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JPS559426A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS559426A
JPS559426A JP8201378A JP8201378A JPS559426A JP S559426 A JPS559426 A JP S559426A JP 8201378 A JP8201378 A JP 8201378A JP 8201378 A JP8201378 A JP 8201378A JP S559426 A JPS559426 A JP S559426A
Authority
JP
Japan
Prior art keywords
electrode
rectifier
substrate
expansion coefficient
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8201378A
Other languages
English (en)
Inventor
Masao Tsuruoka
Keiichi Morita
Hideyuki Yagi
Keiichi Kuniya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8201378A priority Critical patent/JPS559426A/ja
Publication of JPS559426A publication Critical patent/JPS559426A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/35Mechanical effects
    • H01L2924/351Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP8201378A 1978-07-07 1978-07-07 Semiconductor device Pending JPS559426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8201378A JPS559426A (en) 1978-07-07 1978-07-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8201378A JPS559426A (en) 1978-07-07 1978-07-07 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS559426A true JPS559426A (en) 1980-01-23

Family

ID=13762626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8201378A Pending JPS559426A (en) 1978-07-07 1978-07-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS559426A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130121664A (ko) 2010-10-25 2013-11-06 엔지케이 인슐레이터 엘티디 세라믹스 재료, 반도체 제조 장치용 부재, 스퍼터링 타겟 부재 및 세라믹스 재료의 제조 방법
KR20140035834A (ko) 2012-09-14 2014-03-24 엔지케이 인슐레이터 엘티디 적층 구조체, 반도체 제조 장치용 부재 및 적층 구조체의 제조 방법
KR20140077910A (ko) 2011-10-11 2014-06-24 엔지케이 인슐레이터 엘티디 세라믹스 부재, 반도체 제조 장치용 부재 및 세라믹스 부재의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130121664A (ko) 2010-10-25 2013-11-06 엔지케이 인슐레이터 엘티디 세라믹스 재료, 반도체 제조 장치용 부재, 스퍼터링 타겟 부재 및 세라믹스 재료의 제조 방법
KR20140077910A (ko) 2011-10-11 2014-06-24 엔지케이 인슐레이터 엘티디 세라믹스 부재, 반도체 제조 장치용 부재 및 세라믹스 부재의 제조 방법
KR20140035834A (ko) 2012-09-14 2014-03-24 엔지케이 인슐레이터 엘티디 적층 구조체, 반도체 제조 장치용 부재 및 적층 구조체의 제조 방법

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