KR102310075B1 - 척테이블과 연삭 장치 - Google Patents
척테이블과 연삭 장치 Download PDFInfo
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- KR102310075B1 KR102310075B1 KR1020180000614A KR20180000614A KR102310075B1 KR 102310075 B1 KR102310075 B1 KR 102310075B1 KR 1020180000614 A KR1020180000614 A KR 1020180000614A KR 20180000614 A KR20180000614 A KR 20180000614A KR 102310075 B1 KR102310075 B1 KR 102310075B1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 7
- 238000004140 cleaning Methods 0.000 description 9
- 238000005406 washing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
- B23Q3/08—Work-clamping means other than mechanically-actuated
- B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Jigs For Machine Tools (AREA)
Abstract
척테이블(10)은, 판형 워크(W)를 흡인 유지하는 유지면(11a)을 갖는 다공성판(11)과, 유지면(11a)을 노출시키고 다공성판(11)을 수용하는 오목부(120)를 구비하는 프레임(12)을 구비하고, 프레임(12)은, 오목부(120)의 바닥면(120a)에 형성되고 흡인원(17)과 연통 가능한 흡인 구멍(121)과, 프레임(12)의 상면(123a)에서 개구되어 형성되고 물공급원(19)과 연통 가능한 물공급 구멍(124)을 구비했기 때문에, 물공급 구멍(124)으로부터 물을 공급하여 판형 워크(W)의 외주부(Wc)를 수밀봉하면서 유지면(11a)에서 판형 워크(W)를 흡인 유지할 수 있기 때문에, 외주부(Wc)에 휘어짐이 있는 판형 워크(W)라 하더라도, 척테이블(10)의 유지면(11a)과 판형 워크(W)의 외주부(Wc) 사이에서 흡인력이 누설되는 것을 방지하여, 척테이블(11)로 판형 워크(W)를 확실하게 흡인 유지할 수 있다.
Description
도 2는 척테이블, 유지 수단 및 반입 수단의 구성을 나타내는 단면도이다.
도 3은 척테이블의 구성을 나타내는 분해 사시도이다.
도 4는 척테이블의 구성을 나타내는 사시도이다.
도 5는 반입 수단에 의해, 임시 테이블에 임시로 둔 판형 워크를 수취하는 상태를 나타내는 단면도이다.
도 6은 반입 수단에 의해, 척테이블에 판형 워크를 전달하는 상태를 나타내는 단면도이다.
도 7은 척테이블에 흡인 유지된 판형 워크의 외주부를 수밀봉하면서 판형 워크를 연삭하는 상태를 나타내는 단면도이다.
3a, 3b : 스테이지 4a, 4b : 카세트
5 : 반출 반입 수단 6 : 임시 테이블
7 : 세정 수단 8 : 턴테이블
9, 9a : 반입 수단 90 : 반송 패드
91 : 아암부 92 : 축부
93 : 모터 94 : 흡인원
10 : 척테이블 11 : 다공성판
11a : 유지면 12 : 프레임
120 : 오목부 120a : 바닥면
121 : 흡인 구멍 122 : 흡인 홈
123 : 볼록부 123a : 상면
124 : 물공급 구멍 13 : 유지 수단
130 : 베이스 14 : 회전 수단
15 : 로터리 조인트 16 : 흡인로
17 : 흡인원 17a : 흡인 밸브
18 : 수로 19 : 물공급원
19a : 급수 밸브 20A, 20B : 연삭 수단
21 : 스핀들 22 : 모터
23 : 스핀들 하우징 24 : 홀더
25 : 마운트 26a, 26b : 연삭 휠
27a, 27b : 연삭 지석 28, 29 : 칼럼
30A, 30B : 연삭 이송 수단 31 : 볼나사
32 : 모터 33 : 가이드 레일
34 : 승강판 40 : 두께 측정 수단
41 : 제1 게이지 41 : 제2 게이지
100 : 수층
Claims (2)
- 척테이블이 회전 가능하게 장착된 유지 수단과, 상기 척테이블이 흡인 유지한 판형 워크를 연삭하는 연삭 지석을 갖는 연삭 수단과, 판형 워크를 흡인 유지하는 반송 패드를 구비하고 상기 척테이블에 판형 워크를 반입하는 반입 수단을 구비하는 연삭 장치의 상기 척테이블에 있어서의 판형 워크의 유지 방법으로서,
상기 척 테이블은,
판형 워크를 흡인 유지하는 유지면을 갖는 다공성판과,
상기 유지면을 노출시키고 상기 다공성판을 수용하는 오목부를 갖는 프레임을 포함하고,
상기 프레임은, 상기 오목부의 바닥면에 형성되고 흡인원과 연통 가능한 흡인 구멍과,
상기 프레임의 상기 오목부에 수용된 상기 다공성판을 둘러싸는 환형의 상면에 있어서, 상기 유지면에 유지된 판형 워크의 외주보다 외측에서 개구되어 원형으로 배치되어 형성되며, 물공급원과 연통 가능한 물공급 구멍을 포함하고,
상기 반입 수단에 의한 판형 워크의 상기 척테이블로의 반입 시, 상기 반송 패드가 판형 워크로부터 이격되기 전에 상기 물공급 구멍으로부터 상기 프레임의 상면에 물을 공급하여 판형 워크의 외주부를 수밀봉(water seal)하고, 상기 유지면에 판형 워크를 흡인 유지한 후에 상기 반송 패드를 후퇴시키며,
상기 물공급 구멍으로부터 물을 계속해서 공급하여 상기 수밀봉한 상태에서, 판형 워크를 흡인 유지한 상기 척테이블을 회전시켜 상기 연삭 수단으로 판형 워크를 연삭하는 판형 워크의 유지 방법. - 삭제
