KR101946377B1 - heat shield floor packing structure for nonslip - Google Patents

Abstract

In order to prevent the excessive rise of internal temperature and to improve the slip resistance and durability, stain resistance, dropout phenomena, convenience of maintenance and economical efficiency of a product by providing a heat-insulating and bonding layer on an object surface requiring slip prevention, the present invention provides a heat-insulating floor pavement material for slip prevention, comprising: a heat-shielding and bonding layer formed by applying a fast-curing type heat-insulating coating material to an object surface requiring slip prevention and curing the same, wherein the fast-curing type heat-insulating coating material consists of 8-14 wt% of a methyl methacrylate resin as a slip prevention agent, 15-22 wt% of thermosetting resin as a strength adjusting agent, 8-14 wt% of an oligomer as an elongation modifier, 10-20 wt% of soft monomers as a diluent, 20-24 wt% of hollow glass beads as a heat-insulating agent, 15-20 wt% of sieving powder as a sliding resistance agent, and the remaining wt% of additives; and a slip prevention layer, in which a slip prevention pavement material containing methyl methacrylate resin is applied and cured to the top surface of the heat-insulating and bonding layer so as to be coupled thereto and which has convex and concave parts formed on the top surface thereof in a semi-cured state.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat-

The present invention relates to a heat-resistant flooring material for anti-slip, and more particularly, to an anti-slip heat-resistant flooring material, The present invention relates to a heat-resistant flooring material for slip prevention, which is improved in development, maintenance convenience, and economy.

Generally, in a road formed by an ascon, concrete, steel, etc., a slope of the road is required, a slope of the road is required, or a braking distance such as a steep curve or a ramp is required. Lt; / RTI >

In order to prevent this, non-slip flooring is applied to the road surface in order to increase the friction force of the road surface to increase the slip performance and to reduce the sudden stoppage of the vehicle, slip of the vehicle on the inclined road surface,

The anti-slip flooring is generally formed by mixing thermoplastic resin and aggregates such as silica, quartz, glass beads, bauxite, slag and the like, and then applying the mixture to a road surface using a lacquer or a hera and then using a roller brush Thereby forming a surface roughness.

However, when the temperature of the surrounding environment is high or the sunlight or the like is irradiated and the internal temperature of the road surface is excessively elevated as in the case of hot rolling, the adhesion force of the anti-slip flooring is lowered, .

Further, when the weight is applied to the cracked portion, the portion where the anti-slip flooring is dropped off gradually increases, and the maintenance cost for repairing the crack increases excessively.

Korean Patent No. 10-0386007

In order to solve the above problems, the present invention provides a heat-shrinkable laminated sheet having a heat-shielding bonding layer on an object surface that is required to be slip-resistant, thereby preventing an internal temperature from being excessively increased and preventing slip resistance, durability, And an object of the present invention is to provide a non-slip heat-resistant flooring material having improved convenience and economy.

In order to solve the above problems, the present invention provides a thermosetting resin composition comprising 8 to 14% by weight of a methyl methacrylate resin as a non-slip agent, 15 to 22% by weight of a thermosetting resin as an intensity adjuster, 8 10 to 20% by weight of a soft monomer as a diluent, 20 to 24% by weight of hollow glass beads as a heat-shrinking agent, 15 to 20% by weight of a sieving powder as a slip resistant agent, 4 to 7 3 to 5 wt% of a colorant as a secondary coloring agent, 2 to 3 wt% of a crosslinking agent as a density adjusting agent, 1 to 3 wt% of a silicone monomer as a coupling agent, 1 to 3 wt% % Of a surface additive, 1 to 3 wt% of benzoyl peroxide as a reaction initiator, 1 to 2 wt% of a viscosity adjuster as an anti-settling agent, and 1 to 2 wt% of a reaction promoter as a reaction rate adjuster Formed and cured Thermal bonding layer; And a non-slip layer formed on the upper surface of the heat-shielding bonding layer by being coated and cured by being bonded to the upper surface of the heat-shielding bonding layer and containing a methyl methacrylate resin in a semi-hardened state .

Here, it is preferable that the colorant is provided as a white color pigment so as to increase the heat efficiency.

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The diameter of the hollow glass bead is preferably set to 15 to 70 mu m.

On the other hand, the sieving powder may be a plate-like mica; And one selected from the group consisting of quartz, alumina, aluminum silicate, glass powder, solid bead, loess powder, calcium carbonate, talc, cray, barium sulfate, glass powder and mixtures thereof, It is preferable that the fast curing type tea beverage is included in an amount of 7.5 to 16% by weight based on the total weight of the carrier.

Through the above-mentioned solution, the anti-slip heat resistant flooring material according to the present invention provides the following effects.

First, since heat transferred through the anti-slip layer stacked on the upper surface of the heat-bonding layer formed on the object surface is separated by the plurality of hollow glass beads included in the heat-shielding bonding layer, the heat-shielding bonding layer and the anti- Separation, wear and cracks of the product are prevented beforehand, so that the durability of the product can be further improved.

