KR100658714B1 - 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. - Google Patents
감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. Download PDFInfo
- Publication number
- KR100658714B1 KR100658714B1 KR1020040099482A KR20040099482A KR100658714B1 KR 100658714 B1 KR100658714 B1 KR 100658714B1 KR 1020040099482 A KR1020040099482 A KR 1020040099482A KR 20040099482 A KR20040099482 A KR 20040099482A KR 100658714 B1 KR100658714 B1 KR 100658714B1
- Authority
- KR
- South Korea
- Prior art keywords
- photosensitive
- partition
- forming
- composition
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005192 partition Methods 0.000 title claims abstract description 95
- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 66
- 230000004888 barrier function Effects 0.000 claims abstract description 49
- 230000001681 protective effect Effects 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000003999 initiator Substances 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 14
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 13
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 10
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 6
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 6
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 claims description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 229940116411 terpineol Drugs 0.000 claims description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- MCNPOZMLKGDJGP-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical group C1=CC(OC)=CC=C1C=CC1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 MCNPOZMLKGDJGP-UHFFFAOYSA-N 0.000 claims description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 4
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 238000005488 sandblasting Methods 0.000 claims description 4
- 239000000600 sorbitol Substances 0.000 claims description 4
- -1 xanthone compound Chemical class 0.000 claims description 4
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims description 3
- OYKPJMYWPYIXGG-UHFFFAOYSA-N 2,2-dimethylbutane;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(C)(C)C OYKPJMYWPYIXGG-UHFFFAOYSA-N 0.000 claims description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 3
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone powder Natural products C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 2
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 claims description 2
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 claims description 2
- JHGGYGMFCRSWIZ-UHFFFAOYSA-N 2,2-dichloro-1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C(Cl)Cl)=CC=C1OC1=CC=CC=C1 JHGGYGMFCRSWIZ-UHFFFAOYSA-N 0.000 claims description 2
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 claims description 2
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 claims description 2
- HXHAMAWOXRQJTJ-UHFFFAOYSA-N 2-(2-methylpropyl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC(C)C)=CC=C3SC2=C1 HXHAMAWOXRQJTJ-UHFFFAOYSA-N 0.000 claims description 2
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 claims description 2
- AAXRSWGYLGOFQP-UHFFFAOYSA-N 2-butoxy-1-(2-butoxyphenyl)ethanone Chemical compound CCCCOCC(=O)C1=CC=CC=C1OCCCC AAXRSWGYLGOFQP-UHFFFAOYSA-N 0.000 claims description 2
- MRDMGGOYEBRLPD-UHFFFAOYSA-N 2-ethoxy-1-(2-ethoxyphenyl)ethanone Chemical compound CCOCC(=O)C1=CC=CC=C1OCC MRDMGGOYEBRLPD-UHFFFAOYSA-N 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 claims description 2
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 claims description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 claims description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 claims description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical group C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 2
- IDLJKTNBZKSHIY-UHFFFAOYSA-N [4-(diethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=CC=C1 IDLJKTNBZKSHIY-UHFFFAOYSA-N 0.000 claims description 2
