JPS5936268U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5936268U JPS5936268U JP12977182U JP12977182U JPS5936268U JP S5936268 U JPS5936268 U JP S5936268U JP 12977182 U JP12977182 U JP 12977182U JP 12977182 U JP12977182 U JP 12977182U JP S5936268 U JPS5936268 U JP S5936268U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- utility
- model registration
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来の印刷配線板にチップ部品を取
付けた状態を示す平面図、第２図ａ、 ｂ及び第３図
ａ、 ｂはこの考案の印刷配線板のそれぞれ異なる実
施例を示す平面図である。
１・・・・・・ランド、２・・・・・・導電部、３・・
・・・・チップ部品、４・・・・・・連通部、５・・・
・・・凹部、６・・・・・・長孔。Figures 1a and 1b are plan views showing a state in which chip components are attached to a conventional printed wiring board, and Figures 2a and 2b and 3a and 3b show different embodiments of the printed wiring board of this invention. FIG. 1... Land, 2... Conductive part, 3...
...Chip parts, 4...Communication part, 5...
... recess, 6... long hole.
Claims (4)
ランドに連通ずる導電路とを絶縁基板に形成し、前記ラ
ンドと導電路との連通部にはんだ流防止部を設けたこと
を特徴とする印刷配線板。(1) A land to which an electrode of a chip component is soldered and a conductive path communicating with the land are formed on an insulating substrate, and a solder flow prevention portion is provided in the communication portion between the land and the conductive path. Printed wiring board.
設けたことを特徴とする実用新案登録請求の範囲第（１
）項記載の印刷配線板。(2) Utility model registration claim No. 1 (1) characterized in that the side portion of the communication portion is removed in a concave shape to provide a solder flow prevention portion.
)Printed wiring board as described in section.
を設けたことを特徴とする実用新案登録請求の範囲第（
１）項記載の印刷配線板。(3) Utility model registration claim No. (
1) The printed wiring board described in item 1).
したことを特徴とする実用新案登録請求の範囲第（１）
項記載の印刷配線板。(4) Utility model registration claim No. (1) characterized in that a solder-resistant film is formed on the communication portion to form a solder flow prevention portion.
Printed wiring board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12977182U JPS5936268U (en) | 1982-08-30 | 1982-08-30 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12977182U JPS5936268U (en) | 1982-08-30 | 1982-08-30 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5936268U true JPS5936268U (en) | 1984-03-07 |
Family
ID=30293930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12977182U Pending JPS5936268U (en) | 1982-08-30 | 1982-08-30 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936268U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280321U (en) * | 1985-11-08 | 1987-05-22 | ||
| JPH0165641U (en) * | 1987-10-20 | 1989-04-26 | ||
| JPH0348490A (en) * | 1989-07-17 | 1991-03-01 | Canon Inc | Printed wiring board and formation thereof |
| JP2003526220A (en) * | 2000-03-07 | 2003-09-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit and substrate for the electric circuit |
| JP2010135375A (en) * | 2008-12-02 | 2010-06-17 | Sumitomo Electric Printed Circuit Inc | Printed wiring board and connection method of electronic component in the same |
| JPWO2015174202A1 (en) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | Resin-sealed module |
| WO2020170968A1 (en) * | 2019-02-21 | 2020-08-27 | デンカ株式会社 | Circuit board, mounting board, method for manufacturing circuit board, and method for manufacturing mounting board |
| WO2023127380A1 (en) * | 2021-12-27 | 2023-07-06 | 日立Astemo株式会社 | Electronic control device |
-
1982
- 1982-08-30 JP JP12977182U patent/JPS5936268U/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6280321U (en) * | 1985-11-08 | 1987-05-22 | ||
| JPH0165641U (en) * | 1987-10-20 | 1989-04-26 | ||
| JPH0348490A (en) * | 1989-07-17 | 1991-03-01 | Canon Inc | Printed wiring board and formation thereof |
| JP2003526220A (en) * | 2000-03-07 | 2003-09-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electric circuit and substrate for the electric circuit |
| JP2010135375A (en) * | 2008-12-02 | 2010-06-17 | Sumitomo Electric Printed Circuit Inc | Printed wiring board and connection method of electronic component in the same |
| JPWO2015174202A1 (en) * | 2014-05-13 | 2017-04-20 | 株式会社村田製作所 | Resin-sealed module |
| US10251277B2 (en) | 2014-05-13 | 2019-04-02 | Murata Manufacturing Co., Ltd. | Resin-sealed module |
| WO2020170968A1 (en) * | 2019-02-21 | 2020-08-27 | デンカ株式会社 | Circuit board, mounting board, method for manufacturing circuit board, and method for manufacturing mounting board |
| JPWO2020170968A1 (en) * | 2019-02-21 | 2021-12-16 | デンカ株式会社 | Circuit board, mounting board, lighting equipment, circuit board manufacturing method and mounting board manufacturing method |
| TWI832972B (en) * | 2019-02-21 | 2024-02-21 | 日商電化股份有限公司 | Circuit substrate, mounting substrate, lighting device, method for producing circuit substrate, and method for producing mounting substrate |
| WO2023127380A1 (en) * | 2021-12-27 | 2023-07-06 | 日立Astemo株式会社 | Electronic control device |
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