Secondly, the plate-like mica shields the thermal infrared rays such as sunlight from being transmitted through the anti-slip layer toward the target surface side, thereby preventing the temperature from being increased by converting into heat energy from the inside of the target surface, It is possible to provide a synergistic effect which further improves the heat insulation and heat resistance performance with the bead.

Third, since the fast-curing type heat conductive filler contains a thermosetting resin, the support strength against the load applied from the anti-slip layer is reinforced and the MMA resin is included, so that the heat bonding layer and the anti- The impact resistance, abrasion resistance, skid resistance, and stain resistance can be further improved.

Fourth, since the non-slip wrapping material includes the MMA-based resin which is the same as the heat-radiating material, since the wear of the non-slip layer can be visually confirmed easily by including the different color paints, It is possible to prevent abrasion and breakage of the car body and to improve maintenance and economical efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a non-slip heat resistant flooring material according to an embodiment of the present invention. Fig.
2 is an enlarged view showing a portion A in Fig.
3 is a flowchart illustrating a method of manufacturing a heat-resistant flooring material for anti-slip according to an embodiment of the present invention.
4A and 4B are cross-sectional views illustrating a process in which a non-skid heat-resistant flooring material according to an embodiment of the present invention is applied to a target surface.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, a non-skid heat-resistant flooring according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view illustrating a non-skid heat-resistant flooring packaging material according to an embodiment of the present invention. FIG. 2 is an enlarged view of part A of FIG. 1, FIGS. 4A and 4B are cross-sectional views illustrating a process of applying a non-skid heat-resistant flooring material according to an embodiment of the present invention to a target surface. FIG.

1 to 4B, the anti-slip heat resistant flooring material 100 according to an embodiment of the present invention includes the heat shielding bonding layer 10 and the anti-slip layer 20.

Here, the non-skid-resistant heat-resistant flooring material 100 is formed on a target surface K that requires a slip-off effect when the vehicle is traveling, such as an acute curve portion of a road, an inclined surface,

At this time, the process of applying the anti-slip heat resistant flooring material 100 to the object surface K proceeds as follows.

First, a fast curing type heat conductive filler is applied and cured on a target surface K which is required to be slippery to form a heat adhesion bonding layer 10 (s10).

In detail, the quick-curing type heat conductive material includes a methyl methacrylate resin (hereinafter referred to as MMA resin) and a hollow glass bead 11. At this time, since the heat-shielding bonding layer 10 of the MMA-based resin is made of a homogeneous material with the anti-slip layer 20 while having its own sliding resistance or durability, it is integrated by chemical bonding between homogeneous materials, / RTI >

Further, the hollow glass bead 11 is included to heat the heat transferred to the object surface K, and detailed description of each component of the fast curing type thermal conductive member will be described later.

It is preferable that the fast curing type thermal conductive filler is uniformly applied to the target surface K and hardened so that the thickness h1 of the heat-shielding bonding layer 10 is set to 0.4 to 1 mm. If the coating thickness h1 of the heat-shielding bonding layer 10 is set to less than 0.4 mm, the heat shielding effect by the hollow glass beads 11 may be deteriorated. On the other hand, if the thickness h1 of the heat-shielding bonding layer 10 is set to more than 1 mm, the heat-shielding effect is improved but the construction cost may increase. Therefore, it is preferable that the thickness h1 of the heat-shielding bonding layer 10 is set to 0.4 to 1 mm.

When the heat shielding bonding layer 10 is formed (s10), a non-slip wrapping material is applied and cured on the upper surface of the heat shielding bonding layer 10 to form a non-slip layer 20 (s20).

In detail, when the heat shrinkable type heat conductive filler is cured to form the heat shielding bonding layer 10, a non-slip wrapping material containing an MMA resin is applied to the upper surface of the heat shielding bonding layer 10.

At this time, the non-slip wrapping material may include a base material, an aggregate, a colorant, a viscosity adjusting agent, a wax, and benzoyl peroxide including an MMA resin. Such a non-slip wrapping material is disclosed in Japanese Patent No. 10-1726192 of the present applicant. As a matter of course, the non-slip wrapping material may further include the hollow glass beads 11 to further improve the heat shielding performance.

Accordingly, since the MMA resin is included in the non-slip wrapping material as in the case of the fast-curing type coiler, it is possible to improve the adhesive force of the same synthetic resin due to the high fusing force. Thus, the surface heat dissipation is substantially prevented during bonding between the heat-shielding bonding layer 10 and the anti-slip layer 20, so that the durability of the product can be further improved. In addition, the fast curing type heat conductor sheet can be applied to other packaging materials including conventional MMA resins, so that the compatibility of products can be further improved.

It is preferable that the non-slip wrapping material is uniformly applied on the upper surface of the heat shielding bonding layer 10 so that the thickness h2 of the non-slip layer 20 is set to 2 to 5 mm. Here, if the thickness h2 of the non-skid layer 20 is less than 2 mm, the anti-slip performance may be deteriorated. On the other hand, if the thickness (h2) of the non-skid layer 20 is set to more than 5 mm, the drying time for curing is increased to deteriorate the installation property, and the manufacturing cost is increased due to excessive use of the non- Can be lowered. Therefore, the thickness h2 of the anti-slip layer 20 is preferably set to 2 to 5 mm, more preferably 2.5 to 4 mm.

