JPH02261830A - Prepreg and low dielectric property laminates - Google Patents
Prepreg and low dielectric property laminatesInfo
- Publication number
- JPH02261830A JPH02261830A JP1082888A JP8288889A JPH02261830A JP H02261830 A JPH02261830 A JP H02261830A JP 1082888 A JP1082888 A JP 1082888A JP 8288889 A JP8288889 A JP 8288889A JP H02261830 A JPH02261830 A JP H02261830A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- impregnated
- laminate
- low dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/034—Organic insulating material consisting of one material containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、通信機器、衛星放送、機器、電子計算機等に
用いられるプリント回路板に使用する低誘電特性積層板
に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a low dielectric property laminate used in printed circuit boards used in communication equipment, satellite broadcasting, appliances, electronic computers, and the like.
〈従来技術及び発明が解決しようとする課題〉従来、高
周波電流を取り扱うプリント回路用基板材料として、ガ
ラス布に4フッ化エチレン樹脂(PTFE)を含浸した
プリプレグを複数枚重ね、両面に銅箔を配したいわゆる
フッ素樹脂積層板が用いられているが、PTFE樹脂と
銅箔との密着性が十分でないため、銅箔のピーリング強
度が弱いという問題点があった。<Prior art and problems to be solved by the invention> Conventionally, as a board material for printed circuits that handle high-frequency current, multiple sheets of prepreg made of glass cloth impregnated with polytetrafluoroethylene resin (PTFE) were stacked and copper foil was applied on both sides. Although a so-called fluororesin laminate is used, there is a problem in that the peeling strength of the copper foil is weak because the adhesion between the PTFE resin and the copper foil is insufficient.
この問題を解決するため、特開昭63−47136号公
報に記載されている様に、従来基材に4フッ化エチレン
樹脂(PTFE、融点327°C)を含浸した後、4フ
ッ化エチレン−6フソ化プロピレン共重合樹脂(FEP
、融点270°C)を含浸させて作ったプリプレグを必
要枚数、特定温度で積層成形した積層板がある。In order to solve this problem, as described in Japanese Patent Application Laid-open No. 63-47136, conventionally, after impregnating a base material with tetrafluoroethylene resin (PTFE, melting point 327°C), 6-fluorinated propylene copolymer resin (FEP
There is a laminate made by laminating and molding the required number of prepregs impregnated with 270°C (melting point 270°C) at a specific temperature.
しかしながら、FEPは融点がPTFEより約57°C
も低く、PTFHの高い耐熱特性を損うという問題点が
あった。However, FEP has a melting point of about 57°C higher than that of PTFE.
There was a problem that the high heat resistance properties of PTFH were impaired.
また、最外層に金属箔を設置する場合、金属箔の裏側に
接着剤を塗布したり、接着フィルムとして、FEPフィ
ルムを使用して積層成形する方法も行われているが、同
様の問題点があり、積層板使用雰囲気がFEPの融点近
傍の場合、眉間剥離しやすかった。In addition, when installing metal foil as the outermost layer, there are methods in which adhesive is applied to the back side of the metal foil or laminated molding is performed using FEP film as an adhesive film, but similar problems arise. Yes, when the atmosphere in which the laminate was used was near the melting point of FEP, it was easy to peel between the eyebrows.
本発明は、使用時の雰囲気下でも積層板間の接着強度を
強くし、眉間剥離を少なくし、金属箔とプリプレグの眉
間に接着剤を使用しない積N仮とプリプレグを提供する
ことを目的としている。The purpose of the present invention is to provide a multilayer prepreg that strengthens the adhesive strength between the laminates even in the atmosphere during use, reduces glabella peeling, and does not require adhesive between the metal foil and the prepreg. There is.
