KR102594447B1 - 액적 토출 장치, 액적 토출 방법, 및 컴퓨터 기억 매체 - Google Patents
액적 토출 장치, 액적 토출 방법, 및 컴퓨터 기억 매체 Download PDFInfo
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- KR102594447B1 KR102594447B1 KR1020180025709A KR20180025709A KR102594447B1 KR 102594447 B1 KR102594447 B1 KR 102594447B1 KR 1020180025709 A KR1020180025709 A KR 1020180025709A KR 20180025709 A KR20180025709 A KR 20180025709A KR 102594447 B1 KR102594447 B1 KR 102594447B1
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- 238000000034 method Methods 0.000 title claims description 18
- 238000003860 storage Methods 0.000 title claims description 5
- 238000012937 correction Methods 0.000 claims abstract description 182
- 239000007788 liquid Substances 0.000 claims abstract description 83
- 238000003384 imaging method Methods 0.000 claims abstract description 33
- 238000007599 discharging Methods 0.000 claims description 9
- 238000012840 feeding operation Methods 0.000 claims 4
- 238000012545 processing Methods 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000013500 data storage Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002438 flame photometric detection Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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- Crystallography & Structural Chemistry (AREA)
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Abstract
제어부(150)는, 기준 워크(Wf)의 상면에 형성된 기준 마크를 향해, 액적 토출 헤드(34)로부터 토출된 액적을 착탄시킨 후, 제2 촬상부(42)에서 기준 워크(W)의 촬상 화상을 취득하고, 촬상 화상에 기초하여, 기준 마크의 위치와 액적의 착탄 위치의 위치 어긋남량을 검출하며, 위치 어긋남량에 기초하여, 워크 테이블(20)과 액적 토출 헤드(34)의 상대 위치의 보정량을 산출한다.
Description
도 2는 본 실시형태에 따른 액적 토출 장치의 구성의 개략을 도시한 평면도이다.
도 3은 제어부의 구성의 개략을 모식적으로 도시한 설명도이다.
도 4는 기준 워크의 구성의 개략을 도시한 설명도이다.
도 5는 기준 마크, 타겟 및 액적의 위치 관계를 도시한 설명도이다.
도 6은 보정기에서 펄스 신호를 변환하는 모습을 도시한 설명도이다.
도 7은 기준 워크에 대한 묘화 동작을 행하는 모습을 도시한 평면에서 본 설명도이며, (a)는 제1 묘화 동작을 도시하고, (b)는 제2 묘화 동작을 도시하며, (c)는 제3 묘화 동작을 도시하고 있다.
도 8은 기준 워크에 대한 묘화 동작을 행하는 모습을 도시한 측면에서 본 설명도이며, (a)는 제1 묘화 동작을 도시하고, (b)는 제2 묘화 동작을 도시하며, (c)는 제3 묘화 동작을 도시하고 있다.
도 9는 워크에 대한 묘화 동작을 행하는 모습을 도시한 평면에서 본 설명도이며, (a)는 제1 묘화 동작을 도시하고, (b)는 제2 묘화 동작을 도시하며, (c)는 제3 묘화 동작을 도시하고 있다.
도 10은 기준 데이터를 보간하는 모습을 도시한 표의 일례이다.
도 11은 다른 실시형태에 따른 제어부의 구성의 개략을 모식적으로 도시한 설명도이다.