After the non-slip wrapping material is applied, the uneven portion z is formed on the upper surface in the semi-cured state. At this time, the concavo-convex part (z) may be formed by applying the concave-convex part by the roller (1) for forming concavo-convex and pressing the upper surface of the semi-cured antislip wrapping material.

Specifically, the roller 1 for forming concavo-convex portions has a plurality of columnar pressing protrusions 1b arranged at predetermined intervals on the outer surface of the rotatable body portion 1a in a radial direction. Of course, it may be provided as a vertical or horizontal frame having a predetermined thickness, spaced apart at predetermined intervals along the circumferential direction of the body part 1a.

Then, the unevenness-forming roller 1 is rotationally moved along the upper surface of the non-slip wrapping material in the semi-cured state. The concavo-convex part (z) including the groove (x) and the convex part (y) corresponding to the shape of the end surface of the pressing projection (1b) may be formed on the upper surface part of the non-slip layer (20). Accordingly, since the non-slip wrapping material is pressed against the end face of the pressing projection 1b by the rotational force and the load of the unevenly-forming roller 1, the non-slip wrapping material is brought into close contact with the upper face of the heat-shielding bonding layer 10, 20 can be further improved.

When the anti-slip wrapping material is completely cured after the uneven portion z is formed, a non-slip layer 20 is formed to be coupled to the upper surface of the heat-shielding bonding layer 10, The construction is completed.

Here, the anti-slip layer 20 may be formed in a color different from that of the heat-shielding bonding layer 10. For example, the thermal barrier bonding layer 10 may include a white pigment and may be applied in a white color, and the anti-slip layer 20 may include a gray pigment of a different color. As described above, when the heat shielding bonding layer 10 and the anti-slip layer 20 are laminated so as to have mutually different hues, it is visually confirmed that the heat shielding bonding layer 10 is exposed according to the degree of wear of the anti-slip layer 20 So that the maintenance period can be confirmed.

That is, the non-slip wrapping material includes an MMA resin which is the same as the fast-curing type thermal conductive filler, but includes a paint of a different color, so that the wear state of the non-slip layer 20 can be visually confirmed easily, . Therefore, it is possible to prevent wear and breakage of the primary coated high-speed fast curing type cold rolled steel sheet, and maintenance and economical efficiency can be remarkably improved.

Further, when the concave / convex portion (z) is formed on the anti-slip layer 20 as described above, since the negative inspiration is visually displayed through the thickness difference with the heat-shielding bonding layer 10 applied on the lower side, the visibility and the aesthetics May be improved.

The quick-curing type heat-shrinkable film includes 8 to 14% by weight of the MMA resin as the antiskid agent, 15 to 22% by weight of the thermosetting resin as the strength adjusting agent, 8 to 14% by weight of the oligomer as the elongation modifier, 20% by weight of a soft monomer, 20 to 24% by weight of hollow glass beads 11 as a heat-shrinkable agent, 15 to 20% by weight of a sieving powder as a sliding resistance agent and the remaining weight% of additives.

In detail, the MMA resin is included as a base of an anti-slip agent, and includes a poly methyl methacrylate resin (PMMA resin), a methyl methacrylate resin (MMA resin), a styrene methyl methacrylate resin Acrylate resin (styrene methyl methacrylate resin, hereinafter referred to as SMM resin), and mixtures thereof.

Here, the MMA resin is more preferably the PMMA resin; And one selected from the group consisting of MMA resins, SMM resins, and mixtures thereof.

At this time, the PMMA resin preferably has a number average molecular weight of 130,000 and a glass transition temperature (Tg value) of 108 ° C. The MMA resin preferably has a number average molecular weight of 10,000 and a Tg value of 58 ° C. The SMM resin is a copolymer of MMA resin and styrene (SM), and preferably has a number average molecular weight of 204. The SMM resin has an optical property of MMA resin and is excellent in transparency and processability.

Here, the PMMA resin easily undergoes polymerization reaction in a low-temperature or normal-temperature environment without a separate curing means such as an irradiator or a heater, and cures (polymerizes) while being cured in the catalytic reaction. And, as long carbon molecule (-C-C-) ring is formed during the curing process, it is excellent in slip resistance, durability, abrasion resistance, scratch resistance, flexibility and adhesion.

Accordingly, when the fast curing type thermal conductive filler material containing the PMMA resin is applied to the object surface K, it can be applied with a uniform thickness, and workability can be improved. Further, mechanical properties such as hardness, weather resistance, discoloration resistance, scratch resistance and tensile strength of the heat shielding bonding layer 10 can be remarkably improved. Therefore, cracks, breakage and peeling due to the load or impact of the running vehicle are minimized, so that the safety is improved and the service life can be remarkably prolonged.

At this time, if the MMA resin is contained in an amount of less than 8% by weight based on the total weight of the fast-curing type thermal conductive filler, tensile force and optical characteristics may be lowered. On the other hand, when the MMA resin is contained in an amount exceeding 14 wt%, the tensile strength and the optical characteristics are improved, but the flowability of the MMA resin is excessively improved, so that it is difficult to apply the resin in a uniform thickness and the appearance may be poor. Therefore, it is preferable that the MMA resin is contained in an amount of 8 to 14% by weight based on the total weight of the fast-curing type thermal conductive filler.

