
US (2) | US4603182A (ko) |
JP (1) | JPH0618855B2 (ko) |
KR (1) | KR930002943B1 (ko) |
CN (1) | CN1040211A (ko) |
CA (1) | CA1233295A (ko) |
CH (1) | CH667662A5 (ko) |
DE (1) | DE3534782A1 (ko) |
FR (1) | FR2571378B1 (ko) |
GB (1) | GB2165251B (ko) |
IT (1) | IT1188194B (ko) |
NL (1) | NL8502703A (ko) |
NO (1) | NO167042C (ko) |
Cited By (1)
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KR100501798B1 (ko) * | 2002-02-09 | 2005-07-20 | 서해조 | 전자부품 피복성형용 에폭시 수지 조성물 및 제조 방법 |
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US4931514A (en) * | 1986-10-06 | 1990-06-05 | Waters William D | Admixing metal salt promotor, initiator and (m)ethyl acetoacetate to cure vinyl esters |
US4906711A (en) * | 1988-07-29 | 1990-03-06 | General Electric Company | Low viscosity epoxy resin compositions |
JPH0651777B2 (ja) * | 1989-02-21 | 1994-07-06 | 株式会社日立製作所 | 熱硬化性樹脂組成物及びそれを用いたコイル、パネル |
JPH04296316A (ja) * | 1990-12-18 | 1992-10-20 | General Electric Co <Ge> | 耐熱性樹脂組成物、製品及び方法 |
US5350815A (en) * | 1991-04-10 | 1994-09-27 | General Electric Company | Copper bonding epoxy resin compositions, resin coated copper articles and method |
DE4438576A1 (de) * | 1994-10-28 | 1996-05-02 | Basf Ag | Verfahren zur Herstellung von Wickelkörpern |
US5618891A (en) * | 1995-03-29 | 1997-04-08 | General Electric Co. | Solventless resin composition having minimal reactivity at room temperature |
US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
CN1062288C (zh) * | 1996-12-18 | 2001-02-21 | 閎邦实业股份有限公司 | 用于绝缘涂装电容器的单液型环氧树脂浸剂 |
US6103382A (en) * | 1997-03-14 | 2000-08-15 | Siemens Westinghouse Power Corporation | Catalyzed mica tapes for electrical insulation |
US6482868B1 (en) * | 1998-12-31 | 2002-11-19 | 3M Innovative Properties Company | Accelerators useful for energy polymerizable compositions |
US6160155A (en) * | 1999-04-29 | 2000-12-12 | General Electric Company | Method and catalyst system for producing aromatic carbonates |
DE60306139T2 (de) * | 2002-04-25 | 2007-01-11 | Neville Chemical Europe B.V. | Verbessertes modifiziermittel für beschichtungen, klebstoffe oder dichtstoffe |
US20040063896A1 (en) * | 2002-09-30 | 2004-04-01 | Mark Markovitz | Resin compositions for press-cured mica tapes for high voltage insulation |
CN100503690C (zh) * | 2005-12-28 | 2009-06-24 | 同济大学 | 一种可用于氰酸酯固化反应的双组分催化剂及其制备方法 |
EP2379933B1 (en) * | 2008-12-22 | 2018-05-16 | ShawCor Ltd. | Wrappable styrenic pipe insulations |
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DE102011079489A1 (de) * | 2011-07-20 | 2013-01-24 | Siemens Aktiengesellschaft | Verfahren zum Herstellen eines Bandes für ein elektrisches Isolationssystem |
KR101807194B1 (ko) | 2011-07-29 | 2017-12-08 | 에이비비 리써치 리미티드 | 경화성 에폭시 수지 조성물 |
US9096759B2 (en) | 2011-12-21 | 2015-08-04 | E I Du Pont De Nemours And Company | Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin |
JP6131062B2 (ja) * | 2013-02-05 | 2017-05-17 | 株式会社日本触媒 | 硬化性樹脂組成物、その硬化物及び光学材料 |
CN105849822B (zh) * | 2013-10-31 | 2019-08-30 | Abb研究有限公司 | 复合高压绝缘材料及其制备方法 |
JP6403444B2 (ja) * | 2014-06-06 | 2018-10-10 | 三菱電機株式会社 | マイカテープ及び固定子コイル |
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EP3519479A1 (en) * | 2016-09-28 | 2019-08-07 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | Electrical insulation system based on epoxy resins for generators and motors |
US10848027B2 (en) * | 2016-11-17 | 2020-11-24 | General Electric Company | Electrical insulation systems and insulated components for electrical machine |
DE102016014267A1 (de) | 2016-11-30 | 2018-05-30 | Hexion GmbH | Zusammensetzung für ein Isolierband |
CN106589823A (zh) * | 2016-12-14 | 2017-04-26 | 东华大学 | 纤维复合材料用低成本单组份快速固化液体环氧树脂组合物 |