〈課題を解決するための手段〉
上記課題を解決するために、本発明においてはガラス布
基材に4フッ化エチレンパーフロロアルキルビニルエー
テル共重合体樹脂を含浸したプリプレグ又は、ガラス布
基材に47フ化エチレン樹脂を数回含浸した後、最外層
に4フッ化エチレンパーフロロアルキルビニルエーテル
共重合体樹脂を含浸して成るプリプレグを開発し、ガラ
ス布基材に4フッ化エチレン樹脂を含浸したプリプレグ
を必要枚数重ね、両面に上記プリプレグの内の一方を、
1枚以上重ね最外層に金属箔を配置し、積層成形してな
る低誘電特性積層板又は、上記のプリプレグの一方を複
数枚重ね、最外層に金属箔を配置し、積層成形してなる
低誘電特性積層板により解決し得たものである。<Means for Solving the Problems> In order to solve the above problems, the present invention uses a prepreg in which a glass cloth base material is impregnated with a tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin, or a glass cloth base material is impregnated with 47% After impregnating fluoroethylene resin several times, we have developed a prepreg in which the outermost layer is impregnated with tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin, and we have developed a prepreg in which a glass cloth base material is impregnated with tetrafluoroethylene resin. Stack the required number of prepregs and place one of the above prepregs on both sides,
A low dielectric laminate made by laminating one or more sheets of prepreg with metal foil placed on the outermost layer and laminated, or a low dielectric laminate made by laminating multiple sheets of one of the above prepregs and placing metal foil on the outermost layer and laminated and molded. This problem could be solved by using a dielectric laminate.
図面に従って本発明の内容を詳細に説明する。The contents of the present invention will be explained in detail according to the drawings.
第1図、第2図は本発明のプリプレグの断面を示す、第
1図のプリプレグは、基材1の両面に47フ化エチレン
樹脂(PTFE)層2を、さらにそノ両面に4フッ化エ
チレンパーフロロアルキルビニルエーテル共重合体樹脂
(PFA、融点310’C)層3を設けて成るものであ
る。ここで、基材1として通常は電気特性の良いEガラ
ス布が使用され、4フッ化エチレン樹脂(PTFE)I
’!2は4フフ化エチレン樹脂水性デイスバージヨンの
含浸と焼成を数回繰り返して作られたものである。FIGS. 1 and 2 show cross sections of the prepreg of the present invention. The prepreg in FIG. A layer 3 of ethylene perfluoroalkyl vinyl ether copolymer resin (PFA, melting point 310'C) is provided. Here, E glass cloth with good electrical properties is usually used as the base material 1, and tetrafluoroethylene resin (PTFE) I
'! No. 2 was made by repeating impregnation and firing several times with an aqueous dispersion of tetrafluoroethylene resin.
さらに、PFA1i3は4フッ化エチレンパーフロロア
ルキルビニルエーテル共重合体樹脂(PFA。Furthermore, PFA1i3 is a tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin (PFA).
融点310’C)水性ディスバージョンを含浸焼成して
作成する。Melting point: 310'C) Aqueous dispersion is impregnated and fired.
第2図のプリプレグにおいては、基材1の両面にPFA
層3を設けたものである。基材1は第1図と同しEガラ
ス布であり、その基材1にPFA樹脂デイバージョンの
含浸と焼成を数回繰り返してPFA層3を作りプリプレ
グを作成する。In the prepreg shown in Fig. 2, PFA is applied to both sides of the base material 1.
Layer 3 is provided. The base material 1 is the same E glass cloth as in FIG. 1, and the base material 1 is impregnated with a PFA resin diversion and fired several times to form a PFA layer 3 and a prepreg.
また、第3図〜第6図は、第1図、第2図に示したプリ
プレグを用いた低誘電特性積N板の断面を示す。低誘電
特性積層板とは、PTFE樹脂のみを含浸して作ったプ
リプレグ(図示せず)を必要枚数重ね、その両側に第1
図又は第2図に示したプリプレグを重ね、さらに最外層
に金属箔を置き加熱加圧成形してなる比誘電率と誘電正
接の小さな積層板である。Further, FIGS. 3 to 6 show cross sections of a low dielectric characteristic product N plate using the prepreg shown in FIGS. 1 and 2. A low dielectric property laminate is made by stacking the required number of prepregs (not shown) made by impregnating only PTFE resin, and placing a first layer on both sides.
