JPS60130672U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60130672U JPS60130672U JP1790984U JP1790984U JPS60130672U JP S60130672 U JPS60130672 U JP S60130672U JP 1790984 U JP1790984 U JP 1790984U JP 1790984 U JP1790984 U JP 1790984U JP S60130672 U JPS60130672 U JP S60130672U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- lands
- abandoned
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のフラットパッケージ型ＩＣのプリント配
線基板への取付は過程を示す斜視図、第２図は本考案の
プリント配線基板の１実施例を示す斜視図、第３図およ
び第４図は本考案のプリント配線基板の使用状態を説明
するための要部平面図である。
１・・・・・・プリント配線基板、２・・・・・・フラ
ットパッケージ型ｉｃ、 ３・・・・・・取付足、４・
・・・・・ランド、５・・・・・・半田、６・・・・・
・すてランド。Fig. 1 is a perspective view showing the process of attaching a conventional flat package type IC to a printed wiring board, Fig. 2 is a perspective view showing one embodiment of the printed wiring board of the present invention, and Figs. 3 and 4. FIG. 2 is a plan view of main parts for explaining the usage state of the printed wiring board of the present invention. 1...Printed wiring board, 2...Flat package type IC, 3...Mounting foot, 4...
...Land, 5...Solder, 6...
・Steland.
Claims (2)
接続を目的としないすてランドを形成したプリント配線
基板。(1) A printed wiring board in which abandoned lands not intended for electrical connection are formed near a group of lands for connection with electrical components.
状を異にしていることを特徴とする実用新案登録請求の
範囲第１項記載のプリント配線基板。(2) The printed wiring board according to claim 1, wherein the shape of the abandoned land is different from that of the connecting land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1790984U JPS60130672U (en) | 1984-02-10 | 1984-02-10 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1790984U JPS60130672U (en) | 1984-02-10 | 1984-02-10 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60130672U true JPS60130672U (en) | 1985-09-02 |
Family
ID=30506051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1790984U Pending JPS60130672U (en) | 1984-02-10 | 1984-02-10 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130672U (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744699U (en) * | 1980-08-19 | 1982-03-11 | ||
| JPS57141992A (en) * | 1981-02-25 | 1982-09-02 | Omron Tateisi Electronics Co | Printed board |
| JPS5832488A (en) * | 1981-08-20 | 1983-02-25 | 松下電器産業株式会社 | Printed circuit board device |
| JPS5844605U (en) * | 1981-09-18 | 1983-03-25 | 日立機電工業株式会社 | automated guided vehicle |
| JPS5852896A (en) * | 1981-09-24 | 1983-03-29 | 日本電気株式会社 | Hybrid integrated circuit board |
| JPS5856491A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Printed circuit board |
| JPS58132941A (en) * | 1982-02-02 | 1983-08-08 | Sharp Corp | Lead-connecting method for part-mounting substrate |
-
1984
- 1984-02-10 JP JP1790984U patent/JPS60130672U/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5744699U (en) * | 1980-08-19 | 1982-03-11 | ||
| JPS57141992A (en) * | 1981-02-25 | 1982-09-02 | Omron Tateisi Electronics Co | Printed board |
| JPS5832488A (en) * | 1981-08-20 | 1983-02-25 | 松下電器産業株式会社 | Printed circuit board device |
| JPS5844605U (en) * | 1981-09-18 | 1983-03-25 | 日立機電工業株式会社 | automated guided vehicle |
| JPS5852896A (en) * | 1981-09-24 | 1983-03-29 | 日本電気株式会社 | Hybrid integrated circuit board |
| JPS5856491A (en) * | 1981-09-30 | 1983-04-04 | 株式会社東芝 | Printed circuit board |
| JPS58132941A (en) * | 1982-02-02 | 1983-08-08 | Sharp Corp | Lead-connecting method for part-mounting substrate |
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