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JPS58182458U - circuit unit - Google Patents

circuit unit

Info

Publication number
JPS58182458U
JPS58182458U JP8080182U JP8080182U JPS58182458U JP S58182458 U JPS58182458 U JP S58182458U JP 8080182 U JP8080182 U JP 8080182U JP 8080182 U JP8080182 U JP 8080182U JP S58182458 U JPS58182458 U JP S58182458U
Authority
JP
Japan
Prior art keywords
circuit unit
substrate
circuit component
utility
hole formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8080182U
Other languages
Japanese (ja)
Inventor
寛幸 大田
酒井　五雄
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP8080182U priority Critical patent/JPS58182458U/en
Publication of JPS58182458U publication Critical patent/JPS58182458U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例を示し、第１図は全体の縦断面
図、第２図は同平面図、第３図及び第４図はＬＳＩの取
外し手順を夫々示す縦断面図である。 図中、１はプリント基板（基板）、２はＬＳＩ（扁平な
回路部品）、６は半田、７は貫通孔であス−The drawings show an embodiment of the present invention, in which FIG. 1 is a longitudinal sectional view of the whole, FIG. 2 is a plan view thereof, and FIGS. 3 and 4 are longitudinal sectional views showing the removal procedure of the LSI. In the figure, 1 is a printed circuit board (board), 2 is an LSI (flat circuit component), 6 is solder, and 7 is a through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、この基板に熱圧着手段により装着した扁平な回
路部品と、前記基板に前記回路部品の装着領域内に位置
して形成した貫通孔とを具備して成る回路ユニット。1. A circuit unit comprising: a substrate; a flat circuit component attached to the substrate by thermocompression bonding means; and a through hole formed in the substrate within a mounting area of the circuit component.
JP8080182U 1982-05-31 1982-05-31 circuit unit Pending JPS58182458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8080182U JPS58182458U (en) 1982-05-31 1982-05-31 circuit unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8080182U JPS58182458U (en) 1982-05-31 1982-05-31 circuit unit

Publications (1)

Publication Number Publication Date
JPS58182458U true JPS58182458U (en) 1983-12-05

Family

ID=30089935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8080182U Pending JPS58182458U (en) 1982-05-31 1982-05-31 circuit unit

Country Status (1)

Country Link
JP (1) JPS58182458U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534643B2 (en) * 1977-06-29 1980-09-08
JPS5542340B2 (en) * 1976-12-18 1980-10-30

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542340B2 (en) * 1976-12-18 1980-10-30
JPS5534643B2 (en) * 1977-06-29 1980-09-08

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