This is a laminate with a small dielectric constant and dielectric loss tangent, which is obtained by stacking the prepregs shown in the figure or FIG.
第3図はPTFE樹脂含浸プリプレグ4の両側に第1図
で示したプリプレグ5を積層し、さらにその両側に金属
箔6を設けて成る低誘電特性積層板を示す0通常、金属
箔は、銅、アルミ等から成る。第4図はPTFE樹脂含
浸プリプレグ4の両側に第2図で示したプリプレグ7を
積層し、さらにその両側に金属箔6を設けて成る低誘電
特性積層板を示す、第5図は第1図で示したプリプレグ
5の両側に金属箔6を設けて成る低誘電特性積層板を示
し、第6図は第2図で示したプリプレグ7の両側に金属
箔6を設けて成る低誘電特性積層板を示す。FIG. 3 shows a laminate with low dielectric properties, which is made by laminating the prepregs 5 shown in FIG. , aluminum, etc. FIG. 4 shows a low dielectric property laminate in which prepregs 7 shown in FIG. 2 are laminated on both sides of a PTFE resin-impregnated prepreg 4, and metal foils 6 are further provided on both sides. FIG. 6 shows a low dielectric property laminate formed by providing metal foils 6 on both sides of the prepreg 5 shown in FIG. shows.
PFA樹脂は銅箔とPTFE樹脂とのいずれとも親和性
が良く、しかも融点が302〜310°Cと高いため、
製品の耐熱性を損なうことなく銅箔ピーリング強度の高
い積層板が得られる。PFA resin has good affinity with both copper foil and PTFE resin, and has a high melting point of 302-310°C, so
A laminate with high copper foil peeling strength can be obtained without impairing the heat resistance of the product.
〈実施例1〉
Eガラス布(株式会社有沢製作所製、1080A)に4
フッ化エチレン樹脂(PTFE)水性ディスバージラン
(旭硝子株式会社製5フルオンAD1)の含浸、焼成(
350°C110分)を数回繰り返した後、4フッ化エ
チレンパーフロロアルキルビニルエーテル共重合体…脂
(PFA)水性ディスバージョン(ダイキン工業株式会
社製、AI)−20R)を含浸、焼成(395°C11
5分)して樹脂含浸率70%のPTFE、PFA樹脂含
浸プリプレグを得た。<Example 1> E-glass cloth (manufactured by Arisawa Seisakusho Co., Ltd., 1080A) with 4
Impregnation and calcination of fluorinated ethylene resin (PTFE) aqueous disvergylan (5 Fluon AD1 manufactured by Asahi Glass Co., Ltd.)
350°C for 110 minutes) several times, then impregnated with a tetrafluoroethylene perfluoroalkyl vinyl ether copolymer (PFA) aqueous dispersion (manufactured by Daikin Industries, Ltd., AI)-20R) and fired (395°C). C11
5 minutes) to obtain a PTFE and PFA resin-impregnated prepreg with a resin impregnation rate of 70%.
〈実施例2〉
実施例1のガラス布に実施例1のPFA樹脂ディスバー
ジョンの含浸、焼成(395°c、is分)を数回繰り
返して樹脂含浸量70%のPFA樹脂含浸プリプレグを
得た。<Example 2> Impregnation of the glass cloth of Example 1 with the PFA resin dispersion of Example 1 and baking (395°C, IS minutes) were repeated several times to obtain a PFA resin-impregnated prepreg with a resin impregnation amount of 70%. .