On the other hand, the thermosetting resin preferably has an equivalent weight of 600 and a viscosity of 1,000 mPa · s or less. At this time, the thermosetting resin is preferably one selected from the group consisting of an epoxy resin, a urethane resin, an unsaturated polyester resin, and a mixture thereof as the strength adjusting agent.

Here, the epoxy resin is excellent in strength, hardness and workability, has no generation of volatile substances during shrinkage, has no shrinkage in volume, and has excellent adhesion with the object surface (K). In addition, the urethane resin is excellent in adhesion strength and mechanical strength of a coating film, and has excellent stability when used from a low temperature to a high temperature, and has resistance to chemicals. The unsaturated polyester resin improves the permeability of the composition and makes the structure dense to improve strength and water resistance. Therefore, the thermosetting resin may be included to reinforce the supporting strength against the load transmitted from the upper portion of the anti-slip layer 20, which is substantially laminated on the upper surface of the heat shielding bonding layer 10.

Accordingly, the fast curing type heat conductor sheet includes the MMA resin while firmly supporting the load applied on the upper side of the anti-slip layer 20 as the thermosetting resin is included, The impact resistance, wear resistance, and uniformity of quality of the product can be further improved since they are more firmly integrated with each other through the adhesive force due to the high fusion force between the same synthetic resins as the anti-slip layer 20.

Further, even if heat is applied to the thermosetting resin after the curing, since the external shape is maintained, the heat shielding bonding layer 10 is prevented from being deformed or cracked even if heat is transferred from the object surface K, .

When the thermosetting resin is contained in an amount of less than 15% by weight based on the total weight of the fast curing type heat conductive filler, the fast curing type heat conductive filler is coated on the object surface K and cured, The strength may be lowered. On the other hand, if the thermosetting resin is contained in an amount of more than 22% by weight, the strength of the heat-shrinkable bond layer 10 increases, but the miscibility and miscibility between the materials in the manufacture of the fast- It can be difficult. Therefore, it is preferable that the thermosetting resin is contained in an amount of 15 to 22% by weight based on the total weight of the fast-curing type thermal conductive filler.

On the other hand, it is preferable that the oligomer is one selected from the group consisting of an epoxy oligomer, a urethane oligomer and a mixture thereof as an elongation modifier. The oligomer preferably has a number average molecular weight of 8,000 to 10,000 and a viscosity of 30,000 to 50,000 mPa · s.

Here, if the oligomer is contained in an amount of less than 8% by weight based on the total weight of the fast curing type thermal conductive filler, the hardness of the heat-shrinkable bonding layer 10 may increase and the elongation and impact strength may be lowered. On the other hand, if the amount of the oligomer is more than 14% by weight, the elongation percentage is increased but the viscosity is excessively increased and the coating operation may be deteriorated due to the draw phenomenon. Accordingly, it is preferable that the oligomer is contained in an amount of 8 to 15% by weight based on the total weight of the fast-curing type thermal conductive filler.

Meanwhile, the soft monomer may contain glycidyl ester, MMA resin, methacrylic acid (MAA), N-butyl methacrylate resin (BAM resin), 2 2-hydroxyethyl methacrylic acid (hereinafter referred to as 2-HEMA), and mixtures thereof.

In this case, the soft monomer is more preferably the glycidyl ester; And one selected from the group consisting of the MMA resin, the MAA, the BAM resin, the 2-HEMA and a mixture thereof. The soft monomer preferably has a number average molecular weight of 100 or more.

For example, the glycidyl ester may be used as an E-10 product of cardura having a Tg value of -10 ° C. Since the soft monomer has excellent flexibility at room temperature due to the inclusion of the glycidyl ester, The adhesion strength, tensile strength and impact resistance of the heat shielding bonding layer 10 can be improved.

At this time, if the soft monomer is contained in an amount of less than 10% by weight based on the total weight of the fast curing type heat conductive filler, the viscosity of the fast curing type heat conductive filler becomes excessively high, have. On the other hand, if the soft monomer is contained in an amount of more than 20% by weight, the adhesion strength, tensile strength and impact resistance of the heat-shielding bonding layer 10 are improved and the viscosity and dilution state are improved. It may be difficult to maintain the film thickness. Accordingly, it is preferable that the soft monomer is contained in an amount of 10 to 20% by weight based on the total weight of the fast-curing type thermal conductive filler.

On the other hand, the hollow glass beads 11 are preferably provided as a coolant. Here, the hollow glass bead 11 is preferably formed with a hollow portion 11b in the form of a vacuum inside the spherical body portion 11a. As the plurality of hollow glass beads 11 are densely aggregated in the heat shielding bonding layer 10, the heat transferred from the upper portion of the anti-slip layer 20 to the non-slip heat resistant flooring material 100 Can be prevented from being transmitted to the target surface (K) by being adiabated and heated by the air filled in the hollow portion (11b). Accordingly, the temperature rise of the inside of the object surface K is minimized by the hollow glass beads 11, so that the heat-shielding bonding layer 10 and the anti-slip layer 20 are separated, The durability of the product can be further improved.

