JPS63173638A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPS63173638A JPS63173638A JP639187A JP639187A JPS63173638A JP S63173638 A JPS63173638 A JP S63173638A JP 639187 A JP639187 A JP 639187A JP 639187 A JP639187 A JP 639187A JP S63173638 A JPS63173638 A JP S63173638A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- laminate
- resin layer
- point resin
- multilayer board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 238000002844 melting Methods 0.000 claims description 33
- 230000008018 melting Effects 0.000 claims description 33
- 238000010030 laminating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 37
- 238000000465 moulding Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 210000004709 eyebrow Anatomy 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical compound FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［技術分野］
本発明は多層プリント配線板用の多層板のボンディング
シートとして使用する積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a laminate used as a bonding sheet for a multilayer board for a multilayer printed wiring board.
［背景技術１
従来上り、複数の樹脂層を８！層して形成された積層板
をボンディングシートとして多層プリント配線板用の多
層板が形成されているが、この場合の積層板の融点が低
いと積層成形に際して層間の位置ずれが生じ、しかも得
られた多層板の眉間の接着性は優れているものの、寸法
安定性に乏しいＬめで木−か−一力、積層所の融σが高
いと層間の位置ずれが抑制でき、寸法安定性にも優れる
ものの、眉間の接着性が悪く、信頼性の劣ったものであ
った。[Background technology 1 Conventionally, multiple resin layers are formed into 8! A multilayer board for a multilayer printed wiring board is formed by using the laminated board formed by stacking the layers as a bonding sheet, but if the melting point of the laminate in this case is low, misalignment between the layers will occur during lamination molding, and furthermore, the obtained Although the adhesion between the eyebrows of the multilayer board is excellent, it has poor dimensional stability.If the melting point of the laminated board is high, the misalignment between the layers can be suppressed and the dimensional stability is also excellent. However, the adhesion between the eyebrows was poor and the reliability was poor.
［発明の目的］
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、多層板の成形に際して、眉間のずれ
がなく、しかも層間接着性が良好で、寸法安定性に優れ
た多層板を製造できる積層板を提供することにある。[Objective of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to provide a multilayer board with no misalignment between the eyebrows, good interlayer adhesion, and dimensional stability. It is an object of the present invention to provide a laminate board that can produce a multilayer board with excellent properties.
［発明の開示］
本発明の積層板は、複数の樹脂層を積層して形成された
積層板であって、高融点樹脂／１１の少なくとも片面に
低融点樹脂層２が積層されて成るものであり、この構成
により上記目的が達成されたものである。 Ｊｌｌｌち
、積Ｉｌｌ成形により多層板を製造するに際して低融、
α樹脂層［２だけが融解する温度で成形することにより
、この低融点樹脂層２により層間の接着性を確保でき、
又、高融点樹脂層１により眉間の位置ずれを防止できる
と共に寸法安定性にも優れるものである。[Disclosure of the Invention] The laminate of the present invention is a laminate formed by laminating a plurality of resin layers, in which a low melting point resin layer 2 is laminated on at least one side of a high melting point resin /11. This configuration achieves the above objective. When manufacturing multilayer boards by lamination molding, low melting
By molding at a temperature where only the α resin layer [2] melts, this low melting point resin layer 2 can ensure interlayer adhesion,
Furthermore, the high melting point resin layer 1 can prevent misalignment of the glabella and also has excellent dimensional stability.
以下本発明を添付の図面を参照して詳細に説明する６本
発明で用いる樹脂としては種々の熱可塑性樹脂を挙げる
ことができるが、誘電率が小さく、高周波特性が良好と
なる７７索樹脂が好ましい。The present invention will be explained below in detail with reference to the attached drawings.6 Although various thermoplastic resins can be mentioned as the resin used in the present invention, 77 resin has a low dielectric constant and good high frequency characteristics. preferable.
