KR100416967B1 - Planer lightwave circuit module with heat transfer device - Google Patents

Abstract

A planar optical waveguide device having a heat transfer device according to the present invention includes a planar optical waveguide device in which a core serving as an optical signal transmission medium and a cladding surrounding the core are stacked on an upper surface of a semiconductor substrate to form a waveguide, and the planar optical waveguide A heating plate bonded to the lower surface of the device and generating heat transmitted to the planar optical waveguide device by a power source applied from the outside with a bundle of evenly arranged strands of heat wires bent over the lower surface of the planar optical waveguide device. Equipped. The planar optical waveguide device module having the above-described configuration minimizes the decrease in thermal efficiency by directly contacting the heat generating wires with the planar optical waveguide device, and simplifies the process by removing the heat conduction plate, which is conventionally configured separately, and the module. Miniaturization of was achieved.

Description

Planar optical waveguide device module with heat transfer device {PLANER LIGHTWAVE CIRCUIT MODULE WITH HEAT TRANSFER DEVICE}

The present invention relates to a planar optical waveguide device module, and more particularly, to a planar optical waveguide device module having a heat transfer device capable of maintaining a constant temperature distribution of the planar optical waveguide device.

Typically, the temperature gradient of the planar optical waveguide device changes the refractive index in the waveguide, resulting in a change in the characteristic wavelength of the optical device and loss of optical power. Therefore, the uniform temperature distribution of the entire planar waveguide device is essential. For this purpose, the temperature of the planar optical waveguide device is maintained uniformly by supplying heat to the planar optical waveguide device. Accordingly, efficient heat transfer from the heat source to the planar optical waveguide device has been important.

A typical example of a planar optical waveguide device is a planar WDM device based on a phased array design (design based on optical interference between multiple waveguides with different optical paths). These devices are packaged into a temperature control system using Peltier devices. However, this type of temperature control system has many problems. It is expensive, consumes a relatively large amount of power and requires heat exchange with the surroundings. Moreover, a dedicated power source with AC input power of 110V or 220V is required.

An improved temperature control system of the planar optical waveguide device module is shown in FIG. 1. FIG. 1 is a diagram illustrating a configuration of a planar optical waveguide device module 10 having a heat transfer device accommodated in a planar optical waveguide device package. The planar optical waveguide device module 10 includes a planar optical waveguide device 11 and a heat conduction plate 12 attached to a lower portion of the planar optical waveguide device 11, and the planar optical waveguide device 11 and heat conduction. It is composed of a heat sensor (not shown) provided between the plate 12 and the heat generating plate 13 installed under the heat conducting plate 12.

The planar optical waveguide device 11 forms a core on which an optical waveguide is formed by depositing several layers of silica or polymer thin films on a silicon or quartz substrate, and a cladding surrounding the core. The optical device is designed to divide and sum the intensity of an optical signal according to the shape of the core by using a difference in refractive index between and a clad.

The heating plate 13 includes a heating wire 14 arranged in a line form of one strand bent therein. Both ends 17 of the heating wire 14 are connected to the wire 18 drawn from the outside through a method such as soldering.

The planar optical waveguide device module 10 configured as described above transfers heat generated from the heating wire 14 to the planar optical waveguide device 11 through the heat conduction plate 12 with a power source applied from the outside. The temperature of the planar optical waveguide device 11 is constantly controlled by reading and controlling the temperature of the thermal conduction plate 12 with a thermal sensor.

However, in the planar optical waveguide device module 10, which supplies heat to the planar optical waveguide device 11 through the above process, the heat generated from the heat generating plate 13 is transmitted through the heat conduction plate 12. In the process of being transferred to the waveguide element 11, heat transfer loss due to the heat conduction plate 12 is generated, thereby reducing thermal efficiency, and affecting the stability of the wavelength according to the refractive index and the temperature of the planar optical waveguide element 11. It becomes a factor which reduces the performance of a subject element. Furthermore, since heat is transferred through the heat conduction plate 12, there is a disadvantage in that the normal operation time of the planar optical waveguide device module 10, that is, the time taken from the start of the operation to the normal operation is long.

In order to solve the above problems, an object of the present invention is to provide a planar optical waveguide device module that can efficiently transfer heat generated from the heat source to the planar optical waveguide device.

In order to achieve the above object, the planar optical waveguide device module according to the present invention is characterized in that the heating plate is attached directly to the lower surface of the planar optical waveguide device, the heating wire is arranged on the upper surface of the heating plate.

1 is a view showing a planar optical waveguide device module having a heat transfer device according to a conventional embodiment.

2 is a view showing a planar optical waveguide device module having a heat transfer device according to an embodiment of the present invention.

3 is an enlarged view of a portion A of FIG. 2;

Figure 4 is a view showing a planar optical waveguide device module having a heat transfer device according to another embodiment of the present invention.

Description of the main parts of the drawing

22: heating plate 24: heating wire

25 through hole 26 conductor

27: pad

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, when it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

2 and 3, the planar optical waveguide device module 20 having the heat transfer device according to the embodiment of the present invention is a planar optical waveguide device 21, and the heat transfer device is the planar optical waveguide device The heating plate 22 is attached to the lower surface.

The planar optical waveguide device 21 forms a core on which an optical waveguide is formed by depositing several layers of silica or polymer thin films on a silicon or quartz substrate, and a cladding surrounding the core. And a planar optical waveguide device designed to divide and sum the intensity of an optical signal according to the shape of the core using a difference in refractive index between and a clad.

The heating plate 22 may be a hot wire 24, a pad 27 for connecting the hot wire 24 and an electric wire 28 drawn from the outside, and the hot wire 24 may be connected to the pad 27. The through hole 25 is provided.