〈実施例3〉
実施例1に使用したガラス布に実施例1のPTFE樹脂
ディスバージョンの含浸、焼成(350°C110分)
を数回繰り返して樹脂含浸率70%のPTFE樹脂含浸
プリプレグを得た。<Example 3> The glass cloth used in Example 1 was impregnated with the PTFE resin dispersion of Example 1 and baked (350°C, 110 minutes)
This was repeated several times to obtain a PTFE resin-impregnated prepreg with a resin impregnation rate of 70%.
〈実施例4〉
実施例3のPTFE樹脂含浸プリプレグを8枚重ね、表
裏に実施例1のPTFE、PFA樹脂含浸プリプレグを
置き、さらに、最外層に銅箔(厚み35μm1日本鉱業
株式会社製、JTC箔)を置き、370’C,30kg
f/cd、 60分間加熱加圧成形して厚み0.8mm
の積層板を得た。<Example 4> Eight sheets of the PTFE resin-impregnated prepreg of Example 3 were stacked, and the PTFE and PFA resin-impregnated prepreg of Example 1 were placed on the front and back sides, and the outermost layer was coated with copper foil (thickness 35 μm 1 made by Nippon Mining Co., Ltd., JTC). foil), 370'C, 30kg
f/cd, heat and pressure molded for 60 minutes to a thickness of 0.8mm
A laminate was obtained.
〈実施例5〉
実施例3のPTFE樹脂含浸プリプレグを8枚重ね、表
裏に実施例2のPFA樹脂含浸プリプレグを置き、さら
に、最外層に実施例4の銅箔を置き、実施例4の条件で
加熱加圧成形して厚み0.811mの積層板を得た。<Example 5> Eight sheets of the PTFE resin-impregnated prepreg of Example 3 were stacked, the PFA resin-impregnated prepreg of Example 2 was placed on the front and back sides, the copper foil of Example 4 was placed on the outermost layer, and the conditions of Example 4 were applied. A laminate with a thickness of 0.811 m was obtained by heat-pressing molding.
〈実施例6〉
実施例1のPTFE、PFA樹脂含浸プリプレグを10
枚重ね、表裏に実施例4の銅箔を置き、実施例4の条件
で加熱加圧成形して厚み0.8mmの積層板を得た。<Example 6> PTFE and PFA resin impregnated prepreg of Example 1 were
The sheets were stacked, the copper foil of Example 4 was placed on the front and back sides, and the sheets were heated and pressed under the conditions of Example 4 to obtain a laminate with a thickness of 0.8 mm.
〈実施例7〉
実施例2のPFA樹脂含浸プリプレグを10枚重ね、表
裏に実施例4の銅箔を置き、実施例4の条件で加熱加圧
成形して厚み0.8mmの積層板を得た。<Example 7> 10 sheets of the PFA resin-impregnated prepreg of Example 2 were stacked, the copper foil of Example 4 was placed on the front and back sides, and the material was heated and pressed under the conditions of Example 4 to obtain a laminate with a thickness of 0.8 mm. Ta.
く比較例1〉
実施例3のPTFE樹脂含浸プリプレグを10枚重ね、
表裏にPFA#IJ脂フィルム(厚み25μm。Comparative Example 1> Ten sheets of PTFE resin-impregnated prepreg of Example 3 were stacked,
PFA #IJ resin film (thickness 25 μm) on the front and back sides.
ダイキン工業株式会社製)を置き、さらに、最外層に実
施例4の銅箔を置き、実施例4の条件で加熱加圧成形し
て厚み0.8tgmの積層板を得た。Furthermore, the copper foil of Example 4 was placed on the outermost layer and molded under heat and pressure under the conditions of Example 4 to obtain a laminate having a thickness of 0.8 tgm.