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 claims description 2
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 claims description 2
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 claims description 2
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229920000193 polymethacrylate Polymers 0.000 claims description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 2
- GDOBGDUGIFUCJV-UHFFFAOYSA-N 2,2-dimethylbutane;2-methylprop-2-enoic acid Chemical compound CCC(C)(C)C.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O GDOBGDUGIFUCJV-UHFFFAOYSA-N 0.000 claims 1
- JSLWEMZSKIWXQB-UHFFFAOYSA-N 2-dodecylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CCCCCCCCCCCC)=CC=C3SC2=C1 JSLWEMZSKIWXQB-UHFFFAOYSA-N 0.000 claims 1
- 244000028419 Styrax benzoin Species 0.000 claims 1
- 235000000126 Styrax benzoin Nutrition 0.000 claims 1
- 235000008411 Sumatra benzointree Nutrition 0.000 claims 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- 229960002130 benzoin Drugs 0.000 claims 1
- 235000019382 gum benzoic Nutrition 0.000 claims 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 54
- 230000000052 comparative effect Effects 0.000 description 13
- 239000001856 Ethyl cellulose Substances 0.000 description 10
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 10
- 229920001249 ethyl cellulose Polymers 0.000 description 10
- 235000019325 ethyl cellulose Nutrition 0.000 description 10
- 229910010272 inorganic material Inorganic materials 0.000 description 8
- 239000011147 inorganic material Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000012776 electronic material Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000004182 2-chlorophenyl group Chemical group [H]C1=C([H])C(Cl)=C(*)C([H])=C1[H] 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000004573 morpholin-4-yl group Chemical group N1(CCOCC1)* 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
구분 (중량%) | 실시예 1 | 실시예 2 | 실시예 3 | 비교예 1 |
모유리 분말 | 70 | 70 | 70 | 70 |
EC | 1 | 1 | 1 | 2 |
Texanol | 22 | 21 | 19 | 28 |
TMP(EO)3TA | 5 | 5 | 7 | - |
광중합개시제 (Irgacure369) | 1 | 2 | 2 | - |
BCA | 1 | 1 | 1 | - |
실시예 1 | 실시예 2 | 실시예 3 | 비교예 1 | |
접착력(gf) | 187.5 | 212.5 | 225 | 100 |
실시예 1 | 실시예 2 | 실시예 3 | 비교예 1 | |
최소 선폭(㎛) | 30 | 30 | 30 | 80 |
에칭 시간(sec.) | 42 | 42 | 45 | 40 |
실시예 1 | 실시예 2 | 실시예 3 | 비교예 1 | |
박리시간(sec.) | 30 | 30 | 30 | 30 |
박리성 | ◎ | ◎ | ◎ | ◎ |
실시예 1 | 실시예 2 | 실시예 3 | 비교예 1 | |
안정성 | ◎ | ◎ | ◎ | ◎ |
Claims (25)
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 2개 이상의 에틸렌계 이중결합을 가지는 가교성 단량체; 광중합 개시제; 및 유기용매를 포함하는 감광성 조성물과, 격벽용 모유리 분말을 포함하고,상기 격벽용 모유리 분말 100 중량부에 대하여 감광성 조성물을 7 내지 10 중량부로 포함하는 격벽 형성용 감광성 페이스트 조성물.
- 제9항에 있어서, 상기 감광성 모유리 조성물은 바인더 및 유기용매를 더 포함하는 것인 격벽 형성용 감광성 페이스트 조성물.
- 삭제
- 삭제
- 제9항의 격벽 형성용 감광성 페이스트 조성물을 이용하여 어드레스 전극과 유전체층이 형성된 기판에 감광성 격벽층을 형성시키는 단계;상기 감광성 격벽층 위에 감광성 에칭 보호막을 코팅하고, 노광 및 현상하여 패터닝하는 단계;상기 에칭 보호막이 남아있지 않은 부분의 격벽층을 에칭하여 일정 형상의 격벽을 형성시키는 단계;상기 격벽의 상부에 남아있는 에칭 보호막을 제거하는 단계; 및상기 격벽을 소성하는 단계를 포함하는 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제13항에 있어서, 상기 감광성 격벽층의 형성 단계는 어드레스 전극과 유전체층이 형성된 기판에 비감광성 격벽층을 먼저 형성시키고, 상기 비감광성 격벽층 위에 감광성 격벽층을 형성시키는 것인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제14항에 있어서, 상기 비감광성 격벽층은 90 내지 140㎛의 두께를 가지는 것인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제14항에 있어서, 상기 감광성 격벽층은 10 내지 30㎛의 두께를 가지는 것인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제13항에 있어서, 상기 감광성 에칭 보호막은 감광성 유기물인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제13항에 있어서, 상기 에칭단계는 샌드블라스트법에 따라 실시하는 것인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제13항에 있어서, 상기 에칭단계로부터 제조되는 격벽은 30 내지 50㎛의 선폭을 가지는 것인 플라즈마 디스플레이 패널용 격벽의 제조방법.
- 제9항에 있어서, 상기 광중합 개시제는 상기 가교성 단량체 100 중량부에 대하여 10 내지 50 중량부로 포함되는 것인 격벽 형성용 감광성 페이스트 조성물.
- 제9항에 있어서, 상기 광중합 개시제는 상기 가교성 단량체 100 중량부에 대하여 25 내지 40 중량부로 포함되는 것인 격벽 형성용 감광성 페이스트 조성물.
- 제9항에 있어서, 상기 광중합 개시제는 트리아진계, 벤조인, 아세토페논계, 이미다졸계, 아미노 케톤계, 크산톤계 화합물 및 이들의 조합으로 이루어진 군으로부터 선택되는 1종의 화합물인 격벽 형성용 감광성 페이스트 조성물.