この、フッ素樹脂としては、三７フ化塩化エチレン樹脂
（ＣＴＦＥ、融点２１０〜２１２℃）、四７ツ化エチレ
ン樹脂（ＰＴＦＥ、融点３２０〜３３５°Ｃ）、四７ツ
化エチレンー六７フ化プロピレン共重合体樹脂（ＦＥＰ
、融点２６０〜２８０℃）、四７ツ化エチレンーパーフ
ルオロビニルエーテル共重合体樹脂（ＰＦ＾、融点３０
２〜３１０’Ｃ）、四７ツ化エチレンーエチレン共重合
体樹脂（ＥＴＦＥ、融点２６０〜２７０℃）などのよう
な融点が２００℃以上のものが好ましい。これら熱可塑
性樹脂を、例えばフィルム状に成形し、適宜組み合わせ
て高融点樹脂層１と低融点樹脂層２を形成する。例えば
、高融点樹脂層１としてＰＴＦＥフィルムを採用し、低
融点樹脂Ｎ２としてＦＥＰ フィルムを採用できる。This fluororesin includes tri7fluorochloroethylene resin (CTFE, melting point 210 to 212°C), tetra7fluoroethylene resin (PTFE, melting point 320 to 335°C), tetra7fluoroethylene-67fluoroethylene resin Propylene copolymer resin (FEP)
, melting point 260-280°C), tetra7tethylene-perfluorovinyl ether copolymer resin (PF^, melting point 30
Those having a melting point of 200°C or higher, such as tetra7tethylene-ethylene copolymer resin (ETFE, melting point 260-270°C), are preferable. These thermoplastic resins are formed into a film shape, for example, and combined as appropriate to form the high melting point resin layer 1 and the low melting point resin layer 2. For example, a PTFE film can be used as the high melting point resin layer 1, and an FEP film can be used as the low melting point resin N2.
勿論、これら樹脂層は熱可塑性樹脂フェスを紙、不織布
、ガラス不織布などに含浸させ乾燥させて形成したプリ
プレグから形成してもよい０本発明の積層板Ａは、高融
点及び低融点のフィルム又はプリプレグを積み重ね、こ
のものを−組みとして成形プレートを介して複数組み熱
盤間に配置し、２００℃以上、ＺＱ−１５０ｋｇ／ｃｍ
２．４０−１００分で加熱加圧して積層一体化させて製
造される。尚、積層成形に際して、フィルム又はプリプ
レグの両面に銅箔のような金属箔を配置し、成形後にエ
ツチングにより除去してもよい、又、高融点樹脂層１の
両面に低融点樹ｍ層２を設けてもよく、更に、高融点樹
脂層１側に補強のためにガラス基材を貼着させてもよい
、低融点樹脂層２は良好な接着性を確保するために厚み
が２５μ以上であるのが好ましく、一方熱変形を抑える
ためには厚みが１５０μ以下に形成するのが好ましい。Of course, these resin layers may be formed from a prepreg formed by impregnating paper, nonwoven fabric, glass nonwoven fabric, etc. with a thermoplastic resin face and drying it. Stack the prepregs and place them between multiple sets via forming plates between heating plates at 200℃ or higher and ZQ-150kg/cm.
2. Manufactured by heating and pressing for 40-100 minutes to integrate the layers. In addition, during lamination molding, metal foil such as copper foil may be placed on both sides of the film or prepreg and removed by etching after molding, or a low melting point resin layer 2 may be placed on both sides of the high melting point resin layer 1. Furthermore, a glass substrate may be attached to the high melting point resin layer 1 side for reinforcement.The low melting point resin layer 2 has a thickness of 25μ or more to ensure good adhesion. On the other hand, in order to suppress thermal deformation, the thickness is preferably 150 μm or less.
このようにして製造した本発明の積層板Ａは、例えば、
第１図に示すような高融点樹脂Ｎ１の両面に低融点樹脂
層２を設けたものを、第２図に示すように、両面に導体
パターン３を形成した内層材４間に配置し、内層材４と
外層用金属Ｍ５との間に絶縁接着層６を介在させて積層
一体化させて多層板７を形成し、外層用金属箔５から導
体パターンを形成し、スルーホールめっきを施して多層
プリント配線板が製造される。尚、内層材４の絶縁層も
高融点樹脂層であれば、更に寸法安定性が優れる。The laminate A of the present invention manufactured in this way is, for example,
A high melting point resin N1 with low melting point resin layers 2 on both sides as shown in FIG. 1 is placed between inner layer materials 4 having conductive patterns 3 on both sides as shown in FIG. An insulating adhesive layer 6 is interposed between the material 4 and the metal M5 for the outer layer, and the multilayer board 7 is formed by laminating the material 4 and the metal foil 5 for the outer layer.A conductor pattern is formed from the metal foil 5 for the outer layer, and through-hole plating is applied to form the multilayer board. A printed wiring board is manufactured. If the insulating layer of the inner layer material 4 is also a high melting point resin layer, the dimensional stability will be even better.
