KR102115637B1 - 광도파로용 감광성 에폭시 수지 조성물, 광도파로 형성용 경화성 필름, 및 감광성 에폭시 수지 조성물을 이용하여 제조한 광도파로 및 광ㆍ전기 전송용 혼재 플렉시블 프린트 배선판, 및 그 광도파로의 제법 - Google Patents
광도파로용 감광성 에폭시 수지 조성물, 광도파로 형성용 경화성 필름, 및 감광성 에폭시 수지 조성물을 이용하여 제조한 광도파로 및 광ㆍ전기 전송용 혼재 플렉시블 프린트 배선판, 및 그 광도파로의 제법 Download PDFInfo
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- KR102115637B1 KR102115637B1 KR1020157028528A KR20157028528A KR102115637B1 KR 102115637 B1 KR102115637 B1 KR 102115637B1 KR 1020157028528 A KR1020157028528 A KR 1020157028528A KR 20157028528 A KR20157028528 A KR 20157028528A KR 102115637 B1 KR102115637 B1 KR 102115637B1
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- epoxy resin
- optical waveguide
- resin composition
- component
- optical
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/045—Light guides
- G02B1/046—Light guides characterised by the core material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/045—Light guides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optical Integrated Circuits (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(A) 하기 (C) 및 (D) 성분의 플루오렌 골격 함유 에폭시 수지를 포함하지 않는 크레졸 노볼락형 다작용 에폭시 수지.
(B) 비스페놀 A형 고형 에폭시 수지.
(C) 플루오렌 골격 함유 고형 에폭시 수지.
(D) 플루오렌 골격 함유 액상 에폭시 수지.
(E) 양이온 경화 개시제.
Description
Claims (8)
- 하기 (A)∼(E) 성분을 함유하는 광도파로용 감광성 에폭시 수지 조성물로서, 그 에폭시 수지 전량에 대하여, (A) 성분이 20∼40 중량%, (B) 성분이 10∼30 중량%, (C) 성분이 25∼30 중량%, (D) 성분이 20∼25 중량%이고, (A)+(B) 성분과 (C)+(D) 성분이 각각 50 중량%인 것을 특징으로 하는 광도파로용 감광성 에폭시 수지 조성물.
(A) 하기 (C) 및 (D) 성분의 플루오렌 골격 함유 에폭시 수지를 포함하지 않는 크레졸 노볼락형 다작용 에폭시 수지.
(B) 비스페놀 A형 고형 에폭시 수지.
(C) 플루오렌 골격 함유 고형 에폭시 수지.
(D) 플루오렌 골격 함유 액상 에폭시 수지.
(E) 양이온 경화 개시제. - 제1항 또는 제2항에 기재된 광도파로용 감광성 에폭시 수지 조성물을 포함하는 것을 특징으로 하는 광도파로 형성용 경화성 필름.
- 광도파로의 코어층이 제1항 또는 제2항에 기재된 광도파로용 감광성 에폭시 수지 조성물로 이루어지는 것을 특징으로 하는 광도파로.
- 제6항에 기재된 광도파로를 구비하고 있는 광ㆍ전기 전송용 혼재 플렉시블 프린트 배선판.
- 제1항 또는 제2항에 기재된 광도파로용 감광성 에폭시 수지 조성물을 롤투롤(roll-to-roll) 기구를 포함하는 웨트 프로세스에 의해 도공하여 광도파로의 코어층을 형성하는 것을 특징으로 하는 광도파로의 제법.
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JP2013094224A JP6034742B2 (ja) | 2013-04-26 | 2013-04-26 | 光導波路用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルム、およびそれを用いた光導波路ならびに光・電気伝送用混載フレキシブルプリント配線板、およびその光導波路の製法 |
JPJP-P-2013-094224 | 2013-04-26 | ||
PCT/JP2014/056228 WO2014174924A1 (ja) | 2013-04-26 | 2014-03-11 | 光導波路用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルム、およびそれを用いた光導波路ならびに光・電気伝送用混載フレキシブルプリント配線板、およびその光導波路の製法 |
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KR102115637B1 true KR102115637B1 (ko) | 2020-05-26 |
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KR1020157028528A Expired - Fee Related KR102115637B1 (ko) | 2013-04-26 | 2014-03-11 | 광도파로용 감광성 에폭시 수지 조성물, 광도파로 형성용 경화성 필름, 및 감광성 에폭시 수지 조성물을 이용하여 제조한 광도파로 및 광ㆍ전기 전송용 혼재 플렉시블 프린트 배선판, 및 그 광도파로의 제법 |
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US (1) | US9903980B2 (ko) |
EP (1) | EP2977396A1 (ko) |
JP (1) | JP6034742B2 (ko) |
KR (1) | KR102115637B1 (ko) |
CN (1) | CN105102500B (ko) |
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JP6026347B2 (ja) * | 2013-04-23 | 2016-11-16 | 日東電工株式会社 | 感光性エポキシ樹脂組成物および光導波路コア層形成用硬化性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP6566417B2 (ja) * | 2015-06-18 | 2019-08-28 | 日東電工株式会社 | 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP6694180B2 (ja) | 2016-01-29 | 2020-05-13 | 日東電工株式会社 | 光導波路形成用感光性エポキシ樹脂組成物および光導波路形成用感光性フィルム、ならびにそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP6830808B2 (ja) * | 2016-12-21 | 2021-02-17 | 日東電工株式会社 | 光導波路形成用感光性エポキシ樹脂組成物、光導波路形成用硬化性フィルムおよびそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP6859136B2 (ja) * | 2017-03-03 | 2021-04-14 | 日東電工株式会社 | 光導波路コア形成用感光性エポキシ樹脂組成物、光導波路コア形成用感光性フィルム、光導波路、光電気混載基板および光導波路の製造方法 |
CN110537126A (zh) * | 2017-04-28 | 2019-12-03 | 日产化学株式会社 | 包含反应性倍半硅氧烷化合物的光波导形成用组合物 |
JP7224802B2 (ja) | 2018-07-31 | 2023-02-20 | 日東電工株式会社 | 光導波路形成用感光性エポキシ樹脂組成物、光導波路形成用感光性フィルムおよびそれを用いた光導波路、光・電気伝送用混載フレキシブルプリント配線板 |
JP7452030B2 (ja) * | 2020-01-27 | 2024-03-19 | 住友ベークライト株式会社 | 光硬化性樹脂組成物およびそれを用いた基材の加工方法 |
CN112778702B (zh) * | 2020-12-30 | 2023-03-07 | 广东盈骅新材料科技有限公司 | 环氧树脂复合材料和层压板及其制备方法和应用 |
CN120092035A (zh) | 2022-10-28 | 2025-06-03 | 日产化学株式会社 | 阳离子固化性组合物 |
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CN105102500A (zh) | 2015-11-25 |
US20160070029A1 (en) | 2016-03-10 |
WO2014174924A1 (ja) | 2014-10-30 |
TW201443142A (zh) | 2014-11-16 |
KR20160002758A (ko) | 2016-01-08 |
JP2014215531A (ja) | 2014-11-17 |
TWI619762B (zh) | 2018-04-01 |
JP6034742B2 (ja) | 2016-11-30 |
CN105102500B (zh) | 2017-03-22 |
EP2977396A1 (en) | 2016-01-27 |
US9903980B2 (en) | 2018-02-27 |
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