- 제22항에 있어서, 상기 광중합 개시제는 2,4-비스트리클로로메틸-6-p-메톡시스티릴-s-트리아진, 2-p-메톡시스티릴-4,6-비스트리클로로메틸-s-트리아진, 2,4-트리클로로메틸-6-트리아진, 2,4-트리클로로메틸-4-메틸나프틸-6-트리아진, 벤조페논, p-(디에틸아미노)벤조페논, 2,2-디클로로-4-페녹시아세토페논, 2,2'-디에톡시아세토페논, 2,2'-디부톡시아세토페논, 2-히드록시-2-메틸프로피오페논, p-t-부틸트리클로로아세토페논, 2-메틸티오크산톤, 2-이소부틸티오크산톤, 2-도데실티오크산톤, 2,4-디메틸티오크산톤, 2,4-디에틸티오크산톤, 2-벤질-2-(디메틸 아미노)-1-[-4-(4-모폴리닐)페닐]-1-부타논, 2-메틸-1-[4-(메틸티오)페닐]-2-(4-모폴리닐)-1-프로파논, 2,2'-비스-2-클로로페닐-4,5,4',5'-테트라페닐-2'-1,2'-비이미다졸 및 이들의 조합으로 이루어진 군으로부터 선택되는 1종인 격벽 형성용 감광성 페이스트 조성물.
- 제9항에 있어서, 상기 가교성 단량체는 1,4-부탄디올디아크릴레이트, 1,3-부틸렌글리콜디아크릴레이트, 에틸렌글리콜디아크릴레이트, 펜타에리스리톨테트라아크릴레이트, 트리에틸렌글리콜디아크릴레이트, 폴리에틸렌글리콜디아크릴레이트, 디펜타에리스리톨디아크릴레이트, 솔비톨트리아크릴레이트, 비스페놀 A 디아크릴레이트 유도체, 트리메틸프로판트리아크릴레이트, 에틸렌옥사이드 부가형 트리메틸프로판트리아크릴레이트, 디펜타에리스리톨폴리아크릴레이트, 1,4-부탄디올디메타크릴레이트, 1,3-부틸렌글리콜디메타크릴레이트, 에틸렌글리콜디메타크릴레이트, 펜타에리스리톨테트라메타크릴레이트, 트리에틸렌글리콜디메타크릴레이트, 폴리에틸렌글리콜디메타크릴레이트, 디펜타에리스리톨디메타크릴레이트, 솔비톨트리메타크릴레이트, 비스페놀 A 디메타크릴레이트 유도체, 트리메틸프로판트리메타크릴레이트, 디펜타에리스리톨폴리메타크릴레이트로 및 이들의 조합으로 이루어진 군으로부터 선택되는 1종인 격벽 형성용 감광성 페이스트 조성물.
- 제9항에 있어서, 상기 용매는 에틸렌글리콜모노메틸에테르아세테이트, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜메틸에테르아세테이트, 프로필렌글리콜모노에틸에테르아세테이트, 디에틸렌글리콜디메틸에테르, 디에틸렌글리콜메틸에틸에테르, 시클로헥사논, 3-메톡시프로피온산에틸, 3-에톡시프로피온산메틸, 3-에톡시프로피온산에틸, 메틸 에틸 케톤, 이소 프로필 알코올, 에탄올, 메탄올, 부틸 셀로솔브(BC:butyl cellosolve), 부틸 카르비톨 아세테이트(BCA:butyl carbitol acetate), 테르피네올(TP:terpineol), 텍사놀(texanol) 및 이들의 조합으로 이루어진 군으로부터 선택되는 1종인 격벽 형성용 감광성 페이스트 조성물.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040099482A KR100658714B1 (ko) | 2004-11-30 | 2004-11-30 | 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. |
JP2005341970A JP2006154824A (ja) | 2004-11-30 | 2005-11-28 | 感光性組成物、これを含む隔壁形成用感光性ペースト組成物、及びこれを利用したプラズマディスプレイパネル用隔壁の製造方法 |
US11/287,432 US7588877B2 (en) | 2004-11-30 | 2005-11-28 | Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel |
CNA2005101258651A CN1800978A (zh) | 2004-11-30 | 2005-11-30 | 感光组合物、含该组合物的感光浆组合物及隔板形成方法 |
TW094142172A TW200627063A (en) | 2004-11-30 | 2005-11-30 | Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasms display panel |
US12/461,918 US8098012B2 (en) | 2004-11-30 | 2009-08-27 | Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040099482A KR100658714B1 (ko) | 2004-11-30 | 2004-11-30 | 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060060418A KR20060060418A (ko) | 2006-06-05 |
KR100658714B1 true KR100658714B1 (ko) | 2006-12-15 |
Family
ID=36567774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040099482A Expired - Fee Related KR100658714B1 (ko) | 2004-11-30 | 2004-11-30 | 감광성 조성물, 이를 포함하는 격벽 형성용 감광성페이스트 조성물, 및 이를 이용한 플라즈마 디스플레이패널용 격벽의 제조방법. |
Country Status (5)
Country | Link |
---|---|
US (2) | US7588877B2 (ko) |
JP (1) | JP2006154824A (ko) |
KR (1) | KR100658714B1 (ko) |
CN (1) | CN1800978A (ko) |
TW (1) | TW200627063A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100927610B1 (ko) * | 2005-01-05 | 2009-11-23 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 및 이를 이용하여 제조된플라즈마 디스플레이 패널 |
