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JPH0328742U - - Google Patents

Info

Publication number
JPH0328742U
JPH0328742U JP1989089708U JP8970889U JPH0328742U JP H0328742 U JPH0328742 U JP H0328742U JP 1989089708 U JP1989089708 U JP 1989089708U JP 8970889 U JP8970889 U JP 8970889U JP H0328742 U JPH0328742 U JP H0328742U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
resin
resin frame
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989089708U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989089708U priority Critical patent/JPH0328742U/ja
Publication of JPH0328742U publication Critical patent/JPH0328742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図は本考案の一実施例の集積回路
装置を示すそれぞれ断面図、平面図、第３図、第
４図は従来の集積回路装置を示すそれぞれ断面図
、平面図である。 １……回路基板、２……集積回路素子、３……
メタライズパターン、４……ボンデイングワイヤ
、５……樹脂枠、５ａ……樹脂枠上の凹、５ｂ…
…樹脂枠上の溝、６……樹脂、６ａ……余分な樹
脂。 1 and 2 are a sectional view and a plan view, respectively, showing an integrated circuit device according to an embodiment of the present invention, and FIGS. 3 and 4 are a sectional view and a plan view, respectively, showing a conventional integrated circuit device. . 1... Circuit board, 2... Integrated circuit element, 3...
Metallized pattern, 4... Bonding wire, 5... Resin frame, 5a... Concavity on resin frame, 5b...
...Groove on the resin frame, 6...Resin, 6a...Excess resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板の主面上に集積回路素子を搭載し、前
記集積回路素子を囲む樹脂枠を設け、少なくとも
前記集積回路素子を樹脂で封止した集積回路装置
において、余分な樹脂が溜まるように、前記樹脂
枠に凹を設けたことを特徴とする集積回路装置。 In an integrated circuit device in which an integrated circuit element is mounted on the main surface of a circuit board, a resin frame surrounding the integrated circuit element is provided, and at least the integrated circuit element is sealed with resin, the An integrated circuit device characterized in that a resin frame has a recess.
JP1989089708U 1989-07-28 1989-07-28 Pending JPH0328742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089708U JPH0328742U (en) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089708U JPH0328742U (en) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328742U true JPH0328742U (en) 1991-03-22

Family

ID=31639277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089708U Pending JPH0328742U (en) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328742U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580230U (en) * 1992-04-07 1993-11-02 セイレイ工業株式会社 Threshing equipment
WO2011024820A1 (en) * 2009-08-24 2011-03-03 本田技研工業株式会社 Electronic device and method for manufacturing electronic device
JP2011044628A (en) * 2009-08-24 2011-03-03 Honda Motor Co Ltd Electronic device, and method for manufacturing electronic device
JP2011159692A (en) * 2010-01-29 2011-08-18 Honda Motor Co Ltd Electronic device and method for manufacturing the same
JPWO2014006699A1 (en) * 2012-07-04 2016-06-02 富士機械製造株式会社 Semiconductor package and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580230U (en) * 1992-04-07 1993-11-02 セイレイ工業株式会社 Threshing equipment
WO2011024820A1 (en) * 2009-08-24 2011-03-03 本田技研工業株式会社 Electronic device and method for manufacturing electronic device
JP2011044628A (en) * 2009-08-24 2011-03-03 Honda Motor Co Ltd Electronic device, and method for manufacturing electronic device
CN102484102A (en) * 2009-08-24 2012-05-30 本田技研工业株式会社 Electronic device and method for manufacturing electronic device
US8497166B2 (en) 2009-08-24 2013-07-30 Honda Motor Co., Ltd. Electronic device and method of manufacturing electronic device
JP2011159692A (en) * 2010-01-29 2011-08-18 Honda Motor Co Ltd Electronic device and method for manufacturing the same
JPWO2014006699A1 (en) * 2012-07-04 2016-06-02 富士機械製造株式会社 Semiconductor package and manufacturing method thereof

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