次に、本発明の詳細な説明する。Next, the present invention will be explained in detail.
（実施例１）
厚み２００μのＰＴＦＥ フィルム（日東電工（株）製
）の両面に厚み５０μのＦＥＰ フィルム（日東？４工
（株）製）を配置し、その両面に銅箔を配置し、温度３
８０℃で成形一体化させた後、銅箔をエツチング除去し
て積層板を得た。(Example 1) A 50μ thick FEP film (manufactured by Nitto Denko Corporation) was placed on both sides of a 200μ thick PTFE film (manufactured by Nitto Denko Corporation), copper foil was placed on both sides, and the temperature 3
After integral molding at 80° C., the copper foil was removed by etching to obtain a laminate.
この積層板をＰＴＦＩＪ）’／ラス基材に含浸させて形
成した厚み３００μの内層材間に配置し、３２０℃で接
着一体化させて多層板を形成し、寸法変化率を測定した
。結果を第１表に示す。This laminate was placed between 300 μm thick inner layer materials formed by impregnating a PTFIJ)'/lath base material, and was bonded and integrated at 320° C. to form a multilayer board, and the dimensional change rate was measured. The results are shown in Table 1.
（実施例２）
ＦＥＰ フィルム、の代わりにＰＦ八へィルムを使用し
た以外は実施例１と同様にして積層板を得た。(Example 2) A laminate was obtained in the same manner as in Example 1 except that PF Hachifilm was used instead of the FEP film.
この積層板から、３４０℃で接潰一体化させた以外は実
施例１と同様にして多層板を形成し、寸法変化率を測定
した。結果をｍｉｓに示す。A multilayer board was formed from this laminate in the same manner as in Example 1, except that it was integrated at 340° C., and the dimensional change rate was measured. The results are shown in mis.
（実施例３）
ガラスクロス（タイプ１０８、日東電工（株）製）にＰ
ＴＦＥディスパージョン（ダイキン工業（株）製）を含
浸させ乾燥させて形成した固形分含有量８０重１％のプ
リプレグ３枚を積み重ね、その両面に実施例１と同様の
ＦＥＰフィルムを配置し、更にその両面にｌｉ！ｆを配
置し、実施例１と同様にして積層板を得た。(Example 3) P on glass cloth (type 108, manufactured by Nitto Denko Corporation)
Three sheets of prepreg with a solids content of 80% by weight formed by impregnating and drying TFE dispersion (manufactured by Daikin Industries, Ltd.) were stacked, FEP films similar to those in Example 1 were placed on both sides, and Li on both sides! A laminate was obtained in the same manner as in Example 1 by arranging f.
この積層板から実施例１と同様にして多層板を形成し、
このものの寸法変化率を測定した。結果を１ｉ表に示す
。A multilayer board was formed from this laminate in the same manner as in Example 1,
The dimensional change rate of this product was measured. The results are shown in Table 1i.
（実施例４）
ＦＥＰ フィルムの代わりにＰＦ八へィルムを使用した
以外は実施例３と同様にして積層板を得た。(Example 4) A laminate was obtained in the same manner as in Example 3 except that PF Hachifilm was used instead of the FEP film.
この積層板から実施例２と同様にして多層板を形成し、
このものの寸法変化率を測定した。A multilayer board was formed from this laminate in the same manner as in Example 2,
The dimensional change rate of this product was measured.
（比較例）
厚み２００μのＰＴＦＥ フィルムを実施例１と同様の
内層材間に配置し、３８０°Ｃで接着一体化させて多層
板を形成し、寸法変化率を測定した。結果を第１表に示
す。(Comparative Example) A PTFE film having a thickness of 200 μm was placed between the same inner layer materials as in Example 1, and was bonded and integrated at 380° C. to form a multilayer board, and the dimensional change rate was measured. The results are shown in Table 1.
