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JPS6453429A - Device for testing semiconductor chip - Google Patents

Device for testing semiconductor chip

Info

Publication number
JPS6453429A
JPS6453429A JP62210922A JP21092287A JPS6453429A JP S6453429 A JPS6453429 A JP S6453429A JP 62210922 A JP62210922 A JP 62210922A JP 21092287 A JP21092287 A JP 21092287A JP S6453429 A JPS6453429 A JP S6453429A
Authority
JP
Japan
Prior art keywords
rear side
connectors
probe card
performance board
probes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62210922A
Other languages
Japanese (ja)
Inventor
Atsuko Suda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62210922A priority Critical patent/JPS6453429A/en
Publication of JPS6453429A publication Critical patent/JPS6453429A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To enable the title test device to be repaired and modified by separately assembling the probe groups of a probe card and the circuit pattern groups of a performance board for use or separating them as a unit in a manner that both groups are separably connected through the intermediary of connectors. CONSTITUTION:Probes are arranged on the rear side of a probe card while circuit patterns 14 corresponding to the probes 13 are formed on the rear side of a performance board 12. Besides, a connector board 15 is fixed on the rear side of the performance board 12 to provide connectors 16 arranged taking regular polygonal shape on the rear side of the connector board 15. The connectors 16 are connected to the circuit patterns 14 of the performance board 12 through the intermediary of a flat cable 17. On the other hand, pogo pins 18 connected to the probes 13 are implanted in the upper surface of the probe card 10 so that the probe card 10 and the performance board 12 may be integrated with each other by inserting the polygonal pins 18 into the corresponding connectors 16.
JP62210922A 1987-08-24 1987-08-24 Device for testing semiconductor chip Pending JPS6453429A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210922A JPS6453429A (en) 1987-08-24 1987-08-24 Device for testing semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210922A JPS6453429A (en) 1987-08-24 1987-08-24 Device for testing semiconductor chip

Publications (1)

Publication Number Publication Date
JPS6453429A true JPS6453429A (en) 1989-03-01

Family

ID=16597294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210922A Pending JPS6453429A (en) 1987-08-24 1987-08-24 Device for testing semiconductor chip

Country Status (1)

Country Link
JP (1) JPS6453429A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003506686A (en) * 1999-07-28 2003-02-18 ナノネクサス インコーポレイテッド Structure and manufacturing method of integrated circuit wafer probe card assembly
JP2004500699A (en) * 1999-05-27 2004-01-08 ナノネクサス インコーポレイテッド Structure and manufacturing method of integrated circuit wafer probe card assembly
WO2004040325A1 (en) * 2002-10-31 2004-05-13 Advantest Corporation Connection unit, board mounting device to be measured, probe card, and device interface unit
KR100482733B1 (en) * 1998-07-07 2005-04-14 가부시키가이샤 어드밴티스트 A probe card for ic testing apparatus
KR100774035B1 (en) * 2002-10-31 2007-11-06 주식회사 아도반테스토 Board and Probe Card
KR100791000B1 (en) * 2006-10-31 2008-01-03 삼성전자주식회사 Electrical inspection device and inspection method for high speed parallel inspection of wafers
JP2008506112A (en) * 2004-07-07 2008-02-28 カスケード マイクロテック インコーポレイテッド Probe head with membrane suspension probe
JP2009052474A (en) * 2007-08-27 2009-03-12 Hitachi Ltd Gas turbine equipment and operation method of gas turbine equipment
JP2011227059A (en) * 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd Electric inspection jig and wiring board manufacturing method

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100482733B1 (en) * 1998-07-07 2005-04-14 가부시키가이샤 어드밴티스트 A probe card for ic testing apparatus
JP2004500699A (en) * 1999-05-27 2004-01-08 ナノネクサス インコーポレイテッド Structure and manufacturing method of integrated circuit wafer probe card assembly
JP2003506686A (en) * 1999-07-28 2003-02-18 ナノネクサス インコーポレイテッド Structure and manufacturing method of integrated circuit wafer probe card assembly
CN100344976C (en) * 2002-10-31 2007-10-24 株式会社爱德万测试 Connection unit, board mounting device to be measured, probe card, and device interface unit
US7098680B2 (en) 2002-10-31 2006-08-29 Advantest Corp. Connection unit, a board for mounting a device under test, a probe card and a device interfacing part
KR100717479B1 (en) * 2002-10-31 2007-05-14 주식회사 아도반테스토 Coupling unit for test apparatus
WO2004040325A1 (en) * 2002-10-31 2004-05-13 Advantest Corporation Connection unit, board mounting device to be measured, probe card, and device interface unit
KR100774035B1 (en) * 2002-10-31 2007-11-06 주식회사 아도반테스토 Board and Probe Card
JP2008506112A (en) * 2004-07-07 2008-02-28 カスケード マイクロテック インコーポレイテッド Probe head with membrane suspension probe
JP2012068256A (en) * 2004-07-07 2012-04-05 Cascade Microtech Inc Probe head with membrane suspended probe
KR100791000B1 (en) * 2006-10-31 2008-01-03 삼성전자주식회사 Electrical inspection device and inspection method for high speed parallel inspection of wafers
JP2009052474A (en) * 2007-08-27 2009-03-12 Hitachi Ltd Gas turbine equipment and operation method of gas turbine equipment
JP2011227059A (en) * 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd Electric inspection jig and wiring board manufacturing method

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