JP7264653B2 - Substrate processing equipment - Google Patents

Description

The technology disclosed in this specification relates to technology for a substrate processing apparatus capable of processing a substrate.

Patent Document 1 discloses a substrate processing apparatus that includes support pins that support the lower surface of a substrate and a substrate pressing plate that presses the upper surface of the substrate when processing the substrate.

JP-A-4-293300

There are various types of substrates. Among the various substrates, there are specific substrates (for example, thin substrates) whose allowable load is lower than the load applied by the substrate holding plate.

For example, an administrator of a substrate processing apparatus inputs a setting not to use the substrate holding plate when a specific substrate is to be processed. This avoids applying a load exceeding the allowable load to a specific substrate. However, if the administrator forgets to enter the setting, a load exceeding the allowable load will be applied to the specific substrate, causing a problem.

The present specification provides a technique for preventing the upper surface of the substrate from being erroneously pressed by the pressing portion.

A substrate processing apparatus disclosed in this specification includes a substrate processing section capable of processing a substrate, a support section supporting the lower surface of the substrate when the substrate processing section processes the substrate, and a substrate supported by the support section. a holding part capable of holding the upper surface of the substrate that has been processed; and a holding part that should hold the upper surface of the substrate using substrate information related to the substrate when the substrate processing unit processes the substrate. a control unit that causes the holding part to hold the upper surface of the substrate when making a judgment, and does not make the holding part hold the upper surface of the substrate when making a judgment that the upper surface of the substrate should not be held; You may prepare.

According to such a configuration, when the substrate processing section processes the substrate, the substrate processing apparatus uses the substrate information related to the substrate to determine that the upper surface of the substrate should not be pressed. Do not let the holding part press the top surface. By using board information to make a determination, it is possible to prevent the upper surface of the board from being erroneously pressed by the pressing part, compared to a configuration in which the determination is made by a person.

1 shows a sectional view of a substrate processing apparatus according to a first embodiment; FIG. 1 shows a block diagram of a substrate processing apparatus according to a first embodiment; FIG. Fig. 3 shows an enlarged view of a support pin; The flowchart figure of a judgment process is shown.

The main features of the embodiments described below are listed. It should be noted that the technical elements described below are independent technical elements, and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims as filed. not a thing

(Feature 1) The support section has a suction section that sticks to the lower surface of the substrate, and when the control section determines that the upper surface of the substrate should not be pressed, the suction section is operated to cause the substrate to be attracted to the suction section. may According to such a configuration, when it is determined that the upper surface of the substrate should not be pressed, the substrate can be fixed at the predetermined position by the suction portion.

(Feature 2) The pressing portion is positioned at either a contact position where it can contact the upper surface of the substrate or a non-contact position where it cannot contact the upper surface of the substrate, and the control portion presses the upper surface of the substrate. The pressing portion may be moved to the contact position when it is determined that the upper surface of the substrate should be pressed, and the pressing portion may be moved to the non-contact position when it is determined that the upper surface of the substrate should not be pressed. According to such a configuration, when it is determined that the upper surface of the substrate should not be pressed, the pressing portion can be moved to the non-contact position to automatically shift to a state in which the upper surface of the substrate is not pressed.

(Feature 3) The substrate may include a storage unit that stores substrate information, and the control unit may acquire the substrate information from the storage unit of the substrate before processing the substrate by the substrate processing unit. According to such a configuration, when processing a plurality of substrates, substrate information corresponding to each substrate is acquired from each substrate before processing each substrate, and whether or not the upper surface of each substrate should be pressed is determined. judgment can be carried out.

(Feature 4) The board information includes identification information for identifying the board, and the identification information is stored in the memory in association with determination information indicating whether or not the upper surface of the board should be pressed. Using the identification information included in the obtained board information, the determination information associated with the identification information is obtained from the memory, and when the obtained determination information indicates that the upper surface of the board should be pressed, the board is pressed. The upper surface of the substrate may not be pressed by the pressing portion when the obtained determination information indicates that the upper surface of the substrate should not be pressed. According to such a configuration, it is possible to manage the determination information indicating whether or not the upper surface of the substrate should be pressed on the memory.

(Configuration of substrate processing apparatus 10; FIG. 1)
FIG. 1 shows the inside of a substrate processing apparatus 10 of an embodiment, and FIG. 2 shows a block diagram of the substrate processing apparatus 10. As shown in FIG. The substrate processing apparatus 10 is a component mounting apparatus that mounts electronic components 210 on a substrate 200 . In addition, in FIG. 1, the substrate processing apparatus 10 is illustrated in a simplified manner. Also, XYZ coordinates are defined in the figure.

