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JPS52131455A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52131455A
JPS52131455A JP4765876A JP4765876A JPS52131455A JP S52131455 A JPS52131455 A JP S52131455A JP 4765876 A JP4765876 A JP 4765876A JP 4765876 A JP4765876 A JP 4765876A JP S52131455 A JPS52131455 A JP S52131455A
Authority
JP
Japan
Prior art keywords
semiconductor device
protection film
junction
onto
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4765876A
Other languages
Japanese (ja)
Other versions
JPS5937576B2 (en
Inventor
Hiroshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4765876A priority Critical patent/JPS5937576B2/en
Publication of JPS52131455A publication Critical patent/JPS52131455A/en
Publication of JPS5937576B2 publication Critical patent/JPS5937576B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent the load of junction time from affecting the protection film and thus to avoid cracks, by forming the junction pad directly onto the heat oxidation film not onto the protection film which contains the area formed on the wiring layer.
COPYRIGHT: (C)1977,JPO&Japio
JP4765876A 1976-04-28 1976-04-28 semiconductor equipment Expired JPS5937576B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4765876A JPS5937576B2 (en) 1976-04-28 1976-04-28 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4765876A JPS5937576B2 (en) 1976-04-28 1976-04-28 semiconductor equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP59089446A Division JPS59218761A (en) 1984-05-07 1984-05-07 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS52131455A true JPS52131455A (en) 1977-11-04
JPS5937576B2 JPS5937576B2 (en) 1984-09-11

Family

ID=12781344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4765876A Expired JPS5937576B2 (en) 1976-04-28 1976-04-28 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5937576B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472958A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Electrode structure of semiconductor device
JPS54117680A (en) * 1978-03-03 1979-09-12 Nec Corp Semiconductor device
JPS5984551A (en) * 1982-11-08 1984-05-16 Nec Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472958A (en) * 1977-11-24 1979-06-11 Hitachi Ltd Electrode structure of semiconductor device
JPS54117680A (en) * 1978-03-03 1979-09-12 Nec Corp Semiconductor device
JPS6125221B2 (en) * 1978-03-03 1986-06-14 Nippon Electric Co
JPS5984551A (en) * 1982-11-08 1984-05-16 Nec Corp Semiconductor device
JPS6362105B2 (en) * 1982-11-08 1988-12-01

Also Published As

Publication number Publication date
JPS5937576B2 (en) 1984-09-11

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