JP6920063B2 - 板状ワークの保持方法 - Google Patents
板状ワークの保持方法 Download PDFInfo
- Publication number
- JP6920063B2 JP6920063B2 JP2017002553A JP2017002553A JP6920063B2 JP 6920063 B2 JP6920063 B2 JP 6920063B2 JP 2017002553 A JP2017002553 A JP 2017002553A JP 2017002553 A JP2017002553 A JP 2017002553A JP 6920063 B2 JP6920063 B2 JP 6920063B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- shaped work
- chuck table
- grinding
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 67
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Jigs For Machine Tools (AREA)
Description
4a,4b:カセット 5:搬出入手段 6:仮置きテーブル
7:洗浄手段 8::ターンテーブル
9,9a:搬入手段 90:搬送パッド 91:アーム部 92:軸部
93:モータ 94:吸引源
10:チャックテーブル 11:ポーラス板 11a:保持面
12:枠体 120:凹部 120a:底面 121:吸引孔 122:吸引溝
123:凸部 123a:上面 124:水供給孔
13:保持手段 130:ベース 14:回転手段 15:ロータリージョイント
16:吸引路 17:吸引源 17a:吸引バルブ 18:水路 19:水供給源
19a:給水バルブ 20A,20B:研削手段 21:スピンドル 22:モータ
23:スピンドルハウジング 24:ホルダ 25:マウント
26a,26b:研削ホイール 27a,27b:研削砥石 28,29:コラム
30A,30B:研削送り手段 31:ボールネジ 32:モータ
33:ガイドレール 34:昇降板
40:厚み測定手段 41:第1のゲージ 41:第2のゲージ
100:水層
Claims (1)
- チャックテーブルが回転可能に装着された保持手段と、該チャックテーブルが吸引保持した板状ワークを研削する研削砥石を有する研削手段と、板状ワークを吸引保持する搬送パッドを備え該チャックテーブルに板状ワークを搬入する搬入手段とを備える研削装置の該チャックテーブルにおける板状ワークの保持方法であって、
該チャックテーブルは、
板状ワークを吸引保持する保持面を有するポーラス板と、
該保持面を露出させ該ポーラス板を収容する凹部を備える枠体と、を備え、
該枠体は、該凹部の底面に形成され吸引源と連通可能な吸引孔と、
該枠体の該凹部に収容された該ポーラス板を囲繞する環状の上面において、該保持面に
保持された板状ワークの外周より外側において開口して円状に配置されて形成され水供給
源と連通可能な水供給孔とを備え、
該搬入手段による板状ワークの該チャックテーブルへの搬入時、該搬送パッドが板状ワ
ークから離間する前に該水供給孔から該枠体の上面に水を供給し板状ワークの外周部
を水シールし、該保持面に板状ワークを吸引保持した後に該搬送パッドを退避させ、
該水供給孔から水を供給し続け該水シールした状態で、板状ワークを吸引保持した該チ
ャックテーブルを回転させ該研削手段で板状ワークを研削する
板状ワークの保持方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017002553A JP6920063B2 (ja) | 2017-01-11 | 2017-01-11 | 板状ワークの保持方法 |
TW106142369A TWI758364B (zh) | 2017-01-11 | 2017-12-04 | 板狀工件的保持方法 |
CN201711442466.7A CN108296935B (zh) | 2017-01-11 | 2017-12-27 | 卡盘工作台和磨削装置 |
KR1020180000614A KR102310075B1 (ko) | 2017-01-11 | 2018-01-03 | 척테이블과 연삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017002553A JP6920063B2 (ja) | 2017-01-11 | 2017-01-11 | 板状ワークの保持方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018111159A JP2018111159A (ja) | 2018-07-19 |
JP6920063B2 true JP6920063B2 (ja) | 2021-08-18 |
Family
ID=62867513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017002553A Active JP6920063B2 (ja) | 2017-01-11 | 2017-01-11 | 板状ワークの保持方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6920063B2 (ja) |
KR (1) | KR102310075B1 (ja) |
CN (1) | CN108296935B (ja) |
