KR101506535B1 - 포지티브형 감광성 수지 조성물 - Google Patents
포지티브형 감광성 수지 조성물 Download PDFInfo
- Publication number
- KR101506535B1 KR101506535B1 KR1020070128690A KR20070128690A KR101506535B1 KR 101506535 B1 KR101506535 B1 KR 101506535B1 KR 1020070128690 A KR1020070128690 A KR 1020070128690A KR 20070128690 A KR20070128690 A KR 20070128690A KR 101506535 B1 KR101506535 B1 KR 101506535B1
- Authority
- KR
- South Korea
- Prior art keywords
- polymerizable monomer
- resin composition
- group
- photosensitive resin
- positive photosensitive
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 75
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 16
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 11
- 125000003709 fluoroalkyl group Chemical group 0.000 claims abstract description 7
- 239000000178 monomer Substances 0.000 claims description 91
- -1 methylglycidyl Chemical group 0.000 claims description 43
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- NKPPNPJUBLEKAD-UHFFFAOYSA-N 1-(4-hydroxyphenyl)prop-2-en-1-one Chemical compound OC1=CC=C(C(=O)C=C)C=C1 NKPPNPJUBLEKAD-UHFFFAOYSA-N 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 13
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 11
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000000379 polymerizing effect Effects 0.000 claims description 10
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 6
- PBHPFFDRTUWVIT-UHFFFAOYSA-N oxetan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCO1 PBHPFFDRTUWVIT-UHFFFAOYSA-N 0.000 claims description 6
- LIIDZMADWHKDJW-UHFFFAOYSA-N 2-(oxetan-2-yl)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCC1CCO1 LIIDZMADWHKDJW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000004438 haloalkoxy group Chemical group 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 claims description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 6
- 239000001257 hydrogen Substances 0.000 claims 6
- 229910052736 halogen Inorganic materials 0.000 claims 3
- 125000001153 fluoro group Chemical group F* 0.000 claims 2
- LWNUEMNFWONZEQ-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC[Si](OC([Si](O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)CCCOC(C(=C)C)=O)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C)(C)C Chemical compound C(C(=C)C)(=O)OCCCC[Si](OC([Si](O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)CCCOC(C(=C)C)=O)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C)(C)C LWNUEMNFWONZEQ-UHFFFAOYSA-N 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 abstract description 133
- 239000002904 solvent Substances 0.000 abstract description 34
- 239000003513 alkali Substances 0.000 abstract description 26
- 239000002253 acid Substances 0.000 abstract description 20
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 150000001875 compounds Chemical class 0.000 abstract description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000002585 base Substances 0.000 abstract description 2
- 125000000524 functional group Chemical group 0.000 abstract 1
- 239000010408 film Substances 0.000 description 113
- 230000015572 biosynthetic process Effects 0.000 description 42
- 238000003786 synthesis reaction Methods 0.000 description 41
- 239000000758 substrate Substances 0.000 description 32
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 21
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 19
- 239000000243 solution Substances 0.000 description 16
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 14
- 238000004458 analytical method Methods 0.000 description 14
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 12
- 238000011161 development Methods 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 11
- 238000007654 immersion Methods 0.000 description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- JESXATFQYMPTNL-UHFFFAOYSA-N mono-hydroxyphenyl-ethylene Natural products OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 4
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 4
- BESKSSIEODQWBP-UHFFFAOYSA-N 3-tris(trimethylsilyloxy)silylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C BESKSSIEODQWBP-UHFFFAOYSA-N 0.000 description 4
- 229920001214 Polysorbate 60 Polymers 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- OSJIQLQSJBXTOH-UHFFFAOYSA-N 8-tricyclo[5.2.1.02,6]decanylmethyl prop-2-enoate Chemical compound C12CCCC2C2CC(COC(=O)C=C)C1C2 OSJIQLQSJBXTOH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- BGGCPIFVRJFAKF-UHFFFAOYSA-N 1-[4-(1,3-benzoxazol-2-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 BGGCPIFVRJFAKF-UHFFFAOYSA-N 0.000 description 2
- QPYAUURPGVXHFK-UHFFFAOYSA-N 1-[4-(dimethylamino)-3,5-dinitrophenyl]pyrrole-2,5-dione Chemical compound C1=C([N+]([O-])=O)C(N(C)C)=C([N+]([O-])=O)C=C1N1C(=O)C=CC1=O QPYAUURPGVXHFK-UHFFFAOYSA-N 0.000 description 2
- NCFIKBMPEOEIED-UHFFFAOYSA-N 1-acridin-9-ylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 NCFIKBMPEOEIED-UHFFFAOYSA-N 0.000 description 2
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 2
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 2
- CPEXFJVZFNYXGU-UHFFFAOYSA-N 2,4,6-trihydroxybenzophenone Chemical compound OC1=CC(O)=CC(O)=C1C(=O)C1=CC=CC=C1 CPEXFJVZFNYXGU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 2
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- NWGKJDSIEKMTRX-AAZCQSIUSA-N Sorbitan monooleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O NWGKJDSIEKMTRX-AAZCQSIUSA-N 0.000 description 2
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 2
- HVUMOYIDDBPOLL-XWVZOOPGSA-N Sorbitan monostearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O HVUMOYIDDBPOLL-XWVZOOPGSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 229940105990 diglycerin Drugs 0.000 description 2
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 2
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 2
- 229940117360 ethyl pyruvate Drugs 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 229950004959 sorbitan oleate Drugs 0.000 description 2
- 229950003429 sorbitan palmitate Drugs 0.000 description 2
- 229950011392 sorbitan stearate Drugs 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
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Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
합성된 공중합체(A6)를 GPC분석(폴리에틸렌옥시드 표준)한 결과, 상기 공중합체(A6)의 중량평균 분자량은 5,100이었다.