11: X축 스테이지 12: Y축 가이드 레일
13: Y축 선형 모터 14: X축 가이드 레일
15: X축 선형 모터 16: Y축 선형 스케일
20: 워크 테이블 21: 테이블 이동 기구
22: Y축 슬라이더 23: X축 선형 스케일
24: 로터리 인코더 30: 캐리지 유닛
33: 캐리지 34: 액적 토출 헤드
40: 촬상 유닛 41: 제1 촬상부
42: 제2 촬상부 100: 기준 마크
101: 타겟 150: 제어부
160: 보정량 산출기 161: 보정기
162: 제1 모션 컨트롤러 163: 제2 모션 컨트롤러
164: 잉크젯 컨트롤러 170: 인코더 역변환기
D: 액적 E1∼E3: 착탄 영역
L1∼L5: 주사 라인 W: 워크
Wf: 기준 워크
Claims (11)
- 워크에 기능액의 액적을 토출하여 묘화하는 액적 토출 장치로서,
상기 워크를 배치하는 워크 테이블과,
상기 워크 테이블에 배치된 상기 워크에 액적을 토출하는 액적 토출 헤드와,
상기 워크 테이블과 상기 액적 토출 헤드를, 주주사(主走査) 방향, 주주사 방향에 직교하는 부주사(副走査) 방향 및 회전 방향으로 상대적으로 이동시키는 이동 기구와,
주주사 방향에서의 상기 액적 토출 헤드의 하류측에 설치되고, 상기 워크의 촬상 화상을 취득하는 촬상부와,
상기 워크 테이블과 상기 액적 토출 헤드의 상대 위치의 보정량을 산출하고, 상기 보정량에 기초하여 상기 이동 기구를 제어하는 제어부를 가지며,
상기 워크는, 상기 보정량을 산출할 때에 이용되고, 상면에 복수의 기준 마크가 형성된 기준 워크를 포함하며,
상기 기준 워크의 상면에는, 복수의 상기 기준 마크를 포함하고, 상기 기준 마크를 향해 액적이 착탄(着彈)되는 착탄 영역이 형성되며,
상기 착탄 영역은, 상기 착탄 영역의 형성을 위한 액적의 착탄 도중에 상기 이동 기구에 의해 수행되는 개행(改行) 동작에 대하여 분할되지 않은 채로 부주사 방향으로 연신(延伸)하고, 주주사 방향으로 복수개 나란히 배치되어 있으며,
상기 제어부는, 상기 보정량의 산출 시,
주주사 방향으로 연신하고, 부주사 방향으로 나란히 설정되는 복수의 주사 라인마다,
상기 기준 마크를 향해 상기 액적 토출 헤드로부터 토출된 액적을 착탄시킨 후, 상기 촬상부에서 상기 기준 워크의 상기 착탄 영역을 포함한 촬상 화상을 취득하고,
상기 촬상 화상에 기초하여, 상기 기준 마크의 위치와 상기 액적의 착탄 위치의 위치 어긋남량을 검출하며,
상기 위치 어긋남량에 기초하여 상기 보정량을 산출하는 것
을 각각 행하고,
복수의 상기 주사 라인 간의 개행(改行) 동작은, 상기 이동 기구가 상기 워크 테이블을 부주사 방향으로 이동시킴으로써 행해지고,
상기 분할되지 않은 채로 부주사 방향으로 연신하는 착탄 영역을 형성하기 위한 상기 이동 기구의 상기 개행 동작은, 상기 이동 기구가 상기 워크 테이블을 상기 부주사 방향에 대한 정방향으로 이동시키는 것과, 상기 부주사 방향에 대한 부방향으로 이동시키는 것을 포함하는 것을 특징으로 하는 액적 토출 장치. - 제1항에 있어서, 상기 제어부는,
상기 워크 테이블의 회전 방향의 위치와 부주사 방향의 위치의 보정량을 산출하고,
그 후, 상기 액적 토출 헤드의 회전 방향의 위치와 부주사 방향의 위치의 보정량을 산출하며,
그 후, 상기 워크 테이블의 주주사 방향의 위치의 보정량을 산출하고,
그 후, 상기 액적 토출 헤드에서의 액적 토출 타이밍의 보정량을 산출하는 것을 특징으로 하는 액적 토출 장치. - 액적 토출 장치를 이용하여, 워크에 기능액의 액적을 토출하여 묘화하는 액적 토출 방법으로서,
상기 액적 토출 장치는,
상기 워크를 배치하는 워크 테이블과,
상기 워크 테이블에 배치된 상기 워크에 액적을 토출하는 액적 토출 헤드와,
상기 워크 테이블과 상기 액적 토출 헤드를, 주주사 방향, 주주사 방향에 직교하는 부주사 방향 및 회전 방향으로 상대적으로 이동시키는 이동 기구와,
주주사 방향에서의 상기 액적 토출 헤드의 하류측에 설치되고, 상기 워크의 촬상 화상을 취득하는 촬상부를 가지며,
상기 워크는, 상면에 복수의 기준 마크가 형성된 기준 워크를 포함하고,
상기 기준 워크의 상면에는, 복수의 상기 기준 마크를 포함하고, 상기 기준 마크를 향해 액적이 착탄되는 착탄 영역이 형성되며,
상기 착탄 영역은, 상기 착탄 영역의 형성을 위한 액적의 착탄 도중에 상기 이동 기구에 의해 수행되는 개행(改行) 동작에 대하여 분할되지 않은 채로 부주사 방향으로 연신하고, 주주사 방향으로 복수개 나란히 배치되어 있으며,
상기 액적 토출 방법은,
주주사 방향으로 연신하고, 부주사 방향으로 나란히 설정되는 복수의 주사 라인마다,
상기 기준 마크를 향해 상기 액적 토출 헤드로부터 토출된 액적을 착탄시키는 제1 공정과,
그 후, 상기 촬상부에서 상기 기준 워크의 상기 착탄 영역을 포함한 촬상 화상을 취득하는 제2 공정과,
그 후, 상기 촬상 화상에 기초하여, 상기 기준 마크의 위치와 상기 액적의 착탄 위치의 위치 어긋남량을 검출하는 제3 공정과,
그 후, 상기 위치 어긋남량에 기초하여, 상기 워크 테이블과 상기 액적 토출 헤드의 상대 위치의 보정량을 산출하고, 상기 보정량에 기초하여 상기 이동 기구를 제어하는 제4 공정
을 각각 행하고,
복수의 상기 주사 라인 간의 개행 동작은, 상기 이동 기구에 의해 상기 워크 테이블을 부주사 방향으로 이동시킴으로써 수행되고,
