JPS63197346U - - Google Patents
Info
- Publication number
- JPS63197346U JPS63197346U JP8922087U JP8922087U JPS63197346U JP S63197346 U JPS63197346 U JP S63197346U JP 8922087 U JP8922087 U JP 8922087U JP 8922087 U JP8922087 U JP 8922087U JP S63197346 U JPS63197346 U JP S63197346U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor component
- dissipation sheet
- dissipation structure
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図はこの考案に係る半導体部品の放熱構造
を示す分解斜視図、第２図ないし第４図は従来例
を示す分解斜視図で、第２図は板状の放熱用シー
トを用いた例を示す図、第３図はチユーブ状の放
熱用シートを用いた例を示す図、第４図は放熱用
シートで半導体部品を包み込んだ例を示す図であ
る。
１……半導体部品、２……放熱器、４……固定
用クリツプ、５……放熱用シート、５ａ……切欠
部、なお、図中同一符号は同一または相当部分を
示す。
Fig. 1 is an exploded perspective view showing the heat dissipation structure of a semiconductor component according to this invention, Figs. 2 to 4 are exploded perspective views showing conventional examples, and Fig. 2 is an example using a plate-shaped heat dissipation sheet. FIG. 3 is a diagram showing an example using a tube-shaped heat dissipation sheet, and FIG. 4 is a diagram showing an example in which a semiconductor component is wrapped in the heat dissipation sheet. DESCRIPTION OF SYMBOLS 1... Semiconductor component, 2... Heatsink, 4... Fixing clip, 5... Heat radiation sheet, 5a... Notch, and the same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
に取り付けた半導体部品の放熱構造において、前
記放熱用シートをキヤツプ状に形成したことを特
徴とする半導体部品の放熱構造。 (2) 放熱用シートは、半導体部品の表側のモー
ルド面に対向する部分に切欠部を設けたことを特
徴とする実用新案登録請求の範囲第１項記載の半
導体部品の放熱構造。[Claims for Utility Model Registration] (1) A heat dissipation structure for a semiconductor component in which a semiconductor component is attached to a heat sink via a heat dissipation sheet, characterized in that the heat dissipation sheet is formed into a cap shape. Heat dissipation structure. (2) The heat dissipation structure for a semiconductor component according to claim 1, wherein the heat dissipation sheet has a notch in a portion facing the mold surface on the front side of the semiconductor component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8922087U JPS63197346U (en) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8922087U JPS63197346U (en) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197346U true JPS63197346U (en) | 1988-12-19 |
Family
ID=30948010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8922087U Pending JPS63197346U (en) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197346U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017138341A1 (en) * | 2016-02-12 | 2017-08-17 | 東芝キヤリア株式会社 | Heat dissipating device and method for assembling heat dissipating device |
-
1987
- 1987-06-10 JP JP8922087U patent/JPS63197346U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017138341A1 (en) * | 2016-02-12 | 2017-08-17 | 東芝キヤリア株式会社 | Heat dissipating device and method for assembling heat dissipating device |
| JPWO2017138341A1 (en) * | 2016-02-12 | 2018-08-09 | 東芝キヤリア株式会社 | Heat dissipation device and method of assembling the heat dissipation device |