JPS63112348U - - Google Patents
Info
- Publication number
- JPS63112348U JPS63112348U JP461287U JP461287U JPS63112348U JP S63112348 U JPS63112348 U JP S63112348U JP 461287 U JP461287 U JP 461287U JP 461287 U JP461287 U JP 461287U JP S63112348 U JPS63112348 U JP S63112348U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- thermally conductive
- conductive resin
- foil
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
Description
第１図ａ，ｂは本考案の一実施例を示し、ａが
下面図、ｂが側断面図、第２図は従来の熱伝導性
樹脂塗布作業の一例を示す斜視図、第３図は熱伝
導性樹脂を介して冷却体に装着した半導体装置の
側面図である。
１：半導体装置、２：基板、３：サーマルコン
パウンド、６：箔。
1A and 1B show an embodiment of the present invention, in which a is a bottom view, b is a side sectional view, FIG. 2 is a perspective view showing an example of a conventional thermally conductive resin coating operation, and FIG. FIG. 2 is a side view of a semiconductor device attached to a cooling body via a thermally conductive resin. 1: Semiconductor device, 2: Substrate, 3: Thermal compound, 6: Foil.
Claims (1)
表面を箔によつて密封されて固定されたことを特
徴とする半導体装置。 A semiconductor device characterized in that a predetermined amount of thermally conductive resin is fixed on the outer surface of a container substrate with the surface sealed with foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP461287U JPS63112348U (en) | 1987-01-16 | 1987-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP461287U JPS63112348U (en) | 1987-01-16 | 1987-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63112348U true JPS63112348U (en) | 1988-07-19 |
Family
ID=30785433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP461287U Pending JPS63112348U (en) | 1987-01-16 | 1987-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63112348U (en) |
-
1987
- 1987-01-16 JP JP461287U patent/JPS63112348U/ja active Pending