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JPH01157424U - - Google Patents

Info

Publication number
JPH01157424U
JPH01157424U JP4727388U JP4727388U JPH01157424U JP H01157424 U JPH01157424 U JP H01157424U JP 4727388 U JP4727388 U JP 4727388U JP 4727388 U JP4727388 U JP 4727388U JP H01157424 U JPH01157424 U JP H01157424U
Authority
JP
Japan
Prior art keywords
semiconductor chip
mounting board
die bonding
bonding agent
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4727388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4727388U priority Critical patent/JPH01157424U/ja
Publication of JPH01157424U publication Critical patent/JPH01157424U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体チツプ用搭載基板
に半導体チツプが搭載された状態を示す側断面図
、第２図は他の実施例を示す側断面図、第３図は
従来の半導体チツプ用搭載基板に半導体チツプが
ダイボンデイング剤によつて固着された状態を示
す側断面図である。 １……金属基板、２……ダイボンデイング剤、
３……半導体チツプ、１１……凹部。 Figure 1 is a side sectional view showing a semiconductor chip mounted on a semiconductor chip mounting board according to the present invention, Figure 2 is a side sectional view showing another embodiment, and Figure 3 is a conventional semiconductor chip mounting board. FIG. 2 is a side cross-sectional view showing a state in which a semiconductor chip is fixed to a mounting board with a die bonding agent. 1...Metal substrate, 2...Die bonding agent,
3...Semiconductor chip, 11...Recessed portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイボンデイング剤によつて半導体チツプが固
着される半導体チツプ用搭載基板において、前記
搭載基板のダイボンデイング面に凹部に設けたこ
とを特徴とする半導体チツプ用搭載基板。 1. A semiconductor chip mounting board to which a semiconductor chip is fixed by a die bonding agent, characterized in that a recess is provided in a die bonding surface of the mounting board.
JP4727388U 1988-04-06 1988-04-06 Pending JPH01157424U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4727388U JPH01157424U (en) 1988-04-06 1988-04-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4727388U JPH01157424U (en) 1988-04-06 1988-04-06

Publications (1)

Publication Number Publication Date
JPH01157424U true JPH01157424U (en) 1989-10-30

Family

ID=31273494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4727388U Pending JPH01157424U (en) 1988-04-06 1988-04-06

Country Status (1)

Country Link
JP (1) JPH01157424U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077312A1 (en) * 2002-03-08 2003-09-18 Rohm Co.,Ltd. Semiconductor device using semiconductor chip
JP2003264267A (en) * 2002-03-08 2003-09-19 Rohm Co Ltd Semiconductor device using semiconductor chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077312A1 (en) * 2002-03-08 2003-09-18 Rohm Co.,Ltd. Semiconductor device using semiconductor chip
JP2003264267A (en) * 2002-03-08 2003-09-19 Rohm Co Ltd Semiconductor device using semiconductor chip

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