As shown in FIG. 1, the substrate processing apparatus 10 includes a moving mechanism 20, a mounting unit 24, a component feeder 30, a conveyor 40, a display unit 50, a control unit 54, a support unit 70, and a negative pressure generator. A device 78 and a pressing portion 80 are provided. As shown in FIG. 1, each section 20 , 24 , 40 , 70 , 78 , 80 is housed in housing 12 .

The moving mechanism 20 is a robot that moves the moving base 22 in the X direction and the Y direction (that is, in the horizontal direction). The moving mechanism 20 includes guide rails that guide the moving base 22, actuators that move the moving base 22 along the guide rails, and the like. The moving mechanism 20 is arranged above the component feeder 30 and the conveyor 40 .

The mounting unit 24 includes a suction nozzle 24a that suctions the electronic component 210, and a nozzle support portion 24b that supports the suction nozzle 24a. The nozzle support portion 24b is fixed to the moving base 22. As shown in FIG. The nozzle support portion 24b includes an actuator (not shown) for moving the suction nozzle 24a in the vertical direction (that is, the Z-axis direction). To mount the electronic component 210 at a predetermined position on the board 200 , first, the moving base 22 is moved to move the mounting unit 24 above the component feeder 30 . Next, the suction nozzle 24 a is moved downward until the lower surface (suction surface) of the suction nozzle 24 a contacts the electronic component 210 in the component feeder 30 . Next, the suction nozzle 24a is caused to suck the electronic component 210, and the suction nozzle 24a is moved upward. Next, the movement base 22 is moved to move the mounting unit 24 above the substrate 200 . Next, the mounting unit 24 is positioned at the above-described predetermined position, and the suction nozzle 24 a is lowered toward the substrate 200 . Thus, electronic component 210 is mounted on substrate 200 .

Component feeder 30 accommodates a plurality of electronic components 210 . The component feeder 30 supplies electronic components 210 to the mounting unit 24 . A specific configuration of the component feeder 30 is not particularly limited. The component feeder 30 is, for example, a tape-type feeder that accommodates a plurality of electronic components 210 in the form of a winding tape, a tray-type feeder that accommodates a plurality of electronic components 210 on a tray, or a container in which a plurality of electronic components 210 are randomly placed. It may be any bulk feeder that accommodates a

The conveyor 40 carries the jig 74 and the substrate 200 into the substrate processing apparatus 10 , places the substrate 200 on the jig 74 , and carries out the jig 74 and the substrate 200 out of the substrate processing apparatus 10 . do. The conveyor 40 of this embodiment includes, for example, a pair of belt conveyors, a supporting device (not shown) attached to the belt conveyors and supporting the jig 74 and the substrate 200 from below, and an actuator (not shown) for driving the belt conveyors. ). The jig 74 and substrate 200 are transported in the X-axis direction.

The support part 70 is a mechanism for supporting the bottom surface of the substrate 200 . Specifically, the support portion 70 includes a support base 72 fixed to the bottom surface of the housing 12 , a jig 74 supported on the upper end of the support base 72 , and a plurality of jigs 74 arranged on the top surface of the jig 74 . and a support pin 76 of . The support base 72 can be adjusted in height in the vertical direction (that is, in the Z-axis direction) by an actuator (not shown). The jig 74 can be moved up and down by adjusting the height of the support table 72 . The support pins 76 are in contact with the bottom surface of the substrate 200 and support the bottom surface of the substrate 200 .

The negative pressure generating device 78 is a device that generates a negative pressure for attracting a suction portion 76b (see FIG. 3) provided at the upper end of the support pin 76 to the lower surface of the substrate 200, which will be described later. The negative pressure generator 78 is connected to the support base 72 via a tube 78a. The details of the support pin 76 including the suction portion 76b will be described later.

The pressing part 80 is a block for pressing the edge of the upper surface of the substrate 200 . The pressing portion 80 can be moved to either a contact position or a non-contact position by an actuator 82 . The abutment position is a position where the upper surface of the substrate 200 can be abutted (that is, a position overlapping the substrate 200 when viewed from above), and the non-abutment position is a position where the upper surface of the substrate 200 cannot be abutted. That is, the position does not overlap the substrate 200 when viewed from above).

