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JPS6439743A - Container for integrated circuit - Google Patents

Container for integrated circuit

Info

Publication number
JPS6439743A
JPS6439743A JP62196772A JP19677287A JPS6439743A JP S6439743 A JPS6439743 A JP S6439743A JP 62196772 A JP62196772 A JP 62196772A JP 19677287 A JP19677287 A JP 19677287A JP S6439743 A JPS6439743 A JP S6439743A
Authority
JP
Japan
Prior art keywords
leads
face
constitution
ceramic body
probing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62196772A
Other languages
Japanese (ja)
Inventor
Hikari Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62196772A priority Critical patent/JPS6439743A/en
Publication of JPS6439743A publication Critical patent/JPS6439743A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To easily inspect a circuit of an inner IC and test characteristics by providing a plurality of pads electrically connected to leads on the opposite face of a lead forming face to inspect or test the IC to perform a probing. CONSTITUTION:Conductor wirings are provided in a ceramic body 10 to connect leads 11 to a terminal 102 of an IC or the like. The leads and pads 12 connected via the wirings or through holes are formed on the opposite face to the face formed with the leads 11. When a pitch of the leads is 0.4mm therebetween, the width of the lead is 0.2mm as large as possible by considering its clearance. Accordingly, the size of a probing pad 12 can be, in case of two rows, formed at the least 0.6mmX0.6mm. With the constitution, when an IC or the like contained therein is electrically tested, a measuring pad of the area provided on a ceramic body can be probed. Thus, easy testing can be performed.
JP62196772A 1987-08-05 1987-08-05 Container for integrated circuit Pending JPS6439743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196772A JPS6439743A (en) 1987-08-05 1987-08-05 Container for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196772A JPS6439743A (en) 1987-08-05 1987-08-05 Container for integrated circuit

Publications (1)

Publication Number Publication Date
JPS6439743A true JPS6439743A (en) 1989-02-10

Family

ID=16363372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196772A Pending JPS6439743A (en) 1987-08-05 1987-08-05 Container for integrated circuit

Country Status (1)

Country Link
JP (1) JPS6439743A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6976326B2 (en) 2000-05-08 2005-12-20 Tokai Kogyo Mishin Kabushiki Kaisha Clip for embroidery frame
CN110729252A (en) * 2019-10-31 2020-01-24 中国电子科技集团公司第十三研究所 0.4 mm-pitch ceramic four-side lead flat shell and preparation method thereof
CN110783276A (en) * 2019-11-12 2020-02-11 中国电子科技集团公司第十三研究所 0.4 mm-pitch main lead ceramic small-outline shell and power device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6976326B2 (en) 2000-05-08 2005-12-20 Tokai Kogyo Mishin Kabushiki Kaisha Clip for embroidery frame
CN110729252A (en) * 2019-10-31 2020-01-24 中国电子科技集团公司第十三研究所 0.4 mm-pitch ceramic four-side lead flat shell and preparation method thereof
CN110729252B (en) * 2019-10-31 2021-12-24 中国电子科技集团公司第十三研究所 0.4mm pitch ceramic quad flat package
CN110783276A (en) * 2019-11-12 2020-02-11 中国电子科技集团公司第十三研究所 0.4 mm-pitch main lead ceramic small-outline shell and power device

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