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Publication number
JPWO2019180316A5
JPWO2019180316A5 JP2020549750A JP2020549750A JPWO2019180316A5 JP WO2019180316 A5 JPWO2019180316 A5 JP WO2019180316A5 JP 2020549750 A JP2020549750 A JP 2020549750A JP 2020549750 A JP2020549750 A JP 2020549750A JP WO2019180316 A5 JPWO2019180316 A5 JP WO2019180316A5
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JP
Japan
Prior art keywords
substrate film
connector
structure according
conductive
conductive contact
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Granted
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JP2020549750A
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English (en)
Japanese (ja)
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JP7255603B2 (ja
JP2021524152A (ja
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Priority claimed from US15/924,697 external-priority patent/US11088066B2/en
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Publication of JP2021524152A publication Critical patent/JP2021524152A/ja
Publication of JPWO2019180316A5 publication Critical patent/JPWO2019180316A5/ja
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Publication of JP7255603B2 publication Critical patent/JP7255603B2/ja
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JP2020549750A 2018-03-19 2019-03-18 電子機器用の多層構造及び関連する製造方法 Active JP7255603B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/924,697 US11088066B2 (en) 2018-03-19 2018-03-19 Multilayer structure and related method of manufacture for electronics
US15/924,697 2018-03-19
PCT/FI2019/050226 WO2019180316A1 (en) 2018-03-19 2019-03-18 Multilayer structure for electronics and related method of manufacture

Publications (3)

Publication Number Publication Date
JP2021524152A JP2021524152A (ja) 2021-09-09
JPWO2019180316A5 true JPWO2019180316A5 (zh) 2022-04-06
JP7255603B2 JP7255603B2 (ja) 2023-04-11

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JP2020549750A Active JP7255603B2 (ja) 2018-03-19 2019-03-18 電子機器用の多層構造及び関連する製造方法

Country Status (8)

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US (2) US11088066B2 (zh)
EP (1) EP3769594B1 (zh)
JP (1) JP7255603B2 (zh)
KR (1) KR102566274B1 (zh)
CN (1) CN111869338A (zh)
MX (1) MX2020009766A (zh)
TW (1) TWI791797B (zh)
WO (1) WO2019180316A1 (zh)

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