JPS58192492U

JPS58192492U - IC socket

Info

Publication number: JPS58192492U
Application number: JP9076782U
Authority: JP
Inventors: 中沢　久雄
Original assignee: NEC Corp
Current assignee: NEC Corp
Priority date: 1982-06-17
Filing date: 1982-06-17
Publication date: 1983-12-21

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来のラッピング型ＩＣソケットの一例の斜視
図、第２図は第１図に示す底面基板の斜視図、第３図は
第１図に示すＩＣソケットを実装したプリント基板の斜
視図、第４図は本考案の一実施例に使用する底面基板の
斜視図、第５図は本考案の一実施例を実装したプリント
基板の斜視図である。１・・・・・・ＩＣソケット、２・・・・・・上面基板
、３・・・・・・半田付は用端子、４・・・・・・ラッ
ピング端子、５・・・・・・底面基板、６・・・・・・
プリント基板、７・・・・・・ＩＣ。１０・・・・・・ＩＣソケット、１１・・・・・・底面
基板、１２・・・・・・貫通孔、１３・・・・・・非貫
通穴。Figure 1 is a perspective view of an example of a conventional wrapping type IC socket, Figure 2 is a perspective view of the bottom board shown in Figure 1, and Figure 3 is a perspective view of a printed circuit board on which the IC socket shown in Figure 1 is mounted. , FIG. 4 is a perspective view of a bottom board used in an embodiment of the present invention, and FIG. 5 is a perspective view of a printed circuit board on which an embodiment of the present invention is mounted. 1...IC socket, 2...Top board, 3...Terminal for soldering, 4...Wrapping terminal, 5... Bottom board, 6...
Printed circuit board, 7...IC. 10...IC socket, 11...Bottom board, 12...Through hole, 13...Non-through hole.

Claims

[Scope of utility model registration request]

an upper substrate having a contact for electrical connection with an IC lead; a soldering terminal protruding from the lower surface of the upper substrate and electrically connected to the contact; and an upper surface of the upper substrate. Furthermore, the soldering terminal is provided with a wrapping terminal protruding from a position that does not overlap with the terminal and electrically connects with the contact, and the soldering terminal is fixed by engaging a through hole through which the terminal passes through and the wrapping terminal. 1. An IC socket comprising: a bottom substrate having a non-through hole;