JPS59103449U - Mounting structure of semiconductor package - Google Patents
Mounting structure of semiconductor packageInfo
- Publication number
- JPS59103449U JPS59103449U JP19961482U JP19961482U JPS59103449U JP S59103449 U JPS59103449 U JP S59103449U JP 19961482 U JP19961482 U JP 19961482U JP 19961482 U JP19961482 U JP 19961482U JP S59103449 U JPS59103449 U JP S59103449U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- pin
- mounting structure
- above connection
- connection pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図及び第２図は従来の半導体パッケージの実装構造
を示す断面図、第３図は本考案による半導体パッケージ
の実装構造を示す断面図である。
１１・・・・・・半導体パッケージ、１２・・・・・・
接続ピン、１３・・・・・・先端部、１４・・・・・・
プリント基板、１５・・・・・・プリント基板の表面、
１６・・・・・・接続用ヴイア、１８・・・・・・接続
孔、２０・・・・・・半田。1 and 2 are cross-sectional views showing a conventional semiconductor package mounting structure, and FIG. 3 is a cross-sectional view showing a semiconductor package mounting structure according to the present invention. 11... Semiconductor package, 12...
Connection pin, 13...Tip, 14...
Printed circuit board, 15...Surface of printed circuit board,
16... Connection via, 18... Connection hole, 20... Solder.
Claims (1)
パッケージの裏面側に短寸で先端部が先細とされた接続
ピンを突出し、一方プリント基板の表面の上記接続ピン
と対応する箇所には上記接続ピンの外径よりやや小さい
孔径を有する接続用ヴイアを設け、上記接続ピンの先端
先細部を接続用ヴイアの上端部に嵌合して半田付は固定
してなる半導体パッケージの実装構造。A short connecting pin with a tapered tip protrudes from the back side of a semiconductor package in which a chip in which a circuit element is built is sealed, while the above connection pin is placed on the surface of the printed circuit board at a location corresponding to the above connection pin. A mounting structure for a semiconductor package, in which a connecting via having a hole diameter slightly smaller than the outer diameter of a pin is provided, and a tapered part of the tip of the connecting pin is fitted into an upper end of the connecting via to fix soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19961482U JPS59103449U (en) | 1982-12-28 | 1982-12-28 | Mounting structure of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19961482U JPS59103449U (en) | 1982-12-28 | 1982-12-28 | Mounting structure of semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59103449U true JPS59103449U (en) | 1984-07-12 |
Family
ID=30425140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19961482U Pending JPS59103449U (en) | 1982-12-28 | 1982-12-28 | Mounting structure of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59103449U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120731B2 (en) * | 1972-12-27 | 1976-06-28 | ||
| JPS56104489A (en) * | 1980-01-23 | 1981-08-20 | Hitachi Ltd | Substrate connecting terminal mounting structure |
| JPS57180155A (en) * | 1981-04-30 | 1982-11-06 | Nec Corp | Vessel for electronic circuit |
-
1982
- 1982-12-28 JP JP19961482U patent/JPS59103449U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5120731B2 (en) * | 1972-12-27 | 1976-06-28 | ||
| JPS56104489A (en) * | 1980-01-23 | 1981-08-20 | Hitachi Ltd | Substrate connecting terminal mounting structure |
| JPS57180155A (en) * | 1981-04-30 | 1982-11-06 | Nec Corp | Vessel for electronic circuit |
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