JPS6393855A - Vapor deposition device - Google Patents

Abstract

PURPOSE:To provide a vapor deposition device which decreases the contact area of a heated metal and crucible and prevents the cooling of a metal for vapor deposition in a hearth liner by integrally providing >=3 legs having the top ends respectively formed to acute angle to the bottom of the hearth liner in which the heated metal is contained. CONSTITUTION:The legs 2 having the top ends 2a formed to acute angle are provided to the bottom of the hearth liner 1 by the number required for the stable placement on the crucible 4; for example, >=3 pieces. These legs 2 are placed on the crucible 4 of the vapor deposition device and the vapor deposition is executed by heating the metal 3 for vapor deposition by an electron beam 10 generated from a filament 6. The heated metal 3 of Au, Al, etc., creeps from the side face of the liner 1 and contacts the crucible 4 along the legs 2. The contact area of the ends 2a of the legs 2 and the crucible 4 is decreased and the metal 3 in the liner 1 is hardly transferable to the crucible 4 in this invention. The effective use of the energy of the electron beam for heating the metal 3 is thereby permitted.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vapor deposition apparatus for forming a thin metal film on a semiconductor substrate.

[Conventional technology]

FIG. 3 is a side view showing the configuration of a conventional vapor deposition apparatus, and FIG. 4 is a side view of a conventional hearth liner.

As shown in FIG. 3, a vapor-deposited metal 3 is set on a hearth liner 1 made of a high-melting point metal such as tungsten, and this is placed on a copper crucible 4. An electron beam is emitted from a filament 6 heated by a power source 5 in a vacuum. 1o, magnetic pole 7
By adjusting the electron beam 10, the deposited metal 3 is exposed to the electron beam 10 and heated.

Note that 8 is a power source for the magnetic pole 7, and 9 is a cooling port.

When the temperature of the heated vapor-deposited metal 3 exceeds the melting point, the vapor-deposited metal 3 evaporates, and the evaporated substance in the vapor phase solidifies on the semiconductor substrate, thereby forming a thin film.

During thin film formation, the temperature inside the apparatus rises due to heating by the 1° electron beam, so water is flowed through the cooling port 9 to cool the crucible 4 and prevent the temperature inside the apparatus from rising.

[Problem that the invention seeks to solve]

When vapor deposition is performed using a conventional device, the entire vapor-deposited metal 3 melts within the hearth liner 1 in the case of low-melting metals such as gold and aluminum. 3 and crucible 4 come into contact,
The deposited metal 3 is cooled. For this reason, it is necessary to further heat the vapor-deposited metal 3, and the heat increases the temperature inside the vapor deposition apparatus, causing problems such as damage to the semiconductor substrate that is the object to be vapor-deposited.

This invention was made in order to solve the above-mentioned problems, and by reducing the contact area between the melted vapor deposited metal that has wrapped around the hearth liner and the crucible, and thereby preventing the heated vapor deposited metal from cooling. An object of the present invention is to obtain a vapor deposition apparatus that can perform vapor deposition without increasing the temperature inside the apparatus.

[Means for solving problems]

The vapor deposition apparatus according to the present invention has three tip parts each formed at an acute angle at the bottom of the hearth liner in which the metal to be heated is placed.
It has two or more legs that can be attached or detached.

[Effect]

In the vapor deposition apparatus according to the present invention, the vapor deposited metal that wraps around from the side surface of the hearth liner comes into contact with the crucible along the legs provided at the bottom, so the contact area between the vapor deposited metal and the crucible becomes small, and the vapor deposited metal is cooled. is prevented.

〔Example〕

FIG. 1 is a side view of a vapor deposition apparatus showing an embodiment of the present invention, and FIGS. 2(a) and 2(b) are a side view and a plan view showing an enlarged hearth liner, which is an essential part of the present invention. It is.

In these figures, the same reference numerals as in FIG. 3 indicate the same parts, and the bottom of the hearth liner 1 is provided with the number of legs 2 necessary for stable placement on the crucible 4, for example, three or more. Further, the tip portion 2a of this leg 2 is formed at an acute angle in order to reduce the contact area with the crucible 4. Further, the legs 2 can be formed integrally with the hearth liner 1 or separately, and can be detachably attached.

As shown in FIG. 1, the legs 2 provided at the bottom of the hearth liner 1 are placed on the crucible 4 of the vapor deposition apparatus, and the electron beam 1 is generated from the heated filament 6 in the same manner as in the conventional apparatus.
0 to heat the vapor-deposited metal 3 and perform vapor deposition.

The heated and molten vapor-deposited metal 3 such as gold or aluminum wraps around the side of the hearth liner 1 and flows along the legs 2 into the crucible 4.
come into contact with. In the conventional device, the entire bottom surface of the hearth liner 1 is in contact with the crucible 4, so heat conduction is large and the deposited metal 3 is cooled. However, in this invention, the contact area between the tip 2a of the leg 2 and the crucible becomes smaller, making it difficult for the vapor-deposited metal 3 in the hearth liner 1 to conduct to the crucible 4. This allows the energy of the electron beam to be efficiently transferred to the deposited metal 3.
will be used for heating.

〔Effect of the invention〕

As explained above, in the present invention, three or more legs each having an acute angle tip are provided at the bottom of the hearth liner, either integrally with the hearth liner or detachably, so that the heated metal and the crucible do not come into contact with each other. Can be stored in a smaller area,
Cooling of the deposited metal within the hearth liner can be prevented.

Therefore, since there is no need to further heat the cooled metal as in the conventional method, there is an effect that a thin film can be formed on the surface of the semiconductor substrate without increasing the temperature inside the vapor deposition apparatus.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an embodiment of the vapor deposition apparatus of the present invention;
Figures 2 (a) and (b) are an enlarged side view and plan view of the hearth liner of the present invention, Figure 3 is a side view of a conventional vapor deposition apparatus, and Figure 4 is a side view of a conventional hearth liner. be. In the figure, 1 is a hearth liner, 2 is a leg, 3 is a deposited metal, 4 is a crucible, 5 and 8 are power supplies, 6 is a filament, 7 is a magnetic pole, 9 is a cooling port, and 1o is an electron beam. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] In a vapor deposition apparatus that heats vapor-deposited metal in a hearth liner placed in a crucible in a vacuum to form a thin film on the main surface of a semiconductor substrate, three or more legs are provided to reduce the contact area between the hearth liner and the crucible. is provided on the bottom surface of the hearth liner.