JPS57103348A - Semiconductor memory device - Google Patents
Semiconductor memory deviceInfo
- Publication number
- JPS57103348A JPS57103348A JP17932380A JP17932380A JPS57103348A JP S57103348 A JPS57103348 A JP S57103348A JP 17932380 A JP17932380 A JP 17932380A JP 17932380 A JP17932380 A JP 17932380A JP S57103348 A JPS57103348 A JP S57103348A
- Authority
- JP
- Japan
- Prior art keywords
- fet
- substrate
- film
- channel
- oxidized film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Abstract
PURPOSE:To lower the writing voltage of a PROM cell and to improve the reproducibility by breaking a thin insulating film interosed between one of reverse conductive type source and drain regions formed in a substrate and a wire. CONSTITUTION:B ions are implanted, for example, in a channel region to form an FET having n-channel E-mode of 1V of threshold value, and contacting holes 11-13 are respectively opened at source, gate and drain regions 2, 5, 3. After approx. 100Angstrom of a thermally oxidized film is formed in the contacting holes, it is photoetched to remain only with the oxidized film 14 on the source region, aluminum electrodes 15-17 are then formed to form cell FET. The writing is performed in the stae of VD=10V, VS=0V and with the substrate grounded by varying VG to conduct or interrupt the channel. For example, when VG= 10V is set, the VD is set to the oxidized film 14 to break the insulation, so that the cell becomes normal FET. When the VG=0 is set, the VD reversely biases the junction between the drain 3 and the substrate 1, but the film 14 is not broken.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17932380A JPS57103348A (en) | 1980-12-18 | 1980-12-18 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17932380A JPS57103348A (en) | 1980-12-18 | 1980-12-18 | Semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57103348A true JPS57103348A (en) | 1982-06-26 |
JPH049388B2 JPH049388B2 (en) | 1992-02-20 |
Family
ID=16063820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17932380A Granted JPS57103348A (en) | 1980-12-18 | 1980-12-18 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57103348A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213638A2 (en) * | 1985-09-04 | 1987-03-11 | Fujitsu Limited | Programmable semiconductor read only memory device |
JP2014041991A (en) * | 2012-08-22 | 2014-03-06 | Sk Hynix Inc | Semiconductor element and manufacturing method of the same |
JP2016149551A (en) * | 2015-02-13 | 2016-08-18 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | Semiconductor structure having data storage structure and method of manufacturing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5691464A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Semiconductor device |
JPS5691466A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Selective writing possible semiconductor element |
-
1980
- 1980-12-18 JP JP17932380A patent/JPS57103348A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5691464A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Semiconductor device |
JPS5691466A (en) * | 1979-12-25 | 1981-07-24 | Fujitsu Ltd | Selective writing possible semiconductor element |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0213638A2 (en) * | 1985-09-04 | 1987-03-11 | Fujitsu Limited | Programmable semiconductor read only memory device |
JP2014041991A (en) * | 2012-08-22 | 2014-03-06 | Sk Hynix Inc | Semiconductor element and manufacturing method of the same |
JP2016149551A (en) * | 2015-02-13 | 2016-08-18 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | Semiconductor structure having data storage structure and method of manufacturing the same |
JP2018088544A (en) * | 2015-02-13 | 2018-06-07 | 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. | Semiconductor structure having data storage structure and manufacturing method thereof |
US10090360B2 (en) | 2015-02-13 | 2018-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a semiconductor structure including a plurality of trenches |
US10763305B2 (en) | 2015-02-13 | 2020-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with data storage structure |
US11653503B2 (en) | 2015-02-13 | 2023-05-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with data storage structure and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPH049388B2 (en) | 1992-02-20 |
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