상기 분할되지 않은 채로 부주사 방향으로 연신하는 착탄 영역을 형성하기 위한 상기 이동 기구의 상기 개행 동작은, 상기 이동 기구가 상기 워크 테이블을 상기 부주사 방향에 대한 정방향으로 이동시키는 것과, 상기 부주사 방향에 대한 부방향으로 이동시키는 것을 포함하는 것을 특징으로 하는 액적 토출 방법. - 제3항에 있어서, 상기 제4 공정에서,
상기 워크 테이블의 회전 방향의 위치와 부주사 방향의 위치의 보정량을 산출하고,
그 후, 상기 액적 토출 헤드의 회전 방향의 위치와 부주사 방향의 위치의 보정량을 산출하며,
그 후, 상기 워크 테이블의 주주사 방향의 위치의 보정량을 산출하고,
그 후, 상기 액적 토출 헤드에서의 액적 토출 타이밍의 보정량을 산출하는 것을 특징으로 하는 액적 토출 방법. - 제3항 또는 제4항에 기재된 액적 토출 방법을 액적 토출 장치에 의해 실행시키도록, 상기 액적 토출 장치의 컴퓨터상에서 동작하는 프로그램을 저장한 컴퓨터 판독 가능한 기억 매체.
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Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6805028B2 (ja) * | 2017-03-07 | 2020-12-23 | 東京エレクトロン株式会社 | 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体 |
JP6876470B2 (ja) * | 2017-03-07 | 2021-05-26 | 東京エレクトロン株式会社 | ワーク加工装置、ワーク加工方法、プログラム及びコンピュータ記憶媒体 |
US10818840B2 (en) * | 2017-05-05 | 2020-10-27 | Universal Display Corporation | Segmented print bar for large-area OVJP deposition |
US10998531B2 (en) | 2017-12-12 | 2021-05-04 | Universal Display Corporation | Segmented OVJP print bar |
KR102134273B1 (ko) * | 2019-06-11 | 2020-07-15 | 세메스 주식회사 | 잉크젯 프린팅 시스템 |
KR102787864B1 (ko) * | 2019-08-07 | 2025-04-01 | 삼성디스플레이 주식회사 | 액적 토출 장치 및 액적 토출 방법 |
WO2021039024A1 (ja) * | 2019-08-29 | 2021-03-04 | 株式会社ウィルビイ | 立体物印刷システム及び立体物印刷方法 |
CN110571360B (zh) * | 2019-09-11 | 2022-01-25 | 昆山国显光电有限公司 | 喷墨打印系统和显示面板的制备方法 |
KR102363034B1 (ko) * | 2019-11-22 | 2022-02-15 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP7362505B2 (ja) | 2020-02-20 | 2023-10-17 | 東京エレクトロン株式会社 | 基板液処理装置及び液体吐出評価方法 |
KR102569247B1 (ko) * | 2020-07-07 | 2023-08-21 | 세메스 주식회사 | 잉크 탄착점 보정 장치 및 이를 구비하는 기판 처리 시스템 |
KR102661443B1 (ko) | 2020-09-10 | 2024-04-30 | 세메스 주식회사 | 기판 처리 장치, 잉크젯 장치 및 메인터넌스 방법 |
CN112774949A (zh) * | 2021-01-25 | 2021-05-11 | 悠柯(上海)智能科技有限公司 | 汽车柔性生产线智能涂胶检测视觉设备 |
CN112829466B (zh) * | 2021-02-02 | 2023-12-19 | 北京亚美科软件有限公司 | 一种喷墨打印机用连续图文拼接方法 |
KR102619966B1 (ko) * | 2021-05-18 | 2024-01-03 | 세메스 주식회사 | 기판 처리 제어 방법, 기판 처리 장치, 기판 처리 방법 및 컴퓨터 판독가능 매체에 저장된 컴퓨터 프로그램 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050248602A1 (en) | 2001-09-10 | 2005-11-10 | Christopher Newsome | Inkjet deposition apparatus and method |
US20060216409A1 (en) | 2005-03-28 | 2006-09-28 | Canon Kabushiki Kaisha | Film forming method and producing method for electron source substrate |
US20070070107A1 (en) | 2005-09-29 | 2007-03-29 | Bassam Shamoun | Methods and systems for inkjet drop positioning |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10315449A (ja) * | 1997-05-15 | 1998-12-02 | Seiko Epson Corp | 記録装置、記録方法、画像処理装置、画像処理方法、および記録媒体 |