〈発明の効果〉
実施例4〜7までの積層板の比誘電率、誘電正接及び銅
箔引きはがし強さ及びパンチング加工性は表1に示した
通りであり、いずれも良好であった。また、銅箔接着フ
ィルムを使わないので、製造工程を簡略化することがで
きる等の効果がある。<Effects of the Invention> The relative permittivity, dielectric loss tangent, copper foil peeling strength, and punching processability of the laminates of Examples 4 to 7 are as shown in Table 1, and all were good. Furthermore, since a copper foil adhesive film is not used, the manufacturing process can be simplified.
表1 積層板の緒特性Table 1 Laminate properties
図面は本発明の実施例を示すものであって、第1図は基
材に42ノ化エチレン樹脂(PTFE)と4フッ化工チ
リンバーフロロアルキルビニルエーテル共重合体樹脂(
PFA)を含浸したプリプレグを示す断面図、第2図は
基材に4フッ化エチレンパーフロロアルキルビニルエー
テル共重合樹脂を含浸したプリプレグを示す断面図、第
3図はPTFE樹脂含浸プリプレグとPTFE PF
A樹脂含浸プリプレグを使用した積層板を示す断面図で
ある。 第4図はPTFE樹脂含浸プリプレグとPFA
樹脂含浸プリプレグを使用した積層板を示す断面図、第
5図はPTFE、PFA樹脂含浸プリプレグを使用した
積層板を示す断面図、第6図はPFA樹脂含浸プリプレ
グを使用した積層板を示す断面図である。
1・・基材
2・・4フッ化エチレン’IA BFj (P T F
E ) N3・・4フッ化エチレンパ7フロロアルキ
ルビニルエーテル共重合体樹脂層
・PTFE樹脂含浸プリプレグ
・第1図で示したプリプレグ
・金属箔
・第2図で示したプリプレグ
特
許 出 願 人
凸版印刷株式会社
代表者 鈴木和夫
第1図
化2図
第3図The drawings show examples of the present invention, and FIG. 1 shows a base material containing 42-fluorinated ethylene resin (PTFE) and 4-fluorinated trifluoroethylene bar fluoroalkyl vinyl ether copolymer resin (
Figure 2 is a cross-sectional view showing a prepreg impregnated with PTFE resin (PFA), Figure 2 is a cross-sectional view showing a prepreg with a base material impregnated with tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin, Figure 3 is a PTFE resin-impregnated prepreg and PTFE PF.
FIG. 2 is a cross-sectional view showing a laminate using A resin-impregnated prepreg. Figure 4 shows PTFE resin impregnated prepreg and PFA
5 is a sectional view showing a laminate using resin-impregnated prepreg, FIG. 5 is a sectional view showing a laminate using PTFE and PFA resin-impregnated prepreg, and FIG. 6 is a sectional view showing a laminate using PFA resin-impregnated prepreg. It is. 1. Base material 2.. Tetrafluoroethylene 'IA BFj (P T F
E) N3... Tetrafluoroethylene par-7 fluoroalkyl vinyl ether copolymer resin layer - PTFE resin impregnated prepreg - Prepreg shown in Figure 1 - Metal foil - Prepreg shown in Figure 2 Patent Applicant: Toppan Printing Co., Ltd. Representative Kazuo Suzuki Diagram 1 Diagram 2 Diagram 3
Claims (4)
キルビニルエーテル共重合体樹脂を含浸したプリプレグ
。(1) A prepreg in which a glass cloth base material is impregnated with a tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin.
した後、最外層に4フッ化エチレンパーフロロアルキル
ビニルエーテル共重合体樹脂を含浸して成るプリプレグ
。(2) A prepreg obtained by impregnating a glass cloth base material several times with a tetrafluoroethylene resin, and then impregnating the outermost layer with a tetrafluoroethylene perfluoroalkyl vinyl ether copolymer resin.
