JPH03166930A - Electric laminated sheet - Google Patents
Electric laminated sheetInfo
- Publication number
- JPH03166930A JPH03166930A JP1305812A JP30581289A JPH03166930A JP H03166930 A JPH03166930 A JP H03166930A JP 1305812 A JP1305812 A JP 1305812A JP 30581289 A JP30581289 A JP 30581289A JP H03166930 A JPH03166930 A JP H03166930A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- sheet
- dielectric constant
- laminated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000002344 surface layer Substances 0.000 claims abstract description 15
- 239000011148 porous material Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 18
- 239000011888 foil Substances 0.000 abstract description 17
- 239000004744 fabric Substances 0.000 abstract description 13
- 239000011521 glass Substances 0.000 abstract description 13
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 229920001721 polyimide Polymers 0.000 abstract description 4
- 239000009719 polyimide resin Substances 0.000 abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 abstract description 2
- 229920002313 fluoropolymer Polymers 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000002585 base Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 229920006380 polyphenylene oxide Polymers 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント回路板の製造に用いられる電気用
積層板に関する.
〔従来の技術〕
プリント回路板の製造に用いられる電気用積層板として
、第2図にみるように、フッ素系樹脂からなるシート状
連通多孔質基材10の両面に、ガラス布に熱硬化性樹脂
を含浸してなるプリプレグ11.11を介して金属箔1
2.12(例えば、銅箔)を接着した銅箔張り電気用積
層板がある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to an electrical laminate used in the manufacture of printed circuit boards. [Prior Art] As shown in FIG. 2, as an electrical laminate used in the manufacture of printed circuit boards, a sheet-like continuous porous base material 10 made of fluororesin is coated with thermosetting glass cloth on both sides. Metal foil 1 via resin-impregnated prepreg 11.11
2.12 (for example, copper foil) is bonded to a copper foil-clad electrical laminate.
フッ素系樹脂は、(特に高周波数域での)誘電率が低く
有用な材料なのであるが、金属箔や他の樹脂に対する接
着性は良くない.そのため、フッ素樹脂で予めシート状
達通多孔質基材を作っておいて、つぎに、ブリプレグを
介在させて金属箔を配した状態で加熱加圧戒形するよう
にして製造する。金属箔は接着性のよい樹脂を含浸した
プリプレグと強《接着しており、一方、ブリプレグも含
浸樹脂の一部が連通孔に入り込むことによりシート状基
材に強く接着していて、その結果、シート状基材と金属
箔が強く接着することになる(特開平1−159242
号公報).
〔発明が解決しようとする課題〕
しかしながら、上記従来の電気用積層板では、フッ素系
樹脂のシート状基材の低誘電率特性が十分に生かされず
余り低誘電率になっていないという問題や、スルホール
用孔明け加工性が良くなく両面プリント回路板には利用
し難いという問題があった.
この発明は、上記事情に鑑み、シート状基材の低誘電率
特性が十分に生かされ、スルホール用]明け加工性も良
い優れた電気用lIi層板を提供す・ことを課題とする
。Although fluororesin is a useful material due to its low dielectric constant (especially in high frequency ranges), its adhesion to metal foils and other resins is poor. Therefore, a sheet-shaped delivery porous base material is made in advance from a fluororesin, and then a metal foil is arranged with a Bripreg interposed therebetween, and then heated and pressed to form the shape. The metal foil is strongly adhered to the prepreg impregnated with a highly adhesive resin, and on the other hand, the prepreg is also strongly adhered to the sheet-like base material due to some of the impregnated resin entering the communication holes. This results in strong adhesion between the sheet-like base material and the metal foil (Japanese Patent Application Laid-Open No. 1-159242
Publication No.). [Problems to be Solved by the Invention] However, in the conventional electrical laminate described above, there are problems in that the low dielectric constant property of the fluororesin sheet base material is not fully utilized and the dielectric constant is not very low. The problem was that the through-hole drilling processability was not good, making it difficult to use for double-sided printed circuit boards. In view of the above circumstances, it is an object of the present invention to provide an excellent electrical IIi laminate that makes full use of the low dielectric constant properties of the sheet-like base material and has good punchability for through-holes.