In order to fix the substrate 200 on the jig 74 using the pressing portion 80 , first, the conveyor 40 is driven to move the substrate 200 above the support portion 70 . Then, the actuator 82 is driven to move the pressing portion 80 to the contact position. Next, the height of the support table 72 is increased, and the tips of the support pins 76 are brought into contact with the lower surface of the substrate 200 . Next, the height of the support table 72 is further increased to move the substrate 200 upward so that the lower surface of the substrate 200 is separated from the conveyor 40 , and the upper surface of the substrate 200 is brought into contact with the pressing portion 80 . As a result, the substrate 200 is sandwiched between the support pins 76 and the pressing portions 80 and fixed to the jig 74 .

The display unit 50 is a display for displaying various information. The display unit 50 may function as an operating device (a so-called touch panel) for accepting user instructions. In addition to the display unit 50, an operating device such as a keyboard may be provided.

As shown in FIG. 2, the substrate processing apparatus 10 further includes a barcode reader 26 and a communication interface 52. As shown in FIG. The barcode reader 26 is a device for reading information from the barcode 202 attached to the upper surface of the substrate 200 . The barcode 202 is an image coded with identification information for identifying the substrate 200 . The barcode reader 26 is provided at the loading port through which the substrate 200 is transported into the substrate processing apparatus 10 . The barcode reader 26 reads the identification information from the barcode 202 of the substrate 200 before the substrate 200 is loaded from the loading port and fixed on the jig 74 .

The communication interface 52 is an interface for communicating with the server 100 installed separately from the substrate processing apparatus 10 via a LAN (Local Area Network). Note that the LAN may be a wired LAN or a wireless LAN. In addition, below, an interface is described as "I/F."

Server 100 stores information table 102 . The information table 102 includes, for each of a plurality of substrates, identification information (for example, "s01") for identifying the substrate and judgment indicating whether or not the upper surface of the substrate 200 should be pressed using the pressing portion 80. information and are stored in association with each other. The determination information is set to either "OK" indicating that the upper surface of the substrate 200 should be pressed or "NG" indicating that the upper surface of the substrate 200 should not be pressed. For example, if the board identified by the identification information "s01" has strength enough to withstand the load applied to the board by the pressing part 80, the determination information "OK" is associated with the identification information "s01". is set by the administrator of the substrate processing apparatus 10 . Further, for example, when the board identified by the identification information "s02" does not have the strength to withstand the load applied to the board by the pressing portion 80, the determination information " NG" is set by the administrator.

The control section 54 is a device that controls each section in the substrate processing apparatus 10 . The control unit 54 is composed of a CPU and a memory. As shown in FIG. 2, the control unit 54 includes the moving mechanism 20, the mounting unit 24, the barcode reader 26, the component feeder 30, the conveyor 40, the display unit 50, the communication I/F 52, the support unit 70, the negative pressure generator 78, and the , and is communicatively connected to the actuator 82 . The control unit 54 controls each unit (20, 24, 30, 40, 50, 52, 70, 78, 80) to mount the electronic component 210 on the board 200, transport the jig 74 and the board 200, and carry out various operations. Display information, etc.

The control unit 54 further stores a drive flag 54a. The drive flag 54a is set to either "ON" indicating that the negative pressure generator 78 should be driven or "OFF" indicating that the negative pressure generator 78 should not be driven. The drive flag 54a is set by a determination process which will be described later.

(Support pin 76; FIG. 3)
As shown in FIG. 3, the support pin 76 includes a support pin body 76a and a suction portion 76b. The adsorption portion 76b is a cup-shaped component made of rubber. The suction portion 76b is open upward, and the opening communicates with a passage 76c passing through the suction portion 76b and the support pin main body 76a. The passage 76c communicates with a tube 78a extending from the negative pressure generator 78 via a passage 74a in the jig 74 and a passage (not shown) in the support base. By driving the negative pressure generator 78, the air in the opening of the adsorption portion 76b is sucked into the negative pressure generator 78 via the passages 76c, 74a and the tube 78a. As a result, when the adsorption portion 76 b is in contact with the substrate 200 , the pressure in the space between the substrate 200 and the adsorption portion 76 b becomes negative, and the adsorption portion 76 b adsorbs the substrate 200 .

In order to fix the substrate 200 on the jig 74 using the suction portion 76 b , first, the conveyor 40 is driven to move the substrate 200 above the support portion 70 . Then, the actuator 82 is driven to move the pressing portion 80 to the non-contact position. Next, the height of the support table 72 is increased, and the suction portions 76b of the support pins 76 are brought into contact with the lower surface of the substrate 200. Then, as shown in FIG. Here, the negative pressure generator 78 is driven when the height of the support base 72 becomes equal to or higher than a predetermined height after the suction portion 76b contacts the substrate 200 and the drive flag indicates "ON". By driving the negative pressure generator 78 , the adsorption portion 76 b is adsorbed to the substrate 200 . Thereby, the substrate 200 is fixed to the support pins 76 and the substrate 200 is fixed to the jig 74 .