The heating wire 24 provided on the heating plate 22 is bent and attached to the upper surface 22a of the heating plate 22 in the form of a single line. The heating wire 24 is a thin thin film attached by a method such as silk printing in order to reduce the size of the planar optical waveguide device module 20 and should be evenly arranged on the entire upper surface 22a of the heating plate 22.

Both ends of the heating wire 24 are attached to the pad 27 attached to the lower surface 22b through a pair of through holes 25 passing through the upper surface 22a and the lower surface 22b of the heating plate 22. Connected. The through hole 25 extends in the vertical direction. In this case, the heating wire 24 is further extended to pass through the through hole 25 to be connected to the pad 27, or a separate conductor 26 inserted into the through hole 25 as shown in FIG. 3. It may be connected to the pad 27 by using. The pad 27 provides a method of connecting the heating wire 24 and the wire 28 drawn from the outside through a soldering method.

The heating plate 22 configured as described above has an upper surface 22a attached to the lower surface of the planar optical waveguide element 21. When the heating plate 22 is attached to the planar optical waveguide device 21, it is attached by using a medium such as thermal grease, and then rubbed to increase the adhesion of the contact surface during the curing of the medium. Press with the right force.

4 is a view showing a planar optical waveguide device module 30 having a heat transfer device according to another embodiment of the present invention. The planar optical waveguide device module 30 is a planar optical waveguide device 31, and the heat transfer device is a planar optical waveguide device 31 as a heating plate 32 having a heat generating part 32a and an extension part 32b. It is attached to the lower surface of the.

The heat generating plate 32 is extended from the heat generating part 32a to an extension part 32b extending in one direction more than the planar optical waveguide element 31, and is arranged on the upper surface 33a of the heat generating part 32a. The heating wire 34 is provided with both ends extending to the extension part 32b, and pads 37 are provided at both ends of the heating wire 34. The pad 37 provides a method in which wires drawn from the outside and the heating wire 34 can be connected by soldering or the like.

The heating wire 34 is a thin thin film attached by a method such as silk printing to reduce the size of the planar optical waveguide device module 30 and should be evenly disposed on the entire upper surfaces 33a and 33b of the heating plate 32. do.

In the heat generating plate 32 configured as described above, the top surface 33a of the heat generating portion 32a is attached to the bottom surface of the planar optical waveguide element 31. When the heating plate 32 is attached to the planar optical waveguide device 31, the heating plate 32 is attached using a medium such as thermal grease, and then rubbed to increase the adhesion of the contact surface during the curing of the medium. Press with the right force.

When the two types of planar optical waveguide device modules 20 and 30 are configured as described above, when a predetermined amount of power is supplied to the heating wires 24 and 34 from the outside, the heating wires 24 and 34 generate heat to generate the plane. Supply to the optical waveguide elements 21 and 31. In order for the planar optical waveguide elements 21 and 31 to obtain a uniform temperature distribution, the hot wires 24 and 34 should be evenly arranged on the top surfaces 22a and 33a of the heating plates 22 and 32, respectively. Obviously, the adhesion between the optical waveguide elements 21 and 31 and the heating plates 22 and 32 should also be high. In the planar optical waveguide device modules 20 and 30 having such a configuration, the temperature distribution of the planar optical waveguide devices 21 and 31 is uniform, and heat generated from the hot wires 24 and 34 is generated in the planar optical waveguide device. Direct transfer to (21, 31) improves thermal efficiency. In addition, a heat sensing sensor is attached to a predetermined position of the planar optical waveguide elements 21 and 31, and the power supplied to the hot wires 24 and 34 is appropriately controlled through the temperature read from the sensor, thereby providing the planar light. The temperature of the waveguide elements 21 and 31 can be adjusted.

As described above, the present invention is a thermal efficiency of the planar optical waveguide device module by directly contacting a heat generating wire or conductor directly to the planar optical waveguide device to prevent heat loss generated in the process of heat transfer through the heat conduction plate. Improved. Therefore, the deterioration factor that may occur due to uneven temperature distribution of the planar optical waveguide device is removed, and the stability of the device is improved through stable temperature control. In addition, the process of attaching a separate heat conduction plate between the planar waveguide element and the heating plate using heat grease is simplified, and the module is miniaturized by removing the heat conduction plate, and there is no heat transfer process transmitted through the heat conduction plate. The time from the operation point of the planar optical waveguide element to the normal operation is shortened.

Claims (6)

In a planar optical waveguide device module having a heat transfer device, A planar optical waveguide element; And a heating plate bonded to a lower surface of the planar optical waveguide device and including a heating plate in which one strand of heat wires is bent and arranged evenly on the entire upper surface of the planar optical waveguide device bonded to the lower surface of the planar optical waveguide device. Waveguide device module. The method of claim 1, wherein the heating plate A pad for connecting an external power source and the heating wire to a lower surface thereof; A planar optical waveguide device module having a heat transfer device, characterized in that it comprises a through-hole extending from an upper surface thereof to provide a passage connecting to the pad. The method of claim 2, wherein the heating plate And a conductor for connecting the hot wire to the pad through the through-hole at both ends thereof. The method of claim 1, wherein the heating plate A heating unit having the heating wire arranged on an upper surface thereof, and extending from the heating unit in one direction more than a width of the planar optical waveguide element to extend and expose both ends of the heating wire, respectively having pads at both ends of the exposed heating wire; Planar optical waveguide device module having a heat transfer device, characterized in that it comprises an extension. The method of claim 4, wherein the exposed hot wire Planar optical waveguide device module having a heat transfer device, characterized in that located on the upper surface of the extension. The method of claim 1, wherein the heating wire A planar optical waveguide device module having a heat transfer device, characterized in that a thin film is attached to an attachment surface of the heating plate by using a silk printing method.