前記課題を解決するため、この発明にがかる1気用積層
板では、低誘電率の樹脂材料からなる:一ト状基材の両
面に接゛着性の良い樹脂材料からシる表面層が配され、
前記シート状基材が連通多1質材であって、その孔に前
記表面層の樹脂材料G一部が入り込んでいるという構或
をとるようにとている.
具体的には、第1図にみるように、シート状1材lの両
面に表面層2.2を間にして金属箔3.3が積層されて
なる両面金属箔張り積層板の構がとなっている.金属箔
が片面だけの片面金属箔1り積層板の構或もある。また
、金属箔のない積1板の構威もあるが、この場合は、さ
らに金属箔唱接着してプリント回路板にするようにする
こと番=いうまでもない.
この発明の電気用積層板は、通常、厚み:Q,1〜2.
O mm程度、誘電率:2.0〜3.5程度のものであ
る。In order to solve the above problem, the single-layer laminate according to the present invention is made of a resin material with a low dielectric constant: a surface layer made of a resin material with good adhesiveness is arranged on both sides of a single-piece base material. is,
The sheet-like base material is a continuous polymorphous material, and a part of the resin material G of the surface layer is inserted into the pores thereof. Specifically, as shown in Fig. 1, the structure of a double-sided metal foil-covered laminate is made by laminating metal foils 3.3 on both sides of a sheet-like material 1 with a surface layer 2.2 in between. It has become. There is also a single-sided metal foil laminate structure in which the metal foil is only on one side. There is also a single board structure without metal foil, but in this case it goes without saying that it is necessary to further bond the metal foil to make a printed circuit board. The electrical laminate of the present invention usually has a thickness of Q, 1 to 2.
It has a dielectric constant of about 2.0 to 3.5.
シ一ト伏基材用の4M脂には、フッ素系4M脂が普通使
われ〔より具体的には、ポリテトラフルオロエチレン(
PTFE) 、四フッ化エチレンパーフルオロビニルエ
ーテル共重合体(PPFA)、四フン化エチレン67フ
化プロピレン共重合体(PFEP) 、四フフ化エチレ
ンエチレン共重合体(PETFE) 、三フフ化塩化エ
チレン樹脂(PCTFE)などが挙げられる〕、この他
、シリコン系樹脂、ボリフェニレンサルファイド系樹脂
なども使われる.
この発明のシート状基材は、シート両表面間を貫通する
連通孔が多数開いてぃる連通多孔質材であり、通常、厚
ミ? 0. 0 1 〜1 tm、孔径:0.3〜10
μ(より好ましくは0. 5〜In)、気孔率=50〜
95%程度のものが用いられる。Fluorine-based 4M resins are commonly used as 4M resins for sheet-laying base materials [more specifically, polytetrafluoroethylene (
PTFE), tetrafluoroethylene perfluorovinyl ether copolymer (PPFA), tetrafluoroethylene 67-fluoropropylene copolymer (PFEP), tetrafluoroethylene ethylene copolymer (PETFE), trifluorochloride ethylene resin (PCTFE)], silicone resins, polyphenylene sulfide resins, etc. are also used. The sheet-like base material of the present invention is a continuous porous material having a large number of communicating holes penetrating between both surfaces of the sheet, and usually has a thickness of about 0. 0 1 to 1 tm, pore diameter: 0.3 to 10
μ (more preferably 0.5-In), porosity = 50-
About 95% is used.
表面層2は、ガラス布を含まない樹脂のみの層(硬化剤
等の通常の添加剤は含んでもよい)であり、厚み:0.
01〜1fl程度であり、エボキシ樹脂、ポリイミド樹
脂、ppo樹脂などの熱硬化性樹脂が使われている.