KR101300006B1 (ko) * | 2006-09-28 | 2013-08-26 | 주식회사 동진쎄미켐 | 전자 소자용 화합물 및 이를 포함하는 전자 소자 |
US8129088B2 (en) * | 2009-07-02 | 2012-03-06 | E.I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
TWI477904B (zh) * | 2010-03-26 | 2015-03-21 | Sumitomo Chemical Co | Photosensitive resin composition |
CN103926793A (zh) * | 2014-03-26 | 2014-07-16 | 张洋 | 一种薄膜面板的配方 |
KR102242292B1 (ko) * | 2018-01-19 | 2021-04-21 | 우시 비전 피크 테크놀로지 컴퍼니 리미티드 | 고해상도 디스플레이 플라즈마 모듈과 그 제조방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980080296A (ko) * | 1997-03-17 | 1998-11-25 | 마쯔모또 에이찌 | 형광체가 분산되어 있는 감방사선성 조성물 |
KR20000015470A (ko) * | 1998-08-29 | 2000-03-15 | 박이순 | 플라즈마 디스플레이 패널용 광중합형 감광성 격벽 페이스트 조성물 및 이를 이용한 격벽 형성방법 |
KR20010018259A (ko) * | 1999-08-18 | 2001-03-05 | 박선우 | 플라즈마 디스플레이 패널용 감광성 격벽 페이스트 조성물 및이를 이용한 격벽 형성방법 |
KR20020011560A (ko) * | 2000-08-02 | 2002-02-09 | 박이순 | 광중합형 감광성 형광체 페이스트 조성물 및 이를 이용한형광막의 형성방법 |
KR20020084811A (ko) * | 2001-05-01 | 2002-11-11 | 도쿄 오카 고교 가부시키가이샤 | 플라즈마 디스플레이 패널의 제조방법 |
KR20040012298A (ko) * | 2002-08-02 | 2004-02-11 | 주식회사 유피디 | 퓸드 실리카 입자로 표면 처리된 격벽 분말을 포함하는감광성 격벽 페이스트 조성물 및 그의 제조방법, 그리고그를 사용한 플라즈마 디스플레이 패널의 격벽 형성방법 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4613560A (en) * | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
JPS6443804A (en) | 1987-08-10 | 1989-02-16 | Victor Company Of Japan | Production of magnetic head |
JP2917279B2 (ja) | 1988-11-30 | 1999-07-12 | 富士通株式会社 | ガス放電パネル |
JP3259253B2 (ja) * | 1990-11-28 | 2002-02-25 | 富士通株式会社 | フラット型表示装置の階調駆動方法及び階調駆動装置 |
US6097357A (en) * | 1990-11-28 | 2000-08-01 | Fujitsu Limited | Full color surface discharge type plasma display device |
EP1231590A3 (en) * | 1991-12-20 | 2003-08-06 | Fujitsu Limited | Circuit for driving display panel |
EP0554172B1 (en) * | 1992-01-28 | 1998-04-29 | Fujitsu Limited | Color surface discharge type plasma display device |
JP3025598B2 (ja) * | 1993-04-30 | 2000-03-27 | 富士通株式会社 | 表示駆動装置及び表示駆動方法 |
JP2891280B2 (ja) * | 1993-12-10 | 1999-05-17 | 富士通株式会社 | 平面表示装置の駆動装置及び駆動方法 |
JP3163563B2 (ja) * | 1995-08-25 | 2001-05-08 | 富士通株式会社 | 面放電型プラズマ・ディスプレイ・パネル及びその製造方法 |
JP2845183B2 (ja) | 1995-10-20 | 1999-01-13 | 富士通株式会社 | ガス放電パネル |
TW375759B (en) * | 1996-07-10 | 1999-12-01 | Toray Industries | Plasma display and preparation thereof |
JP3510761B2 (ja) * | 1997-03-26 | 2004-03-29 | 太陽インキ製造株式会社 | アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル |
JP3424587B2 (ja) * | 1998-06-18 | 2003-07-07 | 富士通株式会社 | プラズマディスプレイパネルの駆動方法 |
KR100272283B1 (ko) * | 1998-08-21 | 2000-11-15 | 구자홍 | 고휘도 플라즈마 디스플레이 패널용 격벽 조성물 |
WO2004088705A1 (ja) * | 1998-12-01 | 2004-10-14 | Yuichiro Iguchi | プラズマディスプレイ用基板、プラズマディスプレイおよびその製造方法 |
KR100297364B1 (ko) * | 1998-12-31 | 2001-08-07 | 구자홍 | 플라즈마표시장치의격벽재조성물 |
JP4030685B2 (ja) | 1999-07-30 | 2008-01-09 | 三星エスディアイ株式会社 | プラズマディスプレイおよびその製造方法 |
