JPS60257594A - Multilayer printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a multilayer printed wiring board used in electrical equipment, electronic equipment, computers, etc.

[Background technology]

Conventionally, in multilayer printed wiring boards, a thermosetting resin such as epoxy resin, phenol resin, unsaturated resin, or polyester M resin is applied to the upper and/or lower surfaces of the inner layer material on which the circuit is formed using glass cloth, glass non-sacrificial cloth, or glass vapor. It is obtained by disposing the required number of resin-impregnated base materials, and then disposing and integrating an outer layer or material such as a single-sided metal-clad laminate or metal foil. There were problems with poor dimensional stability, smear resistance during drilling, and poor peel-off resistance when hot.

[Purpose of the invention]

The objectives of the present invention are high frequency characteristics (1) dimensional stability;
It is an object of the present invention to provide a multilayer printed wiring board that has excellent smear resistance when opening a tri-V hole and excellent P-V property when heated.

[Disclosure of the invention]

In the present invention, an outer layer material is disposed on the upper surface and/or lower surface of an inner layer material having a circuit through a plurality of adhesive fluororesin layers having different melting points, or after the inner layer material is further disposed, a plurality of adhesive fluororesin layers having different melting points are disposed on the upper surface and/or lower surface of an inner layer material having a circuit. This is a multilayer printed wiring board characterized by the outer layer material being placed and integrated by repeating the process of inserting the resin layer a required number of times, making it possible to take advantage of the excellent high-frequency properties of fluorine-based resin, and also being thermoplastic. Therefore, dimensional stability is improved, and by utilizing the excellent heat resistance of fluororesin, smear resistance and peak resistance under heat can be improved.Moldability is also improved by using multiple fluororesins with different melting points. The present invention will now be described in detail.

As the inner layer material having a circuit used in the present invention, either a single-sided circuit inner layer material or a double-sided circuit inner layer material can be used,
Further, by disposing an inner layer material on which a circuit is formed on the circuit forming side of the inner layer material via a required number of adhesive fluororesin layers, a printed wiring board with even more layers can be obtained. As the adhesive fluororesin layer, a resin sheet, a resin film, a resin-impregnated base material, etc. can be used in any combination, and examples of the fluororesin include tetrafluoroethylene resin, tetrafluoroethylene perfluorovinyl V-ete V1. All fluororesins such as copolymer, tetrafluoroethylene hexafluoropropylene 1 copolymer, tetrafluoroethylene ethylene copolymer, etc. can be used, but it is necessary to use a combination of multiple fluororesins with different melting points. The difference in melting point is preferably within 40' to minimize the influence on the circuit and eliminate residual bubbles.

The base material may be glass, inorganic fabrics such as asbestos [6°, polyester, polyamide, polyvinyl V alcohol 1v, woven fabrics made of organic synthetic fibers such as polyacrylic, natural fibers such as cotton, nonwoven fabrics, mats, cheesecloth, paper, or Among these combination base materials, it is preferable to use glass cloth, which has excellent dimensional stability. As the outer layer material, a single-sided metal-clad laminate or a metal foil made of copper, aluminum, stainless steel, brass, iron, nickel, etc. alone or made of an alloy is used. Regarding the adhesive fluororesin layer, it is preferable that the layer in contact with the circuit portion and the metal foil be a fluororesin film M.

Although there are no particular limitations on the integration means, it is preferable to use a lamination heating and pressing method.

The present invention will be explained below using examples.

Example A 0.1-thick silk tetrafluoride ethylene perf V orovinyl ether copolymer buoy was placed on the top and bottom of the inner layer material consisting of a 0.8 nm thick fluororesin glass laminate plate with circuits formed on both sides. Rem (manufactured by Daikin Industries, Ltd., trade name NEOFLON, melting point 302-310°C) between two sheets with a thickness of 0.1 fl
Thickness of 0.0351! is sandwiched between one sheet of polytetrafluoroethylene resin film (manufactured by Daikin Industries, Ltd., trade name: Polyflon, melting point: 327°C) through adhesive fluororesin layers. Il
Copper foil of 1 is arranged respectively and 6 at 400℃, 4oK+q/d.
A multilayer printed wiring board was obtained by laminating and heating molding for 0 minutes.

A laminate in which three sheets of epoxy resin-impregnated glass cloth with a thickness of 0.1 lff are placed on the top and bottom surfaces of the same inner layer material as in the conventional example, and a copper foil with a thickness of 0.035 ff is placed on the outermost layer. 170
A multilayer printed wiring board was obtained by laminating and heating molding at 50 tL/d at 50°C for 90 minutes.

〔Effect of the invention〕

High frequency characteristics of the multilayer printed wiring board of the example and the conventional example,
As is clear from Table 1, the performance of the multi-printed wiring board of the present invention was good in terms of dimensional stability, smear resistance, and heat peelability, confirming the superiority of the present invention.

Claims (2)

[Claims] (1) Arrange the outer layer material on the upper and/or lower surface of the inner layer material having a circuit via a plurality of adhesive fluororesin layers with different melting points, or further arrange the inner layer material and then bond the inner layer material with a plurality of different melting points. A multilayer printed wiring board characterized in that an outer layer material is arranged and integrated by repeating the process a required number of times through a fluororesin layer. (2) The multilayer printed wiring board according to claim 1, wherein the fluororesin layer for adhesion to the circuit portion and the metal foil is a fluororesin film.