この発明の電気用積層板は、例えば、連通多孔質のシー
ト状基材1の両面に表面層2月樹脂フイルム(厚み:0
.01〜1fl程度のフィルムが普通用いられる)をそ
れぞれ配し、さらに、その外側に金属箔3をそれぞれ配
しておいて、加熱加圧威形することにより得られる.通
常、加熱温度=150〜330℃程度、圧力:5〜50
kgf/cd程度、時間:30〜120分程度の条件で
威形されるなお、金属箔3を片面のみに配するか、全く
配さないようにして積層板を得る場合もある。後者の金
属箔3を全く配さない場合は、金属箔3を後で片面ある
いは両面に張るようにする.この発明の電気用積層板は
、上記例示の材料や数値範囲に限らないことはいうまで
もない.〔作 用〕
この発明では、シート状基材1と金属箔3の間の表面層
2が樹脂のみからなり、従来のように誘電率の高いガラ
ス布を含んでいないため、シート状基材1の低誘電率特
性が十分に生かされている。従来の電気用積層板では、
シート状基材の誘電率が低くてもプリプレグのガラス布
の誘電率が高いため、全体としてみると結構高い誘電率
になる。これに対し、この発明の電気用積層板では、誘
電率の高いガラス布が無いため、シート状基材の低誘電
率が支配的となり、全体としても低誘電率になるのであ
る。The surface layer 2 is a resin-only layer that does not contain glass cloth (it may contain ordinary additives such as a hardening agent), and has a thickness of 0.
01 to 1 fl, and thermosetting resins such as epoxy resin, polyimide resin, and PPO resin are used. The electrical laminate of the present invention has, for example, a surface layer of a resin film (thickness: 0
.. A film of about 0.01 to 1 fl. Usually, heating temperature = about 150-330℃, pressure: 5-50
The laminated plate is formed under the conditions of about kgf/cd and time: about 30 to 120 minutes. In some cases, the metal foil 3 is placed on only one side, or is not placed at all to obtain a laminate. If the latter metal foil 3 is not placed at all, the metal foil 3 is applied later on one or both sides. It goes without saying that the electrical laminate of the present invention is not limited to the materials and numerical ranges exemplified above. [Function] In this invention, the surface layer 2 between the sheet-like base material 1 and the metal foil 3 consists only of resin and does not contain glass cloth with a high dielectric constant as in the conventional case. The low dielectric constant property of the material is fully utilized. With conventional electrical laminates,
Even if the dielectric constant of the sheet-like base material is low, the dielectric constant of the prepreg glass cloth is high, so the dielectric constant as a whole is quite high. On the other hand, in the electrical laminate of the present invention, since there is no glass cloth with a high dielectric constant, the low dielectric constant of the sheet-like base material becomes dominant, and the dielectric constant as a whole becomes low.
また、ガラス布がある場合には、パンチング孔明け加工
が出来ないし、ドリル孔明け加工においても、ガラス布
の繊維交差点にドリルが当ってドリルの位置振れが起こ
り、孔明け位置精度が悪い。この発明の電気用積層板は
、ガラス布が無いために、このようなスルホール用孔明
け加工時の不都合が解消される。Furthermore, if there is a glass cloth, punching holes cannot be performed, and even when drilling holes, the drill hits the fiber intersections of the glass cloth, causing the drill position to run out, resulting in poor hole position accuracy. Since the electrical laminate of the present invention does not include glass cloth, such inconveniences during drilling for through-holes are eliminated.
もちろん、金属箔は接着性のよい樹脂の表面層に強く接
着し、表面層が樹脂の一部が連通孔に入り込むことによ
りシ一ト伏基材に強く接着していて、その結果、シート
状基材と金属箔が強く接着することはいうまでもない。Of course, the metal foil strongly adheres to the surface layer of the resin, which has good adhesive properties, and the surface layer adheres strongly to the sheet-laying base material due to some of the resin entering the communication holes, resulting in a sheet-like shape. Needless to say, the base material and the metal foil are strongly adhered to each other.
続いて、この発明の電気用積層板の実施例を説明する。 Next, examples of the electrical laminate of the present invention will be described.
一実施例1
シート状基材として、連通孔径:in、気孔率:75%
、厚み: 0. 1 ’nのPTFEシ一トを用いた。Example 1 As a sheet-like base material, communicating pore diameter: in, porosity: 75%
, Thickness: 0. A 1'n PTFE sheet was used.
この連通多孔質PTFEシ一トの両面に厚み50nのエ
ボキシ樹脂フィルムをそれぞれ配し、このフィルムの外
側に厚み35μの電解銅箔をそれぞれ配して、加熱加圧
威形し、両面銅箔張り電気用積層板を得た。An epoxy resin film with a thickness of 50 nm is placed on both sides of this continuous porous PTFE sheet, and an electrolytic copper foil with a thickness of 35 μm is placed on the outside of this film. An electrical laminate was obtained.
一実施例2−
シート状基材として、連通孔径:l,w,気孔率:75
%、厚み: 0. 1 tmのPTFEシ一トを用いた
。この連通多孔質PTFEシ一トの両面に厚み50nの
ボリイ主ド樹脂フィルムをそれぞれ配し、このフィルム
の外側に厚み35,nの電解銅箔をそれぞれ配して、加
熱加圧威形し、両面銅箔張り電気用積層板を得た。Example 2 - As a sheet-like base material, communicating pore diameter: l, w, porosity: 75
%, thickness: 0. A 1 tm PTFE sheet was used. A polyurethane resin film with a thickness of 50 nm is placed on both sides of this continuous porous PTFE sheet, and an electrolytic copper foil with a thickness of 35 nm is placed on the outside of this film, and heated and pressed to shape it. An electrical laminate with copper foil on both sides was obtained.
一実施例3一
シート状基材として、連通孔径:ip、気孔率=75%
、厚み: 0. 1 tmのPTFEシートを用いた。Example 3 As a sheet-like base material, communicating pore diameter: ip, porosity = 75%
, Thickness: 0. A 1 tm PTFE sheet was used.
この連通多孔質P.TFEシートの両面に厚み50pm
のPPO (ボリフェニレンオキシド)樹脂フィルムを
それぞれ配し、このフィルムの外側に厚み35p1の電
解銅箔をそれぞれ配して、加熱加圧成形し、両面銅箔張
り電気用積層板を得た。This continuous porous P. 50pm thick on both sides of TFE sheet
A PPO (polyphenylene oxide) resin film was placed on each side, and an electrolytic copper foil having a thickness of 35p1 was placed on the outside of each film, and the sheets were molded under heat and pressure to obtain an electrical laminate with both sides covered with copper foil.
一比較例1−
エボキシ樹脂フィルムの代わりに、無アルカリEガラス
布にエボキシ樹脂を含浸させた厚み50nのプリプレグ
を用いるようにした他は、実施例lと同様にして両面銅
箔張り電気用積層板を得たー比較例2一
ポリイミド樹脂フィルムの代わりに、無アルカリEガラ
ス布にポリイミド樹脂を含浸させた厚み50nのプリプ
レグを用いるようにした他は、実施例2と同様にして両
面銅箔張り電気用積層板を得た。Comparative Example 1 - Double-sided copper foil-covered electrical laminate was carried out in the same manner as in Example 1, except that instead of the epoxy resin film, a 50 nm thick prepreg made by impregnating an alkali-free E glass cloth with epoxy resin was used. A board was obtained - Comparative Example 2 - Double-sided copper foil was prepared in the same manner as in Example 2, except that instead of the polyimide resin film, a prepreg with a thickness of 50 nm, which was made by impregnating a non-alkali E glass cloth with polyimide resin, was used. A stretched electrical laminate was obtained.
比較例3一
PPO樹脂フィルムの代わりに、無アルカリEガラス布
にPPO樹脂を含浸させた厚み50nのプリプレグを用
いるようにした他は、実施例3と同様にして両面銅箔張
り電気用積層板を得た.このようにして得られた実施例
1〜3および比較例1〜3の電気用積層板の誘電率をそ
れぞれ測定した。結果を第1表に示す。Comparative Example 3 - A double-sided copper foil-covered electrical laminate was produced in the same manner as in Example 3, except that instead of the PPO resin film, a prepreg with a thickness of 50 nm made of alkali-free E glass cloth impregnated with PPO resin was used. I got it. The dielectric constants of the electrical laminates of Examples 1 to 3 and Comparative Examples 1 to 3 thus obtained were measured. The results are shown in Table 1.
