JPH0714922Y2 - Surface mount semiconductor device measurement adapter - Google Patents

Description

[Detailed Description of the Invention] [Overview] Regarding a measurement adapter for a surface mount semiconductor device 1 that can be easily inspected by an in-circuit tester (ICT), a measurement adapter for a surface mount semiconductor device that can share a fixture is provided. For the purpose of the following, a main body part in which a terminal for receiving each lead of the semiconductor element is housed in a case capped with the semiconductor element, and a main body part which is located outside the main body part and which is connected to the terminal on the upper surface thereof. A measuring board provided with terminals for measurement, the measuring terminals being capable of accommodating the inspection needles implanted in the fixture at a pitch that matches the virtual grid pitch set on the substrate. It is configured to be arranged at a pitch.

[Industrial application field]

The present invention relates to a surface mount semiconductor device measurement adapter used when inspecting a board by an in-circuit tester (ICT).

Generally, when forming a circuit on a printed circuit board or the like, the leads or various pads of the semiconductor element are arranged on a virtual grid on the board to improve the efficiency of mounting work, and even in the inspection of the board. , This point is utilized.

However, in recent years, with the development of surface mount technology (SMT),
Surface mount package semiconductor elements 1 such as flat pack type packages have come to be widely used, and since these leads do not ride on the grid, it is required to cope with them even in the inspection using ICT or the like.

[Conventional technology]

Conventionally, when the board is inspected using ICT,
As shown in the figure, a fixture 7 in which a large number of test needles 70 are implanted with a grid pitch p of the substrate 8 is used. For example, when inspecting the substrate 8 including the DIP type semiconductor element 9, The inspection needle 70 has been inserted through a through hole or the like formed at a position corresponding to the lead 90 at the measured position, or the inspection needle 70 has been brought into direct contact with the lead of the semiconductor element 1.

[Problems to be solved by the device]

However, when inspecting the substrate 8 on which the surface mount semiconductor element is mounted by such a method, the probing points do not lie on the grid G, so that the inspection needles 70 are arranged at a special pitch each time. Fixture 7
However, the measurement cost is increased and the fixture 7 is difficult to manufacture.

The present invention has been made to solve the above drawbacks, and an object of the present invention is to provide a measurement adapter capable of sharing the fixture 7.

[Means for Solving the Problems]

And a measurement board provided with a measurement terminal, wherein the measurement terminal has a pitch that matches a virtual grid pitch set on the substrate, and is compatible with an inspection needle implanted in a fixture. This is accomplished by providing an adapter for measuring the surface-mounted semiconductor device provided.

[Action]

That is, according to the present invention, the probing points of the semiconductor element 1 are developed on the measuring board 6 and the measuring terminals 5 on the measuring board 6 are made to correspond to the grid G on the substrate 8 so that the conventional fixture is fixed. The inspection by the cha 7 is possible.

〔Example〕

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In FIG. 1, reference numeral 1 is a surface mount semiconductor element such as QFP, 11 is a lead of the semiconductor element 1, and 4 is a main body which is detachably mounted so as to cover the semiconductor element 1.

The main body portion 4 is composed of a case 2 formed of an insulating material such as synthetic resin and a terminal 3 housed in the case 2, and a press-fitting piece 21 protruding from the lower end edge of the case 2 is provided with the semiconductor element 1. By press-fitting between the leads 11 of the semiconductor element 1,
It is designed to be attached to.

Further, the terminal 3 is a conductor provided to be supported by the inner wall portion of the case 2, and a contact at its tip end is in pressure contact with each lead 11 of the semiconductor element 1 when the case 2 is mounted.
30 are formed.

Reference numeral 6 denotes a measurement board, on the upper surface of which a measurement terminal 5 connected to the terminal 3 of the main body 4 via a cable 61 is embedded.
By arranging the fixtures 7 at a pitch p corresponding to the grid pitch p, the inspection needles 70 of the fixture 7 are configured to correspond to the respective measuring terminals 5 simply by bringing the fixture 7 into contact with the upper surface thereof. .

Therefore, according to this embodiment, even if the substrate 8 on which the surface mount semiconductor element 1 is mounted in a mixed manner with the semiconductor element 9 such as the DIP type, the surface mount semiconductor element 1 is covered with the main body portion 4. The probing points of the semiconductor element 1 are developed on the measurement board 6, and probing can be performed as in the conventional case.

In the embodiment shown in FIG. 1, the case 2 of the main body 4 is provided with the press-fitting piece 21 so as to project, and the main body 4 is crowned on the semiconductor element 1 by the press-fitting piece 21. However, the present invention is not limited to this. For example, as shown in FIG. 2, an elastic pressure contact piece 22 is provided on the inner wall of the case 2 in a protruding manner, and the elastic pressure contact piece 22 is used to package the semiconductor element 1.
Various modifications can be made, such as mounting so as to hold 10 or using the elastic pressure contact piece 22 made of a conductor and also used as the terminal 3.

[Effect of device]

As is clear from the above description, according to the measuring adapter for the surface mount semiconductor device of the present invention, the measuring terminals of the measuring board are fixed at a pitch that matches the virtual grid pitch set on the substrate. When inspecting the board on which the DIP type semiconductor element is mounted by arranging so as to be compatible with the inspection needle implanted in the tea, use the fixture to inspect the board on which the surface mount semiconductor element is mounted. In case of performing, by covering the main body part on the semiconductor element, receiving each lead of the semiconductor element on the terminal of the main body part, and contacting the measurement terminal of the measurement board with the inspection needle of the fixture , The probing points can be developed on the measurement board on which the measurement terminals are arranged corresponding to the grid pitch of the board.
The fixture 7 for use does not need to be specially created and can be shared.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a modified example of the case, and FIG. 3 is an explanatory diagram showing a conventional example. In FIG. 1, 1 is a surface mount semiconductor element, 2 is a case, 3
Is a terminal, 4 is a main body, 5 is a measuring terminal, 6 is a measuring board, and 7 is a lead.

Claims (1)

[Scope of utility model registration request] 1. A case (2) for covering a semiconductor element (1).
A main body part in which terminals (3) for receiving the respective leads (11) of the semiconductor element (1) are housed, and the main body part (4) is located outside and connected to the terminals (3) on the upper surface thereof. And a measurement board (6) provided with the measurement terminal (5), wherein the measurement terminal (5) is a virtual grid pitch (P) set on the substrate (8).
An adapter for measuring surface mount semiconductor elements arranged at a pitch that matches the inspection needle (70) implanted in the fixture (7) at a pitch that conforms to.