第１表
゛実施例１１．５
２２．０
３１．０
第１表の結果より、本発明の実施例にあっては比較例に
比して寸法変化率は２１５以下でり、極めて寸法安定性
に優れていることが判る。Table 1 Example 11.5 22.0 31.0 From the results in Table 1, the dimensional change rate of the example of the present invention was 215 or less compared to the comparative example, and the dimensional stability was extremely high. It turns out that it is excellent.
［発明の効果］
本発明にあっては、複数の樹脂層を積層して形成された
積層板であって、高融点樹脂層の少なくとも片面に低融
点樹脂層が積層されているので、積層成形により多層板
を製造するに際して低融点樹脂層だけが融解する温度で
成形することにより、この低融点樹脂層により層間の接
着性を確保でき、又、高融点樹脂層により眉間の位置ず
れを防止できると共に寸法安定性にも優れるものである
。[Effects of the Invention] In the present invention, the laminate is formed by laminating a plurality of resin layers, and since the low melting point resin layer is laminated on at least one side of the high melting point resin layer, laminate molding is possible. By molding at a temperature where only the low melting point resin layer melts when manufacturing a multilayer board, this low melting point resin layer can ensure interlayer adhesion, and the high melting point resin layer can prevent misalignment between the eyebrows. It also has excellent dimensional stability.
第１図は本発明の一実施例を示す断面図、第２図は同上
により形成した多層板を示す分解断面図であって、Ａは
積層板、１は高融点樹脂層、２は低融点りｆ脂層である
。
代理人 弁理士 石 １）長 七
ｖ、１図
第２図
手続補正書（自発）
１、事件の表示
昭和６２年特許ｌ１ｔＡ６３９１号
２、発明の名称
積層板
３、補正をする者
事件との関係 特許出願人
住 所 大阪府門真市大字門真１０４８番地名称（５８
３）松下電工株式会社
代表者 藤 井 貞 夫
４、代理人
郵便番号 ５３０
５、補正命令の日付
明細書＠３頁第１８行目の「紙、」を削除致します。FIG. 1 is a cross-sectional view showing an embodiment of the present invention, and FIG. 2 is an exploded cross-sectional view showing a multilayer board formed by the same method, in which A is a laminate, 1 is a high melting point resin layer, and 2 is a low melting point resin layer. It is a fat layer. Agent Patent Attorney Ishi 1) Chief 7v, 1 Figure 2 Procedural amendment (voluntary) 1. Indication of the case 1985 Patent 1tA6391 2. Name of the invention laminate 3. Person making the amendment Relationship with the case Patent applicant address: 1048 Kadoma, Kadoma City, Osaka Prefecture Name (58
3) Matsushita Electric Works Co., Ltd. Representative Sadao Fujii 4, Agent Postal code 530 5, Statement of date of amendment order @ Page 3, line 18, "Paper," will be deleted.
Claims (1)
て、高融点樹脂層の少なくとも片面に低融点樹脂層が積
層されて成る積層板。(1) A laminate formed by laminating a plurality of resin layers, in which a low melting point resin layer is laminated on at least one side of a high melting point resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP639187A JPS63173638A (en) | 1987-01-14 | 1987-01-14 | Laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP639187A JPS63173638A (en) | 1987-01-14 | 1987-01-14 | Laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63173638A true JPS63173638A (en) | 1988-07-18 |
Family
ID=11637066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP639187A Pending JPS63173638A (en) | 1987-01-14 | 1987-01-14 | Laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63173638A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06344500A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and mixed film for laminated sheet |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| JP2001328205A (en) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | Laminated sheet and method for manufacturing the same |
-
1987
- 1987-01-14 JP JP639187A patent/JPS63173638A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06344500A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and mixed film for laminated sheet |
| JPH06344503A (en) * | 1993-06-03 | 1994-12-20 | Nippon Pillar Packing Co Ltd | Production of laminated sheet and composite film for laminated sheet |
| JP2001328205A (en) * | 2000-05-19 | 2001-11-27 | Nippon Pillar Packing Co Ltd | Laminated sheet and method for manufacturing the same |
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