第
■
表
対応する実施例1と比較例1、実施例2と比較例2、お
よび、実施例3と比較例3の各積層板の誘電率を比較す
れば、この発明の電気用積層板の方が誘電率が相当に低
くなっており、シート状基材の低誘電率特性が十分に生
かされていることがよく分かる.
〔発明の効果〕
以上に述べたように、この発明の電気用積層板は、表面
層がガラス布の無い樹脂のみからなる層であるため、シ
ート状基材の低誘電率特性が十分に生かされ、しかも、
スルホール用孔明け加工性に優れた実用性の高いものと
なっている。Table 2 Comparing the dielectric constants of the corresponding laminates of Example 1 and Comparative Example 1, Example 2 and Comparative Example 2, and Example 3 and Comparative Example 3, it is found that the electrical laminate of the present invention has a It is clear that the dielectric constant of the sheet material is considerably lower, and that the low dielectric constant characteristics of the sheet-like base material are fully utilized. [Effects of the Invention] As described above, since the surface layer of the electrical laminate of the present invention is made only of resin without glass cloth, the low dielectric constant characteristics of the sheet-like base material can be fully utilized. and, moreover,
It is highly practical with excellent through-hole drilling processability.
第1図は、この発明にかかる電気用積層板の一例の構威
を模式的にあらわす断面図、第2図は、従来の電気用積
層板の構戒を模式的にあらわす断面図である。FIG. 1 is a sectional view schematically showing the structure of an example of an electrical laminate according to the present invention, and FIG. 2 is a sectional view schematically showing the structure of a conventional electrical laminate.
Claims (1)
接着性の良い樹脂材料からなる表面層が配され、前記シ
ート状基材が連通多孔質材であって、その孔に前記表面
層の樹脂材料の一部が入り込んでいる電気用積層板。1 A surface layer made of a resin material with good adhesiveness is arranged on both sides of a sheet-like base material made of a resin material with a low dielectric constant, and the sheet-like base material is a continuous porous material, and the surface layer is formed in the pores of the sheet-like base material. An electrical laminate containing a portion of resin material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1305812A JPH03166930A (en) | 1989-11-25 | 1989-11-25 | Electric laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1305812A JPH03166930A (en) | 1989-11-25 | 1989-11-25 | Electric laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03166930A true JPH03166930A (en) | 1991-07-18 |
Family
ID=17949665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1305812A Pending JPH03166930A (en) | 1989-11-25 | 1989-11-25 | Electric laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03166930A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003063238A1 (en) * | 2002-01-25 | 2003-07-31 | Sony Corporation | High-frequency module and its manufacturing method |
KR100721462B1 (en) * | 2004-05-31 | 2007-05-23 | 주식회사 엘지화학 | Adhesive Heat Resistant Sheet |
US7303811B2 (en) | 1999-04-23 | 2007-12-04 | Ube Industries | Porous insulating film and its laminates |
-
1989
- 1989-11-25 JP JP1305812A patent/JPH03166930A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7303811B2 (en) | 1999-04-23 | 2007-12-04 | Ube Industries | Porous insulating film and its laminates |
US7311966B2 (en) | 1999-04-23 | 2007-12-25 | Ube Industries, Ltd. | Porous insulating film and its laminates |
WO2003063238A1 (en) * | 2002-01-25 | 2003-07-31 | Sony Corporation | High-frequency module and its manufacturing method |
US7599190B2 (en) | 2002-01-25 | 2009-10-06 | Sony Corporation | High-frequency module, and method of producing same |
KR100721462B1 (en) * | 2004-05-31 | 2007-05-23 | 주식회사 엘지화학 | Adhesive Heat Resistant Sheet |
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