KR100965508B1 - 점퍼회로기판 - Google Patents
점퍼회로기판 Download PDFInfo
- Publication number
- KR100965508B1 KR100965508B1 KR1020080060436A KR20080060436A KR100965508B1 KR 100965508 B1 KR100965508 B1 KR 100965508B1 KR 1020080060436 A KR1020080060436 A KR 1020080060436A KR 20080060436 A KR20080060436 A KR 20080060436A KR 100965508 B1 KR100965508 B1 KR 100965508B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- jumper
- substrate body
- circuit
- thin film
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000010409 thin film Substances 0.000 claims abstract description 45
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000004809 Teflon Substances 0.000 claims description 3
- 229920006362 Teflon® Polymers 0.000 claims description 3
- 238000009751 slip forming Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 24
- 125000006850 spacer group Chemical group 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/7064—Press fitting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (8)
- 두 회로기판 사이에 위치하여 상기 두 회로기판 사이에 소정의 간격을 형성하는 절연성 재질의 기판몸체와,상기 기판몸체의 양단으로부터 각각 돌출되어 상기 회로기판에 형성된 관통공을 통과하여 상기 회로기판에 형성된 회로패턴의 접점부와 접하는 연결돌기를 포함하여 구성되고,상기 두 연결돌기 사이를 연결하도록 상기 기판몸체 표면이나 내부의 적어도 일부와 상기 연결돌기의 표면이나 내부에는 도체박막이 연속적으로 형성되어 상기 두 연결돌기와 각각 접하는 상기 두 회로기판의 접점부 사이를 전기적으로 연결함을 특징으로 하는 점퍼회로기판.
- 제 1 항에 있어서, 상기 연결돌기는 상기 회로기판에 형성된 관통공의 위치에 대응되도록 상기 기판몸체의 선단에 소정의 간격을 가지고 다수개가 구비됨을 특징으로 하는 점퍼회로기판.
- 제 2 항에 있어서, 상기 연결돌기는 쌍을 이루어 상기 기판몸체의 양단으로부터 각각 돌출되어 형성되고, 상기 도체박막은 상기 쌍을 이루는 연결돌기 사이를 잇도록 직선경로를 따라 형성됨을 특징으로 하는 점퍼회로기판.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서, 상기 기판몸체의 표면에는 도체박막 사이를 전기적으로 연결하기 위한 회로패턴이 형성됨을 특징으로 하는 점퍼회로기판.
- 제 4 항에 있어서, 상기 회로패턴은 상기 기판몸체의 표면에 구리박이 압착되어 형성되거가 그 양단이 두 도체박막에 각각 연결되는 테프론래핑와이어로 형성됨을 특징으로 하는 점퍼회로기판.
- 제 4 항에 있어서, 상기 점퍼회로기판은 다수개의 기판몸체가 적층되어 형성되고, 상기 회로패턴은 서로 간섭되지 않도록 각 층의 기판몸체에 표면이나 내부에 구리박이 압착되어 형성됨을 특징으로 하는 점퍼회로기판.
- 제 6 항에 있어서, 상기 연결돌기의 횡단면의 직경은 상기 회로기판의 관통공의 내경보다 크게 형성되어 상기 연결돌기는 상기 회로기판의 관통공에 압입됨을 특징으로 하는 점퍼회로기판.
- 제 7 항에 있어서, 상기 도체박막은 구리재질을 상기 기판몸체 및 상기 연결돌기의 표면에 압착하여 형성됨을 특징으로 하는 점퍼회로기판.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080060436A KR100965508B1 (ko) | 2008-06-25 | 2008-06-25 | 점퍼회로기판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080060436A KR100965508B1 (ko) | 2008-06-25 | 2008-06-25 | 점퍼회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100000805A KR20100000805A (ko) | 2010-01-06 |
KR100965508B1 true KR100965508B1 (ko) | 2010-06-24 |
Family
ID=41811151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080060436A KR100965508B1 (ko) | 2008-06-25 | 2008-06-25 | 점퍼회로기판 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100965508B1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013070992A2 (en) * | 2011-11-09 | 2013-05-16 | Corning Cable Systems Llc | Cable assembly with cable attach structure having off-axis fiber routing |
KR101599146B1 (ko) * | 2014-08-14 | 2016-03-02 | 한국항공우주연구원 | 점퍼 부착시스템 |
KR101969993B1 (ko) * | 2017-02-07 | 2019-04-19 | 주식회사 경신 | 자동차용 인쇄회로기판의 점핑장치 |
KR101991107B1 (ko) * | 2019-03-19 | 2019-10-01 | 주식회사 경신 | 자동차용 인쇄회로기판의 점핑장치 |
KR101991106B1 (ko) * | 2019-03-19 | 2019-10-01 | 주식회사 경신 | 자동차용 인쇄회로기판의 점핑장치 |
KR101991105B1 (ko) * | 2019-03-19 | 2019-06-19 | 주식회사 경신 | 자동차용 인쇄회로기판의 점핑장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200227957Y1 (ko) | 2001-01-16 | 2001-06-15 | 홍순범 | 연결단자를 갖는 인쇄회로기판 적층 정션박스 |
JP2007188971A (ja) * | 2006-01-11 | 2007-07-26 | Taiyosha Electric Co Ltd | ジャンパーチップ部品 |
-
2008
- 2008-06-25 KR KR1020080060436A patent/KR100965508B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200227957Y1 (ko) | 2001-01-16 | 2001-06-15 | 홍순범 | 연결단자를 갖는 인쇄회로기판 적층 정션박스 |
JP2007188971A (ja) * | 2006-01-11 | 2007-07-26 | Taiyosha Electric Co Ltd | ジャンパーチップ部品 |
Also Published As
Publication number | Publication date |
---|---|
KR20100000805A (ko) | 2010-01-06 |
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