At this time, if the diameter of the hollow glass beads 11 is set to 15 탆 or less, the heat insulation and heat shielding performance to be described later is lowered. On the other hand, if the diameter of the hollow glass beads 11 is set to exceed 70 mu m, the heat insulation and heat shielding performance are improved, but dragging occurs during coating and the coating workability is lowered. Therefore, the diameter of the hollow glass beads 11 is preferably set to 15 to 70 mu m, more preferably 18 to 65 mu m.

If the hollow glass bead 11 is contained in an amount of less than 20% by weight based on the total weight of the fast curing type heat conductive filler, the heat insulation and heat shielding performance may be deteriorated. On the other hand, if the hollow glass beads 11 are contained in an amount exceeding 24 wt%, the heat insulating and heat shielding performance is improved, but the heat shielding bonding layer 10 is cracked and the manufacturing cost may increase. Therefore, it is preferable that the hollow glass beads 11 are included in an amount of 20 to 24% by weight based on the total weight of the fast curing type thermal conductive filler.

On the other hand, the sieving powder is a plate-like mica as a sliding resistance agent; And one selected from the group consisting of quartz, alumina, aluminum silicate, glass powder, solid bead, loess powder, calcium carbonate, talc, cray, barium sulfate, glass beads and mixtures thereof.

At this time, if the sieving powder is contained in an amount of less than 15% by weight based on the total weight of the fast curing type heat conductive filler, durability and wear resistance due to the hardness and strength of the heat conductive bonding layer 10 may be lowered. On the other hand, if the sieving powder is contained in an amount of more than 20% by weight, the viscosity increases and the workability of coating may be lowered and cracks may be generated. Therefore, it is preferable that the sieving powder is contained in an amount of 15 to 20% by weight based on the total weight of the fast-curing type thermal conductive filler.

The planktonic mica is a major silicate minerals in the granite. It is a silicate mineral with a hardness of 2.5 to 4 and a specific gravity of 2.75 to 3.2 and is selected from the group consisting of muscovite, soda mica, biotite, phlogopite, It can be provided as one. Such plate-like mica has a low thermal conductivity and is excellent in heat resistance, and it can suppress the conversion to thermal energy by reflecting heat infrared rays such as incident sunlight.

At this time, if the plate-like mica is less than 7.5% by weight based on the total weight of the fast curing type thermal conductive filler material, reflection efficiency for reflecting incident infrared rays in a direction opposite to the target surface K is reduced, Can be lowered. On the other hand, when the above-mentioned plate-like mica is contained in an amount exceeding 16% by weight, the heat insulation and heat shielding performance are improved, but the adhesion performance may be deteriorated. Therefore, it is preferable that the plate-like mica is contained in an amount of 7.5 to 16% by weight based on the total weight of the fast-curing type thermal conductive filler.

Accordingly, even if thermal infrared rays such as sunlight pass through the anti-slip layer 20 and are incident on the target surface K side, the planar mica is blocked and converted into thermal energy in the target surface K It is possible to provide a synergistic effect that further improves the heat insulation and heat shielding performance in addition to the hollow glass beads 11.

On the other hand, the additive may include 4 to 7% by weight of a carboxyl monomer as an adhesion promoter, 3 to 5% by weight of a coloring agent as an auxiliary retarder, 2 to 3% by weight of a colorant as a density adjuster 1 to 3 weight% of silicone monomer as a coupling agent, 1 to 3 weight% of a surface additive as a surface antifouling agent, 1 to 3 weight% of benzoyl peroxide as a reaction initiator, and 1 to 2 weight% And 1 to 2% by weight of a reaction promoter as a regulator and a reaction rate regulator.

In detail, the carboxyl monomer is preferably one selected from the group consisting of itaconic acid having a number average molecular weight of 130, fumaric acid having a number average molecular weight of 116, and a mixture thereof as an adhesion promoter.

If the content of the carboxyl monomer is less than 4% by weight based on the total weight of the fast curing type thermal conductive filler, the stain resistance and adhesion performance may be deteriorated. On the other hand, when the carboxyl monomer is contained in an amount of more than 7 wt%, adhesion performance is improved, but coating workability may be deteriorated due to excessive adhesion. Therefore, it is preferable that the carboxyl monomer is included in an amount of 4 to 7% by weight based on the total weight of the fast-curing type thermal conductive filler.

Meanwhile, it is preferable that the colorant is provided as a white color pigment so as to increase heat efficiency as a secondary coloring agent. For example, the colorant may be a titanium dioxide, which is an inorganic pigment, and may contain rutile or purity 92 wt.% Of titanium dioxide having a purity of at least 87 wt.%, Based on the total weight, according to KS M ISO 591-1 % ≪ / RTI > of anatase.

Accordingly, as the coloring agent is provided as a white color pigment, thermal infrared rays such as sunlight transmitted through the anti-slip layer 20 are reflected by the target surface K due to the thermal infrared reflection characteristic of the white color pigment It is prevented that the light is incident, so that a substantial heat-shielding effect can be provided.

At this time, if the colorant is included in an amount of less than 3% by weight based on the total weight of the fast curing type thermal conductive filler, the coloring power of the heat conductive bonding layer 10 may be lowered and the heat shielding performance may be deteriorated. On the other hand, if the colorant is contained in an amount exceeding 5% by weight, the tinting performance may be improved and the heat performance may be increased, but the manufacturing cost is increased and the economical efficiency is lowered. Therefore, it is preferable that the colorant is included in an amount of 3 to 5% by weight based on the total weight of the fast curing type thermal conductive filler.

It is preferable that the cross-linking agent is one selected from the group consisting of trimethylol propane triacrylate (TMPTA), trimethylol propane trimethacrylate (TMPTMA) and mixtures thereof as a density controlling agent Do. Here, the crosslinking agent may be a monomer having a purity of 98% or more, a number average molecular weight of 296 and a functional group trivalence.

If the cross-linking agent is contained in an amount of less than 2% by weight based on the total weight of the fast curing type thermal conductive filler, As the crosslinking density between the MMA resin, the oligomer and the soft monomer is lowered, the bending property and the tensile strength may be lowered. If the crosslinking agent is contained in an amount of more than 3% by weight, the bending property and the tensile strength are improved but the reactivity is accelerated, and the shrinkage bonding layer 10 may be twisted or lifted due to shrinkage. Therefore, it is preferable that the crosslinking agent is included in an amount of 2 to 3% by weight based on the total weight of the fast curing type thermal conductive filler.

Meanwhile, the silicone monomer may be a 3- (methacryloxypropyl) trimethoxy having a number average molecular weight of 248 as a coupling agent. At this time, the silicone monomer reacts with a colorant or the like, which is an inorganic pigment, to increase the adhesion between organic and inorganic materials and to prevent water repellency, lipophilicity, and blocking.

If the silicone monomer is contained in an amount of less than 1% by weight based on the total weight of the fast curing type thermal conductive filler, the reactivity with the colorant and the like may be lowered. On the other hand, when the silicone monomer is contained in an amount exceeding 3% by weight, the reactivity and wettability with the colorant and the like are improved and the adhesion strength to asphalt, concrete and wood is increased but the cost can be increased. Therefore, it is preferable that the silicone monomer is contained in an amount of 1 to 3% by weight based on the total weight of the fast-curing type thermal conductive filler.

It is preferable that the surface additive is a surface contaminant preventing agent, and the surface additive is one selected from the group consisting of polyethylene wax, paraffin wax, and mixtures thereof. At this time, the surface additive blocks oxygen in the atmosphere to stably polymerize by the reaction of the reaction, and it is possible to minimize the stickiness of the surface of the heat-shielding bonding layer 10 that has been cured and dried or the surface contamination of the outer surface of the coating film.

If the surface additive is included in an amount of less than 1% by weight based on the total weight of the fast curing type heat conductive filler, the surface fouling preventing performance is lowered. On the other hand, when the surface additive is contained in an amount of more than 3% by weight, water film phenomenon occurs due to an increase in oil content due to wax, and slip resistance is lowered. Therefore, it is preferable that the surface additive is included in an amount of 1 to 3% by weight based on the total weight of the fast curing type thermal conductive filler.

The benzoyl peroxide is preferably contained as a reaction initiator in an amount of 1 to 3% by weight based on the total weight of the fast curing type thermal conductive filler. At this time, the benzoyl peroxide may have a purity of 50% and may be included as an initiator of the curing mechanism by radical formation.

When the benzoyl peroxide is contained in an amount of less than 1% by weight based on the total weight of the fast curing type thermal conductive filler, the curing rate of the heat-shrinkable bonding layer 10 is delayed and the surface of the object K is partially uncured Part can occur. On the other hand, when the benzoyl peroxide is contained in an amount of more than 3% by weight, the pot life of the fast curing type thermal conductive filler is shortened and the workability is lowered due to rapid curing during the formation of the heat bonding layer 10 . Therefore, it is preferable that the benzoyl peroxide is contained in an amount of 1 to 3% by weight based on the total weight of the fast curing type thermal conductive filler.

On the other hand, the viscosity modifier may be silica containing silica as the sedimentation inhibitor, and it is preferable that the viscosity modifier is included in an amount of 1 to 2% by weight based on the total weight of the fast curing type thermal conductive filler. For example, the viscosity modifier may be used as K-200 fumed silica from OCI.

When the viscosity controlling agent is included in an amount of less than 1% by weight based on the total weight of the fast curing type heat conductive filler, the thixotropy and the sedimentation preventing property are lowered. Therefore, And it may be difficult to apply the coating to a uniform thickness. On the other hand, if the viscosity controlling agent is contained in an amount of more than 2% by weight, viscosity of the fast-curing type heat-shrinkable filler is excessively increased, wettability is lowered, and workability for coating and unevenness formation is lowered due to spreading or spreading. Accordingly, it is preferable that the viscosity controlling agent is included in an amount of 1 to 2% by weight based on the total weight of the fast curing type thermal conductive filler.

The reaction accelerator may be a reaction rate modifier such as dimethylaniline (DMA) having a number average molecular weight of 121, dimethylp-toluidine (DMPT) having a number average molecular weight of 135, and a mixture thereof. And the like. Here, the reaction promoter is included to control the reaction speed with respect to the time of hardening of the fast curing type heat conductive filler.

At this time, if the reaction accelerator is included in an amount of less than 1% by weight based on the total weight of the fast curing type thermal conductive filler, the reaction rate may become slow or uncured. On the other hand, if the reaction promoter is contained in an amount exceeding 2% by weight, the working time may be shortened due to the rapid reaction rate, and the workability may be deteriorated. Therefore, it is preferable that the reaction accelerator is present in an amount of 1 to 2% by weight based on the total weight of the fast curing type thermal conductive filler.

Component (% by weight) Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 MMA resin 10 8 8 11 8 10 8 Thermosetting resin 15 15 15 16 15 17 15 Oligomer 8 8 8 9 8 9 8 Soft monomer 18 16 11 18 10 16 10 Hollow glass bead 20 24 24 14 30 20 20 Constitutional powder Planar mica 7.5 7.5 16 7.5 7.5 5 22 The remaining component 7.5 7.5 4 8.5 7.5 6 2 Carboxyl monomer 4 4 4 5 4 4 4 coloring agent 3 3 3 3 3 3 3 Cross-linking agent 2 2 2 2 2 2 2 Silicon monomers One One One One One 2 One Surface additive One One One One One 2 One Benzoyl peroxide One One One One One 2 One Viscosity modifier One One One 2 One One 2 Reaction promoter One One One One One One One Sum 100 100 100 100 100 100 100

division
Wear evaluation (hr) Adhesion performance evaluation (hr) 100 200 500 1,000 100 200 500 1,000 Example 1 Great Great Great Great Great Great Great Great Example 2 Great Great Good Good Great Great Great Good Example 3 Great Great Great Good Great Great Good Good Comparative Example 1 Great Great Good Good Great Great Great Good Comparative Example 2 Great Great Good Lowering Great Great Good Good Comparative Example 3 Great Good Lowering Bad Great Great Great Great Comparative Example 4 Great Good Good Lowering Great Good Lowering Bad

Table 1 shows the composition ratio ratios of the fast curing type heat-shrinkable carrier according to each of the examples and comparative examples. Table 2 shows the composition ratio ratios of the quick-curing type heat-shrinkable carrier according to each example and the comparative example. This table shows the evaluation of wear and adhesion performance over time.

At this time, the fast-curing type hot-rolled steel sheet formed according to each of Examples and Comparative Examples in Table 1 was coated on a steel plate of 150 mm x 70 mm x 2 mm size, which had been pretreated to have an illuminance of about 25 mu m, To form a heat adhesion bonding layer 10, and then the non-slip packaging material was coated on the upper surface thereof. After curing at room temperature for 7 days and drying, adhesion and abrasion state of up to 1,000 hours of accelerated weathering performance were evaluated.

Here, the accelerated weathering performance was measured according to KS F 2274, and the properties were evaluated under the conditions of CS-17, 1 kg, and 1,000 times according to ASTM D4060 using a tester-type abrasion machine after time evaluation with accelerated weathering equipment. At this time, the abrasion condition was evaluated as excellent in the abrasion loss of 20 mg or less, in the range of 21 to 40 mg in the good range, in the range of 51 to 80 in the poor range and in the poor range of 81 mg or more. In addition, cracks and checkings were judged according to ASTM D660 and ASTM D661 standards, and the presence or absence of surface abnormalities such as discoloration and delamination were observed and evaluated.

These abrasion and adhesion performance evaluations were evaluated by the Examples 1 to 3 in which the hollow glass beads 11 or the sieving powders were contained within the above-mentioned range, and Comparative Examples 1 to 4, Or the decrease in the adhesive strength.

As shown in Tables 1 to 2, when the blending ratio of the hollow glass beads 11 exceeds 24 wt% as in Comparative Example 2, the hollow glass beads 11 in the fast-curing type heat- It can be confirmed that cracks are generated and the wear strength is lowered due to weakening of the bonding strength of the excessively dense portions.

Also, as in Comparative Example 3, when the sieving powder is less than 15% by weight, it can be confirmed that the abrasion resistance due to the decrease in hardness and strength is lowered.

As in Comparative Example 4, when the sieving powder is more than 20% by weight, it can be confirmed that cracks are generated due to an increase in viscosity, and it is confirmed that the adhesion strength is lowered as the sheet mica exceeds 16% by weight .

division Tester internal temperature (℃) 18 24 30 35 40 Initial state specimen
19.5 30.7 42.8 51.3 55.9 Psalm 1
(Application Example 1) 18.7 26.6 34.5 39.4 45.6 Psalm 2
(Application Example 2) 18.6 26.1 33.4 38.6 44.2 Psalm 3
(Application Example 3) 18.5 25.6 32.7 37.8 43.5 Comparative Piece 1
(Application of Comparative Example 1) 19.1 27.8 38.1 43.4 47.3 Comparative Piece 2
(Application of Comparative Example 2) 18.4 25.1 31.8 36.1 42.2 Comparative Piece 3
(Application of Comparative Example 3) 18.9 27.1 37.4 41.2 46.5 Comparative Specimen 4
(Application of Comparative Example 4) 18.5 25.4 32.3 37.5 43.1

Table 3 is a table showing the evaluation of the heat shield performance of the non-slip heat conductive flooring material to which each of the examples and comparative examples formed according to Table 1 above was applied.

At this time, a plurality of test specimens with a thermometer placed in a central portion were laid on a 50 cm square wooden plate at a height of 15 cm, and one of the plurality of specimens was placed in an initial state. And the non-slip heat-resistant flooring packaging material to which the comparative example was applied were formed to have the same thickness.

Then, a Nerston bulb, which is an infrared light bulb, was installed inside a sealed tester, and the inside temperature of the ascon was measured according to the change of the internal temperature of the tester after placing each specimen inside the tester.

This evaluation of the differential performance was performed to compare the differential performance according to the mixing ratio of the hollow glass ratio with the specimen 1 and the specimen 2 and to compare the differential performance according to the mixture ratio of the plate mica by comparing specimen 2 and specimen 3, Since it is the result of the temperature change in the tester, it may be different from the result of actual natural phenomenon.

In detail, as shown in Tables 1 to 3, it can be confirmed that the internal temperature of the initial state specimen is also increased as the internal temperature of the tester is increased. The specimen 1, specimen 2 and specimen 3 to which each embodiment is applied, It is confirmed that the internal temperature is lower.

Here, it is confirmed that the inner temperature of the specimen to which the second embodiment of the present invention is applied, in which the mixing ratio of the hollow glass beads 11 is relatively higher than that of the first embodiment, is lower and the heat shielding performance is improved. In addition, it was confirmed that the inner temperature of the specimen to which Example 3 was applied, in which the mixing ratio of the plate-like mica was relatively higher than that of Example 2, was further lowered, thereby further improving the heat shielding performance.

On the other hand, when the mixing ratio of the hollow glass beads 11 is less than 20% by weight as in Comparative Sample 1 to which Comparative Example 1 is applied, it is confirmed that the heat shielding performance is lowered. Also, as in Comparative Sample 3 to which Comparative Example 3 is applied, it can be confirmed that the heat shielding performance is lowered even when the mixing ratio of the plate-like mica is less than 7.5 wt%.

Therefore, it is preferable that the fast curing type tea wrapping composition is mixed at a weight ratio such that the hollow glass beads 11 and the sieving powder can be contained within the above-mentioned range as in Examples 1 to 3. Thus, the anti-slippery undergarment 100 is provided with the anti-slip layer 20 having the heat-shielding performance that minimizes the temperature rise of the object surface K due to the external environment, but is substantially optimized for the anti- As a result of being provided on the upper surface of the heat-shielding bonding layer 10, durability and slip resistance of the product can be further improved.

Here, the terms "comprises", "comprising", "having", or "having" as used in the above description mean that the constituent element can be included unless otherwise stated. It is to be understood that the invention is not limited to the components but may include other components. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

As described above, the present invention is not limited to the above-described embodiments, and variations and modifications may be made by those skilled in the art without departing from the scope of the present invention. And these modifications fall within the scope of the present invention.

10: heat shielding bonding layer 11: hollow glass bead
20: non-slip layer z: concave /
100: Anti-skid heat-resistant flooring

Claims (5)

A thermosetting resin of 15 to 22 wt% as an intensity modifier, an oligomer of 8 to 14 wt% as an elongation modifier, a thermosetting resin of 10 to 20 wt% as a diluent, 20 to 24% by weight of hollow glass beads as a heat shrinking agent, 15 to 20% by weight of sieving powder as a sliding resistance, 4 to 7% by weight of a carboxyl monomer as an adhesion promoting agent, 3 to 5% by weight of a colorant, 2 to 3% by weight of a crosslinking agent as a density adjuster, 1 to 3% by weight of a silicone monomer as a coupling agent, 1 to 3% by weight of a surface additive as a surface antifouling agent, A heat-shrinkable bonding layer formed by applying and curing a fast curing type heat conductive filler comprising 1 to 2 wt% of benzoyl peroxide, 1 to 2 wt% of a viscosity adjuster as an anti-settling agent, and 1 to 2 wt% of a reaction promoter as a reaction rate adjuster; And
And a non-slip layer formed on the upper surface of the heat-shielding bonding layer and bonded to the upper surface of the heat-shielding bonding layer, the anti-slip layer comprising a methyl methacrylate resin. delete The method according to claim 1,
Wherein the colorant is provided as a white color pigment so as to increase heat efficiency. The method according to claim 1,
Wherein the diameter of the hollow glass bead is set to 15 to 70 탆. The method according to claim 1,
The sieving powder is a plate-like mica; And one selected from the group consisting of quartz, alumina, aluminum silicate, glass powder, solid bead, loess powder, calcium carbonate, talc, cray, barium sulfate, glass powder and mixtures thereof,
Wherein the plate-like mica is contained in an amount of 7.5 to 16% by weight based on the total weight of the fast-curing type thermal conductive filler.

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