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KR20120076265A - 프로브 카드용 세라믹 기판 및 그 제조방법 - Google Patents

프로브 카드용 세라믹 기판 및 그 제조방법 Download PDF

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Publication number
KR20120076265A
KR20120076265A KR1020100138343A KR20100138343A KR20120076265A KR 20120076265 A KR20120076265 A KR 20120076265A KR 1020100138343 A KR1020100138343 A KR 1020100138343A KR 20100138343 A KR20100138343 A KR 20100138343A KR 20120076265 A KR20120076265 A KR 20120076265A
Authority
KR
South Korea
Prior art keywords
vias
common
substrate
group
probe card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020100138343A
Other languages
English (en)
Korean (ko)
Inventor
윤석출
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100138343A priority Critical patent/KR20120076265A/ko
Priority to JP2011050163A priority patent/JP5774332B2/ja
Publication of KR20120076265A publication Critical patent/KR20120076265A/ko
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020100138343A 2010-12-29 2010-12-29 프로브 카드용 세라믹 기판 및 그 제조방법 Withdrawn KR20120076265A (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020100138343A KR20120076265A (ko) 2010-12-29 2010-12-29 프로브 카드용 세라믹 기판 및 그 제조방법
JP2011050163A JP5774332B2 (ja) 2010-12-29 2011-03-08 プローブカード用セラミック基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100138343A KR20120076265A (ko) 2010-12-29 2010-12-29 프로브 카드용 세라믹 기판 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR20120076265A true KR20120076265A (ko) 2012-07-09

Family

ID=46677695

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100138343A Withdrawn KR20120076265A (ko) 2010-12-29 2010-12-29 프로브 카드용 세라믹 기판 및 그 제조방법

Country Status (2)

Country Link
JP (1) JP5774332B2 (ja)
KR (1) KR20120076265A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021133560A1 (en) * 2019-12-24 2021-07-01 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11162980B2 (en) 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
US11215641B2 (en) 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
US11340260B2 (en) 2019-12-24 2022-05-24 Teradyne, Inc. Probe card pad geometry in automated test equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006275714A (ja) * 2005-03-29 2006-10-12 Nec Corp プローブカード
JP4897961B2 (ja) * 2006-12-08 2012-03-14 日本特殊陶業株式会社 電子部品検査用配線基板およびその製造方法
KR20090027353A (ko) * 2007-09-12 2009-03-17 주식회사 아이엠 프로브카드용 기판 및 이의 제조방법
JP2009074823A (ja) * 2007-09-19 2009-04-09 Ngk Spark Plug Co Ltd 電子部品検査装置用配線基板およびその製造方法
JP5108433B2 (ja) * 2007-09-25 2012-12-26 日本特殊陶業株式会社 電子部品検査装置用配線基板
KR20120077165A (ko) * 2010-12-30 2012-07-10 삼성전기주식회사 프로브 카드용 세라믹 기판 및 그 제조방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021133560A1 (en) * 2019-12-24 2021-07-01 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11162980B2 (en) 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
US11215641B2 (en) 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
US11333683B2 (en) 2019-12-24 2022-05-17 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11340260B2 (en) 2019-12-24 2022-05-24 Teradyne, Inc. Probe card pad geometry in automated test equipment

Also Published As

Publication number Publication date
JP5774332B2 (ja) 2015-09-09
JP2012141275A (ja) 2012-07-26

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20101229

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid