JPH03185744A - Semiconductor element - Google Patents

Abstract

PURPOSE:To easily judge a defect when many semiconductor elements are measured simultaneously by a method wherein a fuse terminal is built in each semiconductor element. CONSTITUTION:A fuse terminal 11 is connected to a main functional operation circuit 1 by using a power supply. When many semiconductor elements are measured simultaneously with a semiconductor test apparatus, a needle of a probe card is first brought into contact with individual pads 2 to 10. An electric current in the forward direction is made to flow to a diode 12 attached to each pad and a voltage at this time is measured. Whether the needle of the probe card is normally brought into contact with the individual pads is read out and judged from its measured value. The same operation is executed on many semiconductor elements. When it is normally brought into contact, an electrical test and a functional test are made and it is judged whether they are good products or not. When a defect is found by the tests, a fuse at the fuse terminal is blown to identify the defect. Thereby, many semiconductor elements can simultaneously and easily be measured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device tested by a semiconductor testing device.

[Summary of the invention]

The present invention allows semiconductor devices to be tested simultaneously in large numbers to shorten measurement time by conducting tests in several batches.
Even if a band mark cannot be attached even though the product is determined to be defective through testing, by cutting the fuse of the built-in fuse terminal, it is possible to identify the defect and measure multiple items at the same time. be.

[Conventional technology]

Conventionally, when simultaneously measuring a large number of semiconductor devices on a wafer for the purpose of shortening the measurement time, the number of simultaneous measurements has been determined according to the number of defective signals from a semiconductor testing device.

[Problem to be solved by the invention]

However, in conventional technology, when testing a semiconductor device, if the semiconductor device is defective, a blower receives a defective signal from the test equipment and marks the semiconductor device with a pad mark, thereby destroying the semiconductor device. It was considered a defective product. However, there is a limit to the number of defective signals from the test equipment, and when trying to measure a large number of signals simultaneously, some signals cannot be marked with a band mark, which limits the number of simultaneous measurements.

[Means to solve the problem]

In order to solve the above-mentioned problems, the present invention provides a groove bottom with a fuse terminal provided in the semiconductor element, thereby making it possible to judge the pass/fail of simultaneous measurement of a large number of semiconductor elements when there is a restriction that it is not possible to attach a bad mark. .

[Effect]

When a large number of semiconductor devices configured as described above are measured simultaneously, if they are found to be defective, cutting the fuse at this fuse terminal will identify the defect and facilitate simultaneous measurement of a large number of devices. It is possible to do this.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

In FIG. 1, a fuse terminal 1.1 in one semiconductor element is connected to the functional operation circuit 1 through a power source. First, when measuring a large number of devices simultaneously using semiconductor test equipment,
Bring the needle of the probe card into contact with each band 2-10.

A current is passed in the forward direction through the diode 12 attached to each pad, and the voltage at that time is measured. From the measured values, it is determined whether the needles of the probe card are properly touching each pad. The same thing is done with a large number of semiconductor elements. If the contact is normal, an electrical functional test is performed and a pass/fail judgment is made. If the result of the pass/fail determination is that it is defective, a voltage or current is applied to the fuse terminal to disconnect the fuse 13. By cutting it, there will be no electrical connection even if the needle of the probe card comes into contact with it. As a result, when tested in the next step, this semiconductor element is determined to have poor contact, and no electrical and single functional tests are performed thereafter. In this way, it is possible to simultaneously measure a large number of semiconductor devices when bad marks cannot be made depending on the state of the fuses of the semiconductor devices.

〔Effect of the invention〕

As explained above, this invention has the effect of making it easier to determine whether a semiconductor device is defective when simultaneously measuring a large number of devices by incorporating a fuse terminal into the semiconductor device.

[Brief explanation of drawings]

FIG. 1 shows a semiconductor device according to an embodiment of the invention. This function operation circuit 2-10...Bad 11...Fuse terminal 12...Diode 13... Fuse

Claims (1)

[Claims] 1. A semiconductor device provided on a wafer on which a large number of semiconductor devices are electrically and functionally tested simultaneously by a semiconductor testing device, characterized in that the semiconductor device is provided with a fuse terminal.