プリプレグを必要枚数重ね、両面に第1項又は第2項記
載のプリプレグの一方を、1枚以上重ね最外層に金属箔
を配置し、積層成形してなることを特徴とする低誘電特
性積層板。(3) Pile the necessary number of prepregs impregnated with tetrafluoroethylene resin on a glass cloth base material, and place one or more sheets of the prepreg described in item 1 or 2 on both sides, and place metal foil on the outermost layer. A laminate with low dielectric properties characterized by being formed by lamination molding.
枚重ね、最外層に金属箔を配置し、積層成形してなるこ
とを特徴とする低誘電特性積層板。(4) A laminate with low dielectric properties, which is obtained by stacking a plurality of prepregs according to item 1 or item 2, placing a metal foil on the outermost layer, and laminating and molding the same.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1082888A JPH02261830A (en) | 1989-03-31 | 1989-03-31 | Prepreg and low dielectric property laminates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1082888A JPH02261830A (en) | 1989-03-31 | 1989-03-31 | Prepreg and low dielectric property laminates |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02261830A true JPH02261830A (en) | 1990-10-24 |
Family
ID=13786811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1082888A Pending JPH02261830A (en) | 1989-03-31 | 1989-03-31 | Prepreg and low dielectric property laminates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02261830A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087000A (en) * | 1997-12-18 | 2000-07-11 | Ppg Industries Ohio, Inc. | Coated fiber strands, composites and cables including the same and related methods |
US6238791B1 (en) | 1997-12-18 | 2001-05-29 | Ppg Industries Ohio, Inc. | Coated glass fibers, composites and methods related thereto |
WO2007024837A3 (en) * | 2005-08-24 | 2007-07-26 | Mitsui Du Pont Fluorchemical | Fluoropolymer-glass fabric for circuit substrates |
EP1946921A1 (en) | 2007-01-20 | 2008-07-23 | Xiu-Feng Dong | Fluoroplastic composite product and manufacturing method thereof |
CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
CN102167873A (en) * | 2011-03-03 | 2011-08-31 | 吴江市东风电子有限公司 | Impregnation liquid used in copper clad plate preparation process |
CN108966534A (en) * | 2017-05-24 | 2018-12-07 | 台燿科技股份有限公司 | Method for manufacturing metal foil laminated plate and application thereof |
-
1989
- 1989-03-31 JP JP1082888A patent/JPH02261830A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087000A (en) * | 1997-12-18 | 2000-07-11 | Ppg Industries Ohio, Inc. | Coated fiber strands, composites and cables including the same and related methods |
US6238791B1 (en) | 1997-12-18 | 2001-05-29 | Ppg Industries Ohio, Inc. | Coated glass fibers, composites and methods related thereto |
WO2007024837A3 (en) * | 2005-08-24 | 2007-07-26 | Mitsui Du Pont Fluorchemical | Fluoropolymer-glass fabric for circuit substrates |
US7439200B2 (en) | 2005-08-24 | 2008-10-21 | Dupont-Mitsui Fluorochemicals Co. Ltd. | Fluoropolymer-glass fabric for circuit substrates |
EP1946921A1 (en) | 2007-01-20 | 2008-07-23 | Xiu-Feng Dong | Fluoroplastic composite product and manufacturing method thereof |
CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
CN102167873A (en) * | 2011-03-03 | 2011-08-31 | 吴江市东风电子有限公司 | Impregnation liquid used in copper clad plate preparation process |
CN102114453B (en) * | 2011-03-03 | 2016-05-04 | 吴江市东风电子有限公司 | A kind of preparation method who prepares copper-clad plate dielectric cloth |
CN108966534A (en) * | 2017-05-24 | 2018-12-07 | 台燿科技股份有限公司 | Method for manufacturing metal foil laminated plate and application thereof |
CN108966534B (en) * | 2017-05-24 | 2020-09-29 | 台燿科技股份有限公司 | Manufacturing method and application of metal foil laminate |
US11529797B2 (en) | 2017-05-24 | 2022-12-20 | Taiwan Union Technology Corporation | Method of manufacturing metal-clad laminate and uses of the same |
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