US10767075B2 (en) * | 2017-09-15 | 2020-09-08 | Nanoshield Technology Co., Ltd. | Coating composition comprising nano-sol, and preparation method thereof |
CN112151206B (zh) * | 2020-09-25 | 2022-07-01 | 国网河南省电力公司周口供电公司 | 一种碳纤维复合芯导线及其制备方法 |
CN115386351B (zh) * | 2022-07-29 | 2024-02-27 | 西安众海石油科技有限公司 | 一种缓凝高强树脂及其制备方法 |
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GB772694A (en) * | 1954-03-31 | 1957-04-17 | Bataafsche Petroleum | Process for preparing reaction products of glycidyl ethers |
BE631287A (ko) * | 1962-04-20 | 1900-01-01 | ||
NL295379A (ko) * | 1962-07-27 | |||
US3293322A (en) * | 1963-04-09 | 1966-12-20 | Koppers Co Inc | Homogeneous copolymer of epoxy resin and vinyl aryl monomer, cured with a bf3-amine complex |
ZA714954B (en) * | 1970-09-03 | 1972-04-26 | Gen Electric | Thermosetting epoxy resins |
GB1402899A (en) * | 1971-10-28 | 1975-08-13 | Gen Electric | Curable epoxy resin compositons |
US3812214A (en) * | 1971-10-28 | 1974-05-21 | Gen Electric | Hardenable composition consisting of an epoxy resin and a metal acetylacetonate |
US3776978A (en) * | 1972-01-07 | 1973-12-04 | M Markovitz | Epoxy resins containing phenolic accel-erators and organic titanates |
JPS499639A (ko) * | 1972-05-02 | 1974-01-28 | ||
US4113791A (en) * | 1977-03-03 | 1978-09-12 | Westinghouse Electric Corp. | Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators |
US4173593A (en) * | 1977-04-05 | 1979-11-06 | Westinghouse Electric Corp. | Metal acetylacetonate latent accelerators for an epoxy-styrene resin system |
CA1200349A (en) * | 1981-12-14 | 1986-02-04 | Thomas F. Brownscombe | Curable epoxy compositions, their preparation and formed articles therefrom |
JPS58118816A (ja) * | 1982-01-08 | 1983-07-15 | Toshiba Corp | 硬化性樹脂組成物 |
-
1984
- 1984-10-05 US US06/658,102 patent/US4603182A/en not_active Expired - Lifetime
-
1985
- 1985-02-01 CA CA000473385A patent/CA1233295A/en not_active Expired
- 1985-09-18 GB GB08523062A patent/GB2165251B/en not_active Expired
- 1985-09-30 DE DE19853534782 patent/DE3534782A1/de not_active Withdrawn
- 1985-10-01 FR FR858514506A patent/FR2571378B1/fr not_active Expired
- 1985-10-01 CH CH4226/85A patent/CH667662A5/de not_active IP Right Cessation
- 1985-10-03 JP JP60219296A patent/JPH0618855B2/ja not_active Expired - Fee Related
- 1985-10-03 NL NL8502703A patent/NL8502703A/nl active Search and Examination
- 1985-10-04 KR KR1019850007297A patent/KR930002943B1/ko not_active IP Right Cessation
- 1985-10-04 IT IT22363/85A patent/IT1188194B/it active
- 1985-10-04 NO NO853934A patent/NO167042C/no not_active IP Right Cessation
-
1986
- 1986-02-25 US US06/833,303 patent/US4656090A/en not_active Expired - Lifetime
-
1989
- 1989-07-26 CN CN89106130A patent/CN1040211A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100501798B1 (ko) * | 2002-02-09 | 2005-07-20 | 서해조 | 전자부품 피복성형용 에폭시 수지 조성물 및 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
FR2571378A1 (fr) | 1986-04-11 |
US4603182A (en) | 1986-07-29 |
IT1188194B (it) | 1988-01-07 |
FR2571378B1 (fr) | 1989-09-08 |
CN1040211A (zh) | 1990-03-07 |
IT8522363A0 (it) | 1985-10-04 |
CH667662A5 (de) | 1988-10-31 |
NO167042C (no) | 1991-09-25 |
JPS61106619A (ja) | 1986-05-24 |
GB2165251A (en) | 1986-04-09 |
NO167042B (no) | 1991-06-17 |
DE3534782A1 (de) | 1986-05-15 |
JPH0618855B2 (ja) | 1994-03-16 |
NL8502703A (nl) | 1986-05-01 |
NO853934L (no) | 1986-04-07 |
GB2165251B (en) | 1988-02-03 |
GB8523062D0 (en) | 1985-10-23 |
CA1233295A (en) | 1988-02-23 |
US4656090A (en) | 1987-04-07 |
KR930002943B1 (ko) | 1993-04-15 |
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