HUP0104915A3 (en) * | 1998-10-14 | 2003-02-28 | Delsys Pharmaceutical Corp Mon | Electrostatic sensing chuck for attracting particles to a portion of a particle contact surface near a deposition electrode, method for depositing or transporting particles using an electrostatic sensing chuck, method for unbalanced... |
DE10202553A1 (de) * | 2002-01-24 | 2003-08-07 | Burkhard Buestgens | Verfahren zum Auftragen von Farben oder Lacken |
FR2840444B1 (fr) * | 2002-05-30 | 2005-04-01 | St Microelectronics Sa | Dispositif de memoire electriquement programmable de facon irreversible |
JP2004042521A (ja) * | 2002-07-15 | 2004-02-12 | Seiko Epson Corp | モノクロ領域とカラー領域とで副走査送りを切り換える印刷 |
KR100433432B1 (ko) * | 2002-09-19 | 2004-05-31 | 삼성전자주식회사 | 레이저프린터의 광주사장치 |
US20060054039A1 (en) * | 2002-12-03 | 2006-03-16 | Eliahu Kritchman | Process of and apparratus for three-dimensional printing |
JP4018598B2 (ja) * | 2003-06-16 | 2007-12-05 | キヤノン株式会社 | インクジェット記録装置およびインクジェット記録方法 |
JP3982502B2 (ja) * | 2004-01-15 | 2007-09-26 | セイコーエプソン株式会社 | 描画装置 |
KR100559750B1 (ko) * | 2005-07-08 | 2006-03-13 | 주식회사 탑 엔지니어링 | 페이스트 도포기 |
JP2008145625A (ja) * | 2006-12-08 | 2008-06-26 | Seiko Epson Corp | 描画システム、液状体の描画方法、カラーフィルタの製造方法、有機el素子の製造方法 |
JP4508247B2 (ja) | 2008-02-29 | 2010-07-21 | ブラザー工業株式会社 | 記録制御装置、記録制御方法、及び記録制御プログラム |
JP5359973B2 (ja) | 2010-04-02 | 2013-12-04 | セイコーエプソン株式会社 | 液滴吐出装置 |
JP5656480B2 (ja) * | 2010-06-30 | 2015-01-21 | キヤノン株式会社 | 記録装置及びその記録位置調整方法 |
CN102705763B (zh) * | 2012-06-27 | 2014-11-26 | 南京大学(苏州)高新技术研究院 | 一种侧光式led动态背光显示装置 |
JP2014091090A (ja) * | 2012-11-05 | 2014-05-19 | Seiko Epson Corp | 吐出検査方法、液体吐出装置 |
JP6576124B2 (ja) * | 2015-07-02 | 2019-09-18 | 東京エレクトロン株式会社 | 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体 |
JP6805028B2 (ja) * | 2017-03-07 | 2020-12-23 | 東京エレクトロン株式会社 | 液滴吐出装置、液滴吐出方法、プログラム及びコンピュータ記憶媒体 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050248602A1 (en) | 2001-09-10 | 2005-11-10 | Christopher Newsome | Inkjet deposition apparatus and method |
US20060216409A1 (en) | 2005-03-28 | 2006-09-28 | Canon Kabushiki Kaisha | Film forming method and producing method for electron source substrate |
US20070070107A1 (en) | 2005-09-29 | 2007-03-29 | Bassam Shamoun | Methods and systems for inkjet drop positioning |
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CN108568383B (zh) | 2021-12-24 |
US11633969B2 (en) | 2023-04-25 |
JP6846238B2 (ja) | 2021-03-24 |
TW201837503A (zh) | 2018-10-16 |
CN108568383A (zh) | 2018-09-25 |
TWI757440B (zh) | 2022-03-11 |
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US20180261472A1 (en) | 2018-09-13 |
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