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JP6957435B2 - 熱伝導性シリコーン組成物及びその硬化物 - Google Patents

熱伝導性シリコーン組成物及びその硬化物 Download PDF

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Publication number
JP6957435B2
JP6957435B2 JP2018199530A JP2018199530A JP6957435B2 JP 6957435 B2 JP6957435 B2 JP 6957435B2 JP 2018199530 A JP2018199530 A JP 2018199530A JP 2018199530 A JP2018199530 A JP 2018199530A JP 6957435 B2 JP6957435 B2 JP 6957435B2
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JP
Japan
Prior art keywords
group
component
conductive silicone
thermally conductive
mass
Prior art date
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Active
Application number
JP2018199530A
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English (en)
Japanese (ja)
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JP2020066670A (ja
Inventor
俊晴 森村
晃洋 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2018199530A priority Critical patent/JP6957435B2/ja
Priority to PCT/JP2019/030982 priority patent/WO2020084868A1/ja
Priority to CN201980060877.0A priority patent/CN112714784B/zh
Priority to KR1020217006906A priority patent/KR20210080351A/ko
Priority to TW108128867A priority patent/TWI813738B/zh
Publication of JP2020066670A publication Critical patent/JP2020066670A/ja
Application granted granted Critical
Publication of JP6957435B2 publication Critical patent/JP6957435B2/ja
Active legal-status Critical Current
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • C08L83/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Glass Compositions (AREA)
JP2018199530A 2018-10-23 2018-10-23 熱伝導性シリコーン組成物及びその硬化物 Active JP6957435B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018199530A JP6957435B2 (ja) 2018-10-23 2018-10-23 熱伝導性シリコーン組成物及びその硬化物
PCT/JP2019/030982 WO2020084868A1 (ja) 2018-10-23 2019-08-06 熱伝導性シリコーン組成物及びその硬化物
CN201980060877.0A CN112714784B (zh) 2018-10-23 2019-08-06 导热性有机硅组合物及其固化物
KR1020217006906A KR20210080351A (ko) 2018-10-23 2019-08-06 열전도성 실리콘 조성물 및 그의 경화물
TW108128867A TWI813738B (zh) 2018-10-23 2019-08-14 熱傳導性矽氧組成物及其硬化物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018199530A JP6957435B2 (ja) 2018-10-23 2018-10-23 熱伝導性シリコーン組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JP2020066670A JP2020066670A (ja) 2020-04-30
JP6957435B2 true JP6957435B2 (ja) 2021-11-02

Family

ID=70330478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018199530A Active JP6957435B2 (ja) 2018-10-23 2018-10-23 熱伝導性シリコーン組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP6957435B2 (zh)
KR (1) KR20210080351A (zh)
CN (1) CN112714784B (zh)
TW (1) TWI813738B (zh)
WO (1) WO2020084868A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023162636A1 (zh) * 2022-02-28 2023-08-31

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4732400Y1 (zh) 1968-04-23 1972-09-29
JP2536120B2 (ja) 1989-01-25 1996-09-18 日本電気株式会社 電子部品の冷却構造
JP2938340B2 (ja) 1994-03-29 1999-08-23 信越化学工業株式会社 熱伝導性複合シート
JP3075132B2 (ja) 1995-03-06 2000-08-07 信越化学工業株式会社 放熱シート
JP3498823B2 (ja) 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物
JP2002069300A (ja) * 2000-08-31 2002-03-08 Dow Corning Toray Silicone Co Ltd 防振性シリコーンコンパウンド
JP4438937B2 (ja) * 2004-02-05 2010-03-24 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
US20080269405A1 (en) * 2004-04-01 2008-10-30 Toshihiko Okamoto Single-Component Curable Composition
JP2007161806A (ja) * 2005-12-12 2007-06-28 Shin Etsu Chem Co Ltd 熱伝導性シリコーンゴム組成物
JP2009256400A (ja) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd 半導体素子用シリコーン接着剤
JP2013222836A (ja) * 2012-04-17 2013-10-28 Shin Etsu Chem Co Ltd 放熱性及びリワーク性に優れる電子装置及びその製造方法
JP5729882B2 (ja) * 2012-10-23 2015-06-03 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2014105283A (ja) * 2012-11-28 2014-06-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
US10030122B2 (en) * 2015-02-09 2018-07-24 Wacker Chemical Corporation Curable compositions
WO2018180997A1 (ja) * 2017-03-31 2018-10-04 バンドー化学株式会社 熱伝導性シート

Also Published As

Publication number Publication date
CN112714784B (zh) 2022-12-27
TWI813738B (zh) 2023-09-01
JP2020066670A (ja) 2020-04-30
TW202016219A (zh) 2020-05-01
CN112714784A (zh) 2021-04-27
WO2020084868A1 (ja) 2020-04-30
KR20210080351A (ko) 2021-06-30

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