JPS6079771U - multilayer wiring board - Google Patents
multilayer wiring boardInfo
- Publication number
- JPS6079771U JPS6079771U JP17255183U JP17255183U JPS6079771U JP S6079771 U JPS6079771 U JP S6079771U JP 17255183 U JP17255183 U JP 17255183U JP 17255183 U JP17255183 U JP 17255183U JP S6079771 U JPS6079771 U JP S6079771U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- multilayer wiring
- integrated circuit
- metal pattern
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の多層プリント配線基板の外観平面図、第
2図は本考案によるTAB型リードの集積回路チップの
実装に適した多層プリント配線基゛板の外観平面図、第
3図は従来の多層プリント配線基板にモールド封止した
集積回路チップを実装−した部分拡大図、第5図はその
断面図である。第4図は本考案の多層プリント配線基板
に一■型リードを有する集積回路チップを実装しれ部分
拡大図であり、第6図はその断面図である。第7図は集
積回路チップの封止を施した場合の断面図である。
各図において、1・・・・・・多層プリント配線基板の
外部接続端子、2・・・・・・スルーホール、3・・・
・・・キャビティ、4・・・・・・アイランド用金属パ
ターン、5・・・・・・接続端子用金属パターン、6・
・・・・・モールド封止の集積回路チップ、7・・・・
・・リード端子、8・・・・・・TAB型リード、9・
・・・・・TAB型リードを有する集積回路チップ、1
0・・・・・・シリコン樹脂、11・・・・・・従来の
多層プリント配線基板、12・・・・・・本考案による
多層プリント配線基板。Fig. 1 is an external plan view of a conventional multilayer printed wiring board, Fig. 2 is an external plan view of a multilayer printed wiring board suitable for mounting an integrated circuit chip with TAB type leads according to the present invention, and Fig. 3 is a conventional multilayer printed wiring board. FIG. 5 is a partially enlarged view of a multilayer printed wiring board with a mold-sealed integrated circuit chip mounted thereon, and FIG. 5 is a sectional view thereof. FIG. 4 is a partially enlarged view of an integrated circuit chip having one square lead mounted on a multilayer printed wiring board of the present invention, and FIG. 6 is a sectional view thereof. FIG. 7 is a cross-sectional view of the integrated circuit chip after it is sealed. In each figure, 1... External connection terminal of multilayer printed wiring board, 2... Through hole, 3...
...Cavity, 4...Metal pattern for island, 5...Metal pattern for connection terminal, 6...
...Mold-sealed integrated circuit chip, 7...
...Lead terminal, 8...TAB type lead, 9.
...Integrated circuit chip with TAB type leads, 1
0...Silicone resin, 11...Conventional multilayer printed wiring board, 12...Multilayer printed wiring board according to the present invention.
Claims (1)
実装することに適した多数のキャビティと、該キャビ5
ティ周辺の表面に一$型リードを接続する金属パターン
と、該キャビティ内に集積回路チップを、マウント接着
するアイランド用金属パターンを有することを特徴とす
る多層配線基板。a number of cavities suitable for accommodating and directly mounting integrated circuit chips with TAB type leads;
1. A multilayer wiring board comprising: a metal pattern for connecting a $1 lead on the surface around the tee; and a metal pattern for an island for mounting and bonding an integrated circuit chip in the cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17255183U JPS6079771U (en) | 1983-11-08 | 1983-11-08 | multilayer wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17255183U JPS6079771U (en) | 1983-11-08 | 1983-11-08 | multilayer wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6079771U true JPS6079771U (en) | 1985-06-03 |
Family
ID=30376107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17255183U Pending JPS6079771U (en) | 1983-11-08 | 1983-11-08 | multilayer wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6079771U (en) |
-
1983
- 1983-11-08 JP JP17255183U patent/JPS6079771U/en active Pending
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