JPS6049662U - Chip component mounting structure - Google Patents
Chip component mounting structureInfo
- Publication number
- JPS6049662U JPS6049662U JP14256383U JP14256383U JPS6049662U JP S6049662 U JPS6049662 U JP S6049662U JP 14256383 U JP14256383 U JP 14256383U JP 14256383 U JP14256383 U JP 14256383U JP S6049662 U JPS6049662 U JP S6049662U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- mounting structure
- component mounting
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例のチップ部品の実装構造を示す斜視図で
、第２図は同装着状態の断面図、第３図は本考案に係る
チップ部品の実装構造を示す斜視図で、第４図は同装着
状態の断面図、第５図はチップ部品の他の実施例を示す
斜視図で、第６図はプリント基板の他の実施例を示す斜
視図である。
１・・・チップ部品、３，９・・・接着面、４・・・凹
部、６・・・プリント基板、８・・・接着剤。FIG. 1 is a perspective view showing a conventional chip component mounting structure, FIG. 2 is a sectional view of the mounted state, FIG. 3 is a perspective view showing a chip component mounting structure according to the present invention, and FIG. 5 is a perspective view showing another embodiment of the chip component, and FIG. 6 is a perspective view showing another embodiment of the printed circuit board. DESCRIPTION OF SYMBOLS 1... Chip component, 3, 9... Adhesive surface, 4... Recessed part, 6... Printed circuit board, 8... Adhesive.
Claims (1)
れるチップ部品との、少なくとも一方の゛接着面に複数
個の凹部を形成したことを特徴とするチップ部品の実装
構造。A mounting structure for a chip component, characterized in that a plurality of recesses are formed in the bonding surface of at least one of a printed circuit board and a chip component bonded to the printed circuit board with an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256383U JPS6049662U (en) | 1983-09-14 | 1983-09-14 | Chip component mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14256383U JPS6049662U (en) | 1983-09-14 | 1983-09-14 | Chip component mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6049662U true JPS6049662U (en) | 1985-04-08 |
Family
ID=30318511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14256383U Pending JPS6049662U (en) | 1983-09-14 | 1983-09-14 | Chip component mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6049662U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310505A (en) * | 2005-04-28 | 2006-11-09 | Citizen Electronics Co Ltd | Light emitting diode |
-
1983
- 1983-09-14 JP JP14256383U patent/JPS6049662U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310505A (en) * | 2005-04-28 | 2006-11-09 | Citizen Electronics Co Ltd | Light emitting diode |
| JP4681343B2 (en) * | 2005-04-28 | 2011-05-11 | シチズン電子株式会社 | Manufacturing method of light emitting diode |
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