JPH0221748U - - Google Patents
Info
- Publication number
- JPH0221748U JPH0221748U JP1988100283U JP10028388U JPH0221748U JP H0221748 U JPH0221748 U JP H0221748U JP 1988100283 U JP1988100283 U JP 1988100283U JP 10028388 U JP10028388 U JP 10028388U JP H0221748 U JPH0221748 U JP H0221748U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- metal heat
- ceramic substrates
- semiconductor
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 3
- 239000008188 pellet Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図、第３図はそれぞれ本考案の一実施例お
よび他の実施例による放熱板付半導体容器の斜視
図、第２図は本考案の一実施例をシヤーシにネジ
止めした時の断面図、第４図は従来の半導体容器
の斜視図、第５図は従来の半導体容器をシヤーシ
にネジ止めした時の断面図である。
１，１１，１２……放熱板、２，２１，２２，
２３……溝、３１，３２……セラミツク基板、４
１，４２……キヤツプ、５１，５２，５３，５４
……リード、６１，６２……取付ネジ、７……シ
ヤーシ。
1 and 3 are perspective views of semiconductor containers with heat sinks according to one embodiment and another embodiment of the present invention, respectively, and FIG. 2 is a cross-sectional view of one embodiment of the present invention screwed to a chassis. FIG. 4 is a perspective view of a conventional semiconductor container, and FIG. 5 is a sectional view of the conventional semiconductor container screwed to a chassis. 1, 11, 12... Heat sink, 2, 21, 22,
23... Groove, 31, 32... Ceramic substrate, 4
1, 42... Cap, 51, 52, 53, 54
... Lead, 61, 62 ... Mounting screw, 7 ... Chassis.
Claims (1)
ペレツトを搭載した２つのセラミツク基板を近づ
けて載置し、かつ前記金属製放熱板の両端にネジ
止め用の切り込みもしくは穴を設けた構造を有し
、前記２つのセラミツク基板の間の位置の金属製
放熱板の部分に溝を設けたことを特徴とする放熱
板付半導体容器。 It has a structure in which two ceramic substrates each carrying a semiconductor pellet are placed close to each other on a metal heat sink having a substantially rectangular surface, and cuts or holes for screwing are provided at both ends of the metal heat sink. . A semiconductor container with a heat sink, characterized in that a groove is provided in a portion of the metal heat sink located between the two ceramic substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100283U JPH0221748U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100283U JPH0221748U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221748U true JPH0221748U (en) | 1990-02-14 |
Family
ID=31328226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988100283U Pending JPH0221748U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221748U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016219461A (en) * | 2015-05-14 | 2016-12-22 | 三菱電機株式会社 | High frequency high output device |
-
1988
- 1988-07-27 JP JP1988100283U patent/JPH0221748U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016219461A (en) * | 2015-05-14 | 2016-12-22 | 三菱電機株式会社 | High frequency high output device |
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