TW (1) | TWI758364B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7216613B2 (ja) * | 2019-05-16 | 2023-02-01 | 株式会社ディスコ | 加工装置 |
JP7358222B2 (ja) * | 2019-12-06 | 2023-10-10 | 株式会社ディスコ | 板状物保持具 |
CN111113205A (zh) * | 2019-12-25 | 2020-05-08 | 昆山昌利达精密机械有限公司 | 一种五金配件加工用打磨平台 |
TWI757810B (zh) * | 2020-07-31 | 2022-03-11 | 大陸商蘇州雨竹機電有限公司 | 氣相沉積晶圓承載裝置 |
US11652080B2 (en) | 2021-05-27 | 2023-05-16 | Intel Corporation | Thermal compression bonder nozzle with vacuum relief features |
CN113770913B (zh) * | 2021-10-28 | 2022-11-04 | 华海清科股份有限公司 | 一种吸盘转台和加工系统 |
CN115302644B (zh) * | 2022-10-11 | 2023-01-31 | 南京宏泰晶智能装备科技有限公司 | 一种用于单晶硅片的立式打孔装置 |
CN115383389B (zh) * | 2022-10-28 | 2023-03-17 | 镇江华舟电器有限公司 | 一种开关柜侧板焊接固定装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6094842U (ja) * | 1983-12-05 | 1985-06-28 | 九州日本電気株式会社 | 半導体基板用研削装置 |
JPH10135316A (ja) * | 1996-10-28 | 1998-05-22 | Sony Corp | 薄板状基板の真空吸着方法及びその真空吸着テーブル装置 |
JP4417525B2 (ja) | 2000-04-28 | 2010-02-17 | 株式会社ディスコ | 研削装置 |
US6475067B1 (en) * | 2001-12-11 | 2002-11-05 | Budget Maintenance Concrete Services, Inc. | Dry method of concrete floor restoration |
JP4732736B2 (ja) * | 2004-11-08 | 2011-07-27 | 株式会社岡本工作機械製作所 | デバイスウエハの真空チャックシステムおよびそれを用いてデバイスウエハ裏面を研磨する方法 |
JP2006261415A (ja) | 2005-03-17 | 2006-09-28 | Denso Corp | 半導体装置の製造方法 |
JP5406676B2 (ja) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | ウエーハの加工装置 |
JP5944724B2 (ja) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | チャックテーブル |
JP5999972B2 (ja) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | 保持テーブル |
JP6132547B2 (ja) * | 2012-12-25 | 2017-05-24 | 株式会社ディスコ | 負圧生成装置 |
JP2015199153A (ja) | 2014-04-07 | 2015-11-12 | 株式会社ディスコ | 保持テーブル、該保持テーブルを用いた研削方法及び切削方法 |
JP6312554B2 (ja) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP2016047561A (ja) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | 研削装置 |
JP2016078147A (ja) * | 2014-10-14 | 2016-05-16 | 株式会社ディスコ | 研削装置 |
-
2017
- 2017-01-11 JP JP2017002553A patent/JP6920063B2/ja active Active
- 2017-12-04 TW TW106142369A patent/TWI758364B/zh active
- 2017-12-27 CN CN201711442466.7A patent/CN108296935B/zh active Active
-
2018
- 2018-01-03 KR KR1020180000614A patent/KR102310075B1/ko active Active
Also Published As
Publication number | Publication date |
---|---|
CN108296935B (zh) | 2021-12-07 |
JP2018111159A (ja) | 2018-07-19 |
KR20180082957A (ko) | 2018-07-19 |
TWI758364B (zh) | 2022-03-21 |
KR102310075B1 (ko) | 2021-10-06 |
TW201829118A (zh) | 2018-08-16 |
CN108296935A (zh) | 2018-07-20 |
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