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JPJP-P-2017-002553 | 2017-01-11 | ||
JP2017002553A JP6920063B2 (ja) | 2017-01-11 | 2017-01-11 | 板状ワークの保持方法 |
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KR102310075B1 true KR102310075B1 (ko) | 2021-10-06 |
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JP (1) | JP6920063B2 (ko) |
KR (1) | KR102310075B1 (ko) |
CN (1) | CN108296935B (ko) |
TW (1) | TWI758364B (ko) |
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JP7295653B2 (ja) * | 2019-02-20 | 2023-06-21 | 株式会社ディスコ | チャックテーブル |
JP7216613B2 (ja) * | 2019-05-16 | 2023-02-01 | 株式会社ディスコ | 加工装置 |
JP7358222B2 (ja) * | 2019-12-06 | 2023-10-10 | 株式会社ディスコ | 板状物保持具 |
CN111113205A (zh) * | 2019-12-25 | 2020-05-08 | 昆山昌利达精密机械有限公司 | 一种五金配件加工用打磨平台 |
TWI757810B (zh) * | 2020-07-31 | 2022-03-11 | 大陸商蘇州雨竹機電有限公司 | 氣相沉積晶圓承載裝置 |
US11652080B2 (en) | 2021-05-27 | 2023-05-16 | Intel Corporation | Thermal compression bonder nozzle with vacuum relief features |
CN113770913B (zh) * | 2021-10-28 | 2022-11-04 | 华海清科股份有限公司 | 一种吸盘转台和加工系统 |
CN115302644B (zh) * | 2022-10-11 | 2023-01-31 | 南京宏泰晶智能装备科技有限公司 | 一种用于单晶硅片的立式打孔装置 |
CN115383389B (zh) * | 2022-10-28 | 2023-03-17 | 镇江华舟电器有限公司 | 一种开关柜侧板焊接固定装置 |
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JPS6094842U (ja) * | 1983-12-05 | 1985-06-28 | 九州日本電気株式会社 | 半導体基板用研削装置 |
JPH10135316A (ja) * | 1996-10-28 | 1998-05-22 | Sony Corp | 薄板状基板の真空吸着方法及びその真空吸着テーブル装置 |
JP4417525B2 (ja) | 2000-04-28 | 2010-02-17 | 株式会社ディスコ | 研削装置 |
US6475067B1 (en) * | 2001-12-11 | 2002-11-05 | Budget Maintenance Concrete Services, Inc. | Dry method of concrete floor restoration |
JP4732736B2 (ja) * | 2004-11-08 | 2011-07-27 | 株式会社岡本工作機械製作所 | デバイスウエハの真空チャックシステムおよびそれを用いてデバイスウエハ裏面を研磨する方法 |
JP2006261415A (ja) | 2005-03-17 | 2006-09-28 | Denso Corp | 半導体装置の製造方法 |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
JP5944724B2 (ja) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | チャックテーブル |
JP5999972B2 (ja) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | 保持テーブル |
JP6132547B2 (ja) * | 2012-12-25 | 2017-05-24 | 株式会社ディスコ | 負圧生成装置 |
JP2015199153A (ja) | 2014-04-07 | 2015-11-12 | 株式会社ディスコ | 保持テーブル、該保持テーブルを用いた研削方法及び切削方法 |
JP6312554B2 (ja) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP2016047561A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | 研削装置 |
JP2016078147A (ja) * | 2014-10-14 | 2016-05-16 | 株式会社ディスコ | 研削装置 |
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- 2017-12-27 CN CN201711442466.7A patent/CN108296935B/zh active Active
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JP2018111159A (ja) | 2018-07-19 |
TW201829118A (zh) | 2018-08-16 |
CN108296935A (zh) | 2018-07-20 |
CN108296935B (zh) | 2021-12-07 |
JP6920063B2 (ja) | 2021-08-18 |
TWI758364B (zh) | 2022-03-21 |
KR20180082957A (ko) | 2018-07-19 |
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