(Determination process; Fig. 4)
A determination process for determining whether or not the substrate 200 should be fixed using the pressing portion 80 will be described with reference to FIG. 4 .

In S<b>10 , the control unit 54 monitors acquisition of identification information of the substrate 200 from the barcode reader 26 . If the identification information is acquired from the barcode reader 26 (YES in S10), the control unit 54 proceeds to S12.

In S<b>12 , the control unit 54 supplies an information request for requesting determination information to the server 100 via the communication I/F 52 . The information request includes the obtained identification information. When the server 100 acquires the information request from the control unit 54 , the server 100 identifies the determination information associated with the identification information in the information request from the information table 102 . The server 100 then supplies the specified determination information to the control unit 54 .

In S<b>14 , the control unit 54 acquires determination information as a response to the information request from the server 100 via the communication I/F 52 .

In S<b>16 , the control unit 54 uses the acquired determination information to determine whether or not the upper surface of the substrate 200 should be pressed using the pressing unit 80 . When the obtained determination information indicates "OK", the control unit 54 determines that the upper surface of the substrate 200 should be pressed (YES in S16), and proceeds to S18.

In S18, the control section 54 drives the actuator 82 to move the position of the pressing section 80 to the contact position. In S20, the control unit 54 sets the driving flag 54a to "OFF". Accordingly, the substrate 200 can be fixed on the jig 74 using the pressing portion 80 . When S20 ends, the process returns to S10.

Further, when the acquired determination information indicates "NG", the control unit 54 determines that the upper surface of the substrate 200 should not be pressed (NO in S16), and proceeds to S22.

In S22, the control section 54 drives the actuator 82 to move the position of the pressing section 80 to the non-contact position. In S24, the controller 54 sets the drive flag 54a to "ON". Accordingly, the substrate 200 can be fixed on the jig 74 using the suction portion 76b. When S18 ends, the process returns to S10.

(Effect of this embodiment)
The substrate processing apparatus 10 of the embodiment has been described above. As is clear from the above description, the substrate processing apparatus 10 uses identification information acquired from the substrate 200 to acquire determination information corresponding to the substrate 200 (S14 in FIG. 4). When the substrate processing apparatus 10 determines that the upper surface of the substrate 200 should not be pressed using the pressing portion 80 by using the acquired determination information (NO in S16), the substrate processing apparatus 10 changes the position of the pressing portion 80. It is moved to the non-contact position (S22). As a result, it is possible to prevent the upper surface of the substrate 200 from being erroneously pressed by the pressing portion 80 .

Further, for example, a comparative example is assumed in which a warning message is displayed on the display unit 50 when it is determined that the upper surface of the substrate 200 should not be pressed using the pressing unit 80 (NO in S16). In this comparative example as well, it is possible to prevent the upper surface of the substrate 200 from being erroneously pressed by the pressing portion 80 . However, in this comparative example, the administrator needs to see the warning message and move the pressing portion 80 to the non-contact position. In contrast, in this embodiment, when the substrate processing apparatus 10 determines that the upper surface of the substrate 200 should not be pressed (NO in S16), the position of the pressing portion 80 is automatically moved to the non-contact position. (S22). The administrator's convenience can be improved by eliminating the administrator's operation. In addition, the configuration of the above comparative example may be employed in the modified example.

Also, in the above comparative example, the administrator needs to see the warning message and drive the negative pressure generator 78 . On the other hand, in this embodiment, when the substrate processing apparatus 10 determines that the upper surface of the substrate 200 should not be pressed (NO in S16), it sets the drive flag 54a to "ON" (S24). The pressure generator 78 is automatically driven. The administrator's convenience can be improved by eliminating the administrator's operation.

Further, in the above embodiment, the substrate processing apparatus 10 uses the barcode reader 26 to acquire identification information from the barcode 202 of the substrate 200 . According to such a configuration, when processing a plurality of substrates, is it necessary to obtain identification information for identifying each substrate from each substrate and use the obtained identification information to press the upper surface of each substrate? You can decide whether or not

Further, in the above embodiment, the bar code 202 in which the identification information is coded is attached to the substrate 200, and the determination information is stored in the server 100 in association with the identification information. According to such a configuration, the administrator can access the server 100 and manage the determination information. For example, by accessing the server 100, the administrator can collectively set determination information for a plurality of substrates.

(correspondence relationship)
The mounting unit 24, the support section 70, the pressing section 80, and the control section 54 are examples of the "substrate processing section," the "support section," the "pressing section," and the "control section," respectively. The identification information is an example of "substrate information". The adsorption part 76b is an example of the "adsorption part." The barcode 202 is an example of the "storage section". The server 100 is an example of "memory".

Points to note regarding the substrate processing apparatus described in the embodiments will be described. The control unit 54 may issue a predetermined warning (for example, warning message, warning sound) instead of the processing of S22 and S24 in FIG.

Further, the “suction portion” is not limited to the suction portion 76 b that suctions the substrate 200 by the negative pressure generated by the negative pressure generator 78 , and may be, for example, a suction cup attached to the tip of the support pin 76 .

Further, in the above embodiment, the substrate 200 is attached with a bar code 202 coded with identification information. Alternatively, a QR code (registered trademark) that encodes identification information or an IC tag that stores identification information may be attached to the substrate 200 . In this modified example, the QR code and the IC tag are examples of the "storage unit". Also, a character string indicating identification information may be attached to the substrate 200 . In this case, the substrate processing apparatus 10 may capture the character string using a camera and acquire the identification information using OCR. Generally speaking, "substrate information" is obtained from the substrate.

Also, in the above embodiment, the bar code 202 is an image that encodes identification information. Alternatively, barcode 202 may be an image that encodes the judgment information. In this modified example, the judgment information is an example of "board information".

Further, in the above embodiments, the substrate processing apparatus 10 acquires identification information from the substrate 200 . Alternatively, the substrate processing apparatus 10 may acquire identification information (that is, substrate information) from a device other than the substrate 200 (for example, a server).

Also, the “memory” is not limited to the server 100 and may be, for example, a memory within the substrate processing apparatus 10 .

Further, the "substrate processing apparatus" is not limited to a component mounting apparatus, and may be a printing machine that applies solder to a board, or an inspection machine that inspects a board on which components are mounted.

The technical elements described in this specification or in the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims as of the filing. In addition, the techniques exemplified in this specification or drawings achieve multiple purposes at the same time, and achieving one of them has technical utility in itself.

10: Substrate processing apparatus, 12: Housing, 20: Moving mechanism, 22: Moving base, 24: Mounting unit, 24a: Suction nozzle, 24b: Nozzle support, 26: Bar code reader, 30: Parts feeder, 40: Conveyor, 50: Display unit, 52: Communication I/F, 54: Control unit, 54a: Drive flag, 70: Support unit, 72: Support base, 74: Jig, 74a: Passage, 76: Support pin, 76a: Support pin main body, 76b: adsorption part, 76c: passage, 78: negative pressure generator, 78a: tube, 80: holding part, 82: actuator, 100: server, 102: information table, 200: substrate, 202: barcode , 210: electronic components

Claims (3)

a substrate processing unit capable of processing a substrate;
a support part for supporting the lower surface of the substrate when the substrate processing part processes the substrate;
a pressing portion capable of pressing the upper surface of the substrate supported by the supporting portion;
a control unit;
with
the substrate includes a storage unit that stores substrate information related to the substrate;
The substrate information includes identification information for identifying the substrate,
The identification information is stored in a memory in association with determination information indicating whether or not the upper surface of the substrate should be pressed,
The control unit
acquiring the substrate information from the storage unit of the substrate before processing the substrate by the substrate processing unit;
using the identification information included in the obtained substrate information to obtain the determination information associated with the identification information from the memory;
causing the holding part to hold the upper surface of the substrate when the acquired judgment information indicates that the upper surface of the substrate should be held;
when the acquired determination information indicates that the upper surface of the substrate should not be pressed, the pressing unit does not press the upper surface of the substrate;
Substrate processing equipment. The support section includes an adsorption section that adsorbs to the lower surface of the substrate,
The control unit
2. The substrate processing apparatus according to claim 1, wherein when said acquired determination information indicates that said upper surface of said substrate should not be pressed, said adsorption unit is operated to cause said substrate to be adsorbed by said adsorption unit. the pressing portion is positioned at either a contact position where it can contact the upper surface of the substrate or a non-contact position where it cannot contact the upper surface of the substrate;
The control unit
moving the holding portion to the contact position when the acquired determination information indicates that the upper surface of the substrate should be held;
3. The substrate processing apparatus according to claim 1, wherein said holding portion is moved to said non-contact position when said acquired determination information indicates that said upper surface of said substrate should not be held.

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