JP2001126625A (ja) * | 1999-10-25 | 2001-05-11 | Hitachi Ltd | プラズマディスプレイパネル |
CN1230857C (zh) * | 1999-12-21 | 2005-12-07 | 松下电器产业株式会社 | 等离子体显示面板及其制造方法 |
JP2001325888A (ja) | 2000-03-09 | 2001-11-22 | Samsung Yokohama Research Institute Co Ltd | プラズマディスプレイ及びその製造方法 |
TW522435B (en) * | 2000-05-23 | 2003-03-01 | Toray Industries | Slurry, display component and process for producing the display component |
US6870315B2 (en) * | 2000-07-21 | 2005-03-22 | Toray Industries, Inc. | Board for plasma display with barrier ribs, plasma display and production process therefor |
JP3389243B1 (ja) * | 2001-07-03 | 2003-03-24 | 松下電器産業株式会社 | プラズマディスプレイパネルおよびその製造方法 |
JP2003157773A (ja) * | 2001-09-07 | 2003-05-30 | Sony Corp | プラズマ表示装置 |
US6897564B2 (en) * | 2002-01-14 | 2005-05-24 | Plasmion Displays, Llc. | Plasma display panel having trench discharge cells with one or more electrodes formed therein and extended to outside of the trench |
KR100812875B1 (ko) | 2002-01-28 | 2008-03-11 | 마쯔시다덴기산교 가부시키가이샤 | 플라즈마 디스플레이 장치 |
JP4290918B2 (ja) | 2002-02-15 | 2009-07-08 | 太陽インキ製造株式会社 | 光硬化性組成物及びそれを用いて黒色パターンを形成したプラズマディスプレイパネル |
JP3931738B2 (ja) * | 2002-06-12 | 2007-06-20 | 松下電器産業株式会社 | プラズマディスプレイパネルの製造方法 |
US7102287B2 (en) * | 2002-11-18 | 2006-09-05 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and manufacturing method therefor |
KR100889774B1 (ko) * | 2007-03-06 | 2009-03-24 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 격벽 및 이를 포함하는 플라즈마디스플레이 패널 |
JP4885018B2 (ja) * | 2007-03-14 | 2012-02-29 | 京セラミタ株式会社 | 画像形成装置 |
KR100894062B1 (ko) * | 2007-03-26 | 2009-04-21 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 격벽 및 이를 포함하는 플라즈마디스플레이 패널 |
-
2004
- 2004-11-30 KR KR1020040099482A patent/KR100658714B1/ko not_active Expired - Fee Related
-
2005
- 2005-11-28 JP JP2005341970A patent/JP2006154824A/ja not_active Withdrawn
- 2005-11-28 US US11/287,432 patent/US7588877B2/en not_active Expired - Fee Related
- 2005-11-30 CN CNA2005101258651A patent/CN1800978A/zh active Pending
- 2005-11-30 TW TW094142172A patent/TW200627063A/zh unknown
-
2009
- 2009-08-27 US US12/461,918 patent/US8098012B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980080296A (ko) * | 1997-03-17 | 1998-11-25 | 마쯔모또 에이찌 | 형광체가 분산되어 있는 감방사선성 조성물 |
KR20000015470A (ko) * | 1998-08-29 | 2000-03-15 | 박이순 | 플라즈마 디스플레이 패널용 광중합형 감광성 격벽 페이스트 조성물 및 이를 이용한 격벽 형성방법 |
KR20010018259A (ko) * | 1999-08-18 | 2001-03-05 | 박선우 | 플라즈마 디스플레이 패널용 감광성 격벽 페이스트 조성물 및이를 이용한 격벽 형성방법 |
KR20020011560A (ko) * | 2000-08-02 | 2002-02-09 | 박이순 | 광중합형 감광성 형광체 페이스트 조성물 및 이를 이용한형광막의 형성방법 |
KR20020084811A (ko) * | 2001-05-01 | 2002-11-11 | 도쿄 오카 고교 가부시키가이샤 | 플라즈마 디스플레이 패널의 제조방법 |
KR20040012298A (ko) * | 2002-08-02 | 2004-02-11 | 주식회사 유피디 | 퓸드 실리카 입자로 표면 처리된 격벽 분말을 포함하는감광성 격벽 페이스트 조성물 및 그의 제조방법, 그리고그를 사용한 플라즈마 디스플레이 패널의 격벽 형성방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2006154824A (ja) | 2006-06-15 |