Claims (24)
- 하기 구조식(I)로 표시되는 라디칼 중합성 모노머(a1) 및 하기 구조식(I)로 표시되는 라디칼 중합성 모노머(a1)와 상이한 라디칼 중합성 모노머(a2)를 중합하여 얻어지는 공중합체(A) 및 1,2-퀴논디아지드 화합물(B)을 포함하는 감광성 수지 조성물로서, 상기 라디칼 중합성 모노머(a2)는 하기 구조식(II)로 표시되는 적어도 1종의 페놀성 히드록시기를 갖는 라디칼 중합성 모노머를 포함하는 것을 특징으로 하는 포지티브형 감광성 수지 조성물.(상기 구조식(I)에서, R1은 수소 원자, 탄소 개수가 1 내지 5인 알킬기 또는 적어도 하나의 수소가 불소로 치환된 탄소 개수가 1 내지 5인 플루오로 알킬기이며, R2, R3 및 R4는 독립적으로 히드록시기, 탄소 개수가 1 내지 5인 알킬기, 탄소 개수가 1 내지 5인 알콕시기 또는 -O(Si(ClH2l+1)2O)mSi(CpH2p+1)3로 표시되는 작용기이고, l은 1 내지 5의 정수이고, m은 0 또는 1 내지 10의 정수이며, n은 1 내지 5의 정수이고, p는 1 내지 5의 정수이다)(상기 구조식(II)에서 R5, R6 및 R7은 독립적으로 수소, 탄소 개수가 1 내지 3인 알킬기 또는 적어도 하나의 수소가 불소로 치환된 탄소 개수가 1 내지 3인 알킬기이고, R8, R9, R10,R11 및 R12는 각각 독립적으로 수소, 할로겐, 히드록시기(-OH), 시아나이드기(-CN), 트리플루오로 메틸기(-CF3), 트리플루오로 메톡시기(-OCF3), 적어도 하나의 메틸렌기(-CH2-)가 -COO-, -OCO-, -CO-로 치환되거나 적어도 하나의 수소가 할로겐으로 치환된 탄소 개수가 1 내지 5인 알킬기, 또는 적어도 하나의 수소가 할로겐으로 치환된 탄소 개수가 1 내지 5인 할로 알콕시기이고, R8 내지 R12 중 적어도 하나가 히드록시기이다)
- 제1항에 있어서, 상기 라디칼 중합성 모노머(a2)가 적어도 1종의 에폭시기를 갖는 라디칼 중합성 모노머를 더 포함하는 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 제1항에 있어서, 상기 라디칼 중합성 모노머(a2)가 불포화 카르복실산을 포함하는 라디칼 중합성 모노머, 또는 불포화 카르복실산 무수물을 포함하는 라디칼 중합성 모노머로부터 선택된 적어도 1종의 모노머를 더 포함하는 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 삭제
- 제1항에 있어서, 상기 라디칼 중합성 모노머(a1)가 3-메타크릴로일옥시프로필트리메톡시실란([3-(Methacryloyloxy)propyl]trimethoxysilane) 및 메타크릴로일옥시프로필-트리스-트리메틸실록시실란((Methacryloyloxypropyl)tris(trimethylsiloxy)silane)으로 이루어진 그룹에서 선택된 적어도 하나의 모노머인 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 제2항에 있어서, 상기 에폭시기를 갖는 라디칼 중합성 모노머는 글리시딜(메타)아크릴레이트, 메틸글리시딜(메타)아크릴레이트, 3,4-에폭시시클로헥실메틸(메타)아크릴레이트, 3-메틸-3-(메타)아크릴로일옥시메틸옥세탄(3-methyl-3-(meth)acryloyloxymethyloxetane), 3-에틸-3-(메타)아크릴로일옥시메틸옥세탄, 3-메틸-3-(메타)아크릴로일옥시에틸옥세탄(3-ethyl-3-(meth)acryloyloxyethyloxetane) 및 3-에틸-3-(메타)아크릴로일옥시에틸옥세탄(3-ethyl-3-(meth)acryloyloxyethyloxetane)으로 이루어진 그룹으로부터 선택된 적어도 하나 이상의 모노머를 포함하는 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 제3항에 있어서, 상기 불포화 카르복실산을 포함하는 라디칼 중합성 모노머는 적어도 1종의 (메타)아크릴산이며, 상기 불포화 카르복실산 무수물을 포함하는 라디칼 중합성 모노머가 무수말레인산인 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 제1항에 있어서, 상기 구조식(II)로 표시되는 페놀성 히드록시기를 갖는 라디칼 중합성 모노머는 4-히드록시페닐비닐케톤인 것을 특징으로 하는 포지티브형 감광성 수지 조성물.
- 제1항 내지 제3항, 또는 제5항 내지 제8항 중 어느 한 항에 따른 포지티브형 감광성 수지 조성물로 형성시키는 패터닝된 투명막.
- 제9항에 따른 패터닝된 투명막을 사용하여 형성된 절연막.
- 제9항에 따른 패터닝된 투명막을 포함하는 표시소자.
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JP5176768B2 (ja) * | 2008-08-06 | 2013-04-03 | Jsr株式会社 | ポジ型感光性絶縁樹脂組成物 |
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JP5441542B2 (ja) * | 2009-07-22 | 2014-03-12 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機el表示装置、及び液晶表示装置 |
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JP5193321B2 (ja) * | 2011-01-28 | 2013-05-08 | 富士フイルム株式会社 | レーザー彫刻用樹脂組成物、レーザー彫刻用レリーフ印刷版原版、並びに、レリーフ印刷版及びその製版方法 |
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JPWO2012133617A1 (ja) * | 2011-03-30 | 2014-07-28 | 日本ゼオン株式会社 | 樹脂組成物および半導体素子基板 |
TW201310166A (zh) * | 2011-08-31 | 2013-03-01 | Everlight Chem Ind Corp | 層間絕緣膜暨保護膜用之樹脂及感光樹脂組成物 |
JP5935297B2 (ja) * | 2011-11-09 | 2016-06-15 | Jnc株式会社 | ポジ型感光性組成物 |
JP6065750B2 (ja) * | 2013-05-29 | 2017-01-25 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
TW201518862A (zh) * | 2013-09-13 | 2015-05-16 | Fujifilm Corp | 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置及有機el顯示裝置 |
JP2015072336A (ja) * | 2013-10-02 | 2015-04-16 | Jnc株式会社 | 感光性組成物及びそれを用いた表示素子 |
CN103848930A (zh) * | 2013-12-30 | 2014-06-11 | 苏州瑞红电子化学品有限公司 | 一种含n-苯基马来酰亚胺光敏丙烯酸树脂的合成及其在负性光致抗蚀剂中的应用 |
JP6297992B2 (ja) * | 2015-02-05 | 2018-03-20 | 信越化学工業株式会社 | ケイ素含有重合体、ケイ素含有化合物、レジスト下層膜形成用組成物、及びパターン形成方法 |
CN106338887A (zh) * | 2016-09-20 | 2017-01-18 | 深圳市容大感光科技股份有限公司 | 一种光致抗蚀剂组合物及其用途 |
WO2021162358A1 (ko) * | 2020-02-12 | 2021-08-19 | 한양대학교 산학협력단 | 디스플레이 유전체막용 저유전율 유전체 조성물, 디스플레이용 저유전율 유전체막의 제조방법 및 이를 이용한 디스플레이 소자. |
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KR101441501B1 (ko) | 2014-09-17 |
US8513350B2 (en) | 2013-08-20 |
TWI450039B (zh) | 2014-08-21 |
JP2008242438A (ja) | 2008-10-09 |
TW200836012A (en) | 2008-09-01 |
US20080207807A1 (en) | 2008-08-28 |
KR20080079986A (ko) | 2008-09-02 |
KR20140007779A (ko) | 2014-01-20 |
JP5245432B2 (ja) | 2013-07-24 |
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