TW200627063A (en) | 2006-08-01 |
US7588877B2 (en) | 2009-09-15 |
US8098012B2 (en) | 2012-01-17 |
US20060115767A1 (en) | 2006-06-01 |
US20090317604A1 (en) | 2009-12-24 |
KR20060060418A (ko) | 2006-06-05 |
CN1800978A (zh) | 2006-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6019791B2 (ja) | 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法 | |
JP5494645B2 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP3113636B2 (ja) | 熱に補助された光感受性組成物およびそれについての方法 | |
CN105182688B (zh) | 感光性树脂组合物、感光性元件、抗蚀剂图形的制造方法以及印刷电路板的制造方法 | |
WO2012067107A1 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2018013799A (ja) | 感光性樹脂エレメント | |
JP5660200B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 | |
CN108241259B (zh) | 一种具有良好孔掩蔽功能可直接描绘曝光成像的抗蚀剂组合物 | |
JPWO2008075531A1 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
US8098012B2 (en) | Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel | |
JP2006106287A (ja) | 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法 | |
JP4752650B2 (ja) | 感光性樹脂組成物 | |
WO2013125429A1 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
WO2019173967A1 (en) | Photosensitizer, photosensitive resin composition, photosensitive element, and method of producing wiring board | |
WO2014119562A1 (ja) | 感光性樹脂組成物、感光性エレメント、サンドブラスト用マスク材、及び被処理体の表面加工方法 | |
JPWO2007113901A1 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JP2010054847A (ja) | 感光性樹脂組成物及び凹凸基板の製造方法 | |
JP4599974B2 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
KR101142631B1 (ko) | 샌드블라스트 레지스트용 감광성 수지 조성물 및 드라이필름 포토레지스트 | |
US6372292B1 (en) | Insulating paste composition for rib formation and method of rib pattern formulation | |
JP2010271395A (ja) | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターンの製造方法 | |
JP5126408B2 (ja) | 感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 | |
TW202440655A (zh) | 感光性樹脂組成物、感光性元件、抗蝕劑圖案之形成方法及配線基板之製造方法 | |
JPH10144213A (ja) | 感光性ガラスペースト組成物 | |
JPH11212272A (ja) | レリーフパターン、アデティブ用レリーフパターン、障壁形成用レリーフパターン、レリーフパターンの製造法及びその製造に用いられる感光性エレメント |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20041130 |
|
PA0201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20060522 Patent event code: PE09021S01D |
|
PG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20061121 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20061211 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20061212 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20091130 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20101129 Start annual number: 5 End annual number: 5 |
|
FPAY | Annual fee payment |
Payment date: 20111125 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20111125 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20121123 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20121123 Start annual number: 7 End annual number: 7 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |