JP6765876B2 - Development equipment, process cartridges, and image forming equipment, and methods for reproducing the developing equipment. - Google Patents

Description

The present invention relates to a developing apparatus that develops an electrostatic latent image formed on a photosensitive drum, and a process cartridge that forms a developer image on the photosensitive drum and is detachable from the apparatus main body to the image forming apparatus. The present invention also relates to an image forming apparatus for forming an image on a recording medium using a developing agent, and a method for reproducing the developing apparatus.

In an image forming apparatus using electrophotographic technology, first, the photosensitive drum is uniformly charged by a charging roller. Next, the charged photosensitive drum is selectively exposed to form an electrostatic latent image on the photosensitive drum. Then, the electrostatic latent image formed on the photosensitive drum is developed as a toner image by a developing device. The toner image formed on the photosensitive drum is transferred to a recording material such as recording paper or a plastic sheet, and the toner image transferred onto the recording material is fixed to the recording material by heating and pressurizing. Further, the toner remaining on the photosensitive drum after the toner image on the photosensitive drum is transferred to the recording material is removed by the cleaning blade.

In such an image forming apparatus, toner replenishment and maintenance of various process means are generally required. In order to facilitate the toner replenishment and maintenance, a process cartridge in which process means such as a photosensitive drum, a charging roller, a developing device, and a cleaning blade are integrated as a cartridge has been put into practical use. Since this process cartridge is detachable from the main body of the image forming apparatus, it is possible to easily replace the process means and replenish the toner by replacing the process cartridge.

According to this process cartridge method, since the maintenance of the image forming apparatus can be performed by the user himself / herself, the operability can be remarkably improved, and the image forming apparatus having excellent usability can be provided. Therefore, the process cartridge method is widely adopted in the image forming apparatus.

Here, the conventional process cartridge will be described. The photoconductor unit C has a cleaning frame body 13 that integrally supports the photosensitizing drum 10, the charging roller 11, and the cleaning blade 12. Further, the developing unit D integrally supports the developing roller 23, the supply roller 22, and the developing blade 24 as a regulating member, and the developing frame 21 constitutes the developing agent storage unit 20 for storing the developing agent. have. The developing roller 23 is a roller that carries a developer for developing an electrostatic latent image formed on the photosensitive drum 10, and the supply roller 22 is a roller for supplying the developer to the developing roller 23. Further, the developing blade 24 is a blade for regulating the layer thickness of the developing agent supported on the developing roller 23. The developing unit D includes bearing members 31 and bearing members 39 that support the developing rollers 23 and the supply rollers 22 at both ends of the developing frame 21 in the direction of the rotation center axis of the developing rollers 23 and the supply rollers 22.

Here, the technique disclosed in Patent Document 1 will be described. In the technique disclosed in Patent Document 1, holes having openings in the axial direction are provided at the ends of the developing frame 21 in the direction of the rotation center axis of the developing roller 23 and the supply roller 22. The developing blade 24 is fixed to the developing frame 21 with a screw 50, and the tip of the screw 50 projects into the hole. Further, the bearing member 31 is provided with a through hole. In this way, in the state where the bearing member 31 is attached to the developing frame body 21, the hole of the developing frame body 21 and the through hole of the bearing member 31 communicate with each other. Then, in a state where the hole of the developing frame 21 and the through hole of the bearing member 31 communicate with each other, the hole of the developing frame 21 and the through hole of the bearing member 31 are formed from the through hole of the bearing member 31. The conductive resin melted in the space is injected and hardened. In the technique disclosed in Patent Document 1, the bearing member 31 and the developing frame 21 are coupled to each other by using the conductive resin in this way. As a result, the productivity of manufacturing the developing unit D is improved. Further, the resin molding portion formed by solidifying the conductive resin is electrically connected to the developing blade 24. Therefore, by supplying power to the power feeding position in the resin molding portion, it is possible to supply power to the developing blade 24 as well.

Further, in the technique disclosed in Patent Document 2, a method of disassembling the bearing member 31 and the developing frame 21 is disclosed. Specifically, in the technique disclosed in Patent Document 2, the screw 50 is inserted from the outer wall of the developing frame 21 toward the columnar hole formed at the end of the developing frame 21. As a result, the screw 50 projects in the conductive resin molded portion formed in the hole of the developing frame 21 in the direction orthogonal to the axial direction of the hole. In the technique disclosed in Patent Document 2, the conductive resin molded portion is fixed to the bearing member 31 and fixed to the developing frame 21 only by the screws 50. Therefore, the conductive resin molded portion is detached from the developing frame body 21 simply by removing the screw 50, and the bearing member 31 and the developing frame body 21 can be easily disassembled.

Japanese Patent No. 5460824 Japanese Unexamined Patent Publication No. 2013-134299

However, in the technique disclosed in Patent Document 2, when the bearing member 31 is to be removed without removing the screw 50 fixing the developing blade 24, the resin molded portion may be broken. Further, even when the bearing member 31 is to be removed after removing the screw 50, if the resin molded portion adheres to the developing frame 21, the resin molded portion is attempted to be removed. May break. When the resin molded portion is broken, when the fracture surface is adhered with an adhesive or the like and the bearing member 31 and the developing frame 21 are reconnected, the conductive path from the feeding position to the developing blade 24 is established. It could be unstable.

Therefore, the present invention functions as a conductive path of the resin molded portion when the bearing member and the developing frame are reconnected when the bearing member and the developing frame are disassembled due to the breakage of the resin molded portion. It is an object of the present invention to provide a developing apparatus capable of suppressing a decrease in the bearing. Further, a process cartridge, an image forming apparatus, and a method for reproducing the developing apparatus, which can suppress deterioration of the function of the resin molded portion as a conductive path when the bearing member and the developing frame are reconnected, are used. The purpose is to provide.

In order to achieve the above object, the developing apparatus of the present invention
A developing device that develops an electrostatic latent image formed on an image carrier with a developing agent.
The frame of the developing device and
A developer carrier that supports a developer and a developer
A regulatory member that regulates the amount of developer carried on the developer carrier, and
A bearing member that rotatably supports the developer carrier and
It has a conductive resin member for supplying electric power to the regulating member, and has a resin member for fixing the bearing member to the frame body.
In a developing apparatus, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulation member.
It is characterized by having a connecting means for connecting the first resin member and the second resin member and electrically connecting the first resin member and the second resin member.

Further, in order to achieve the above object, the process cartridge of the present invention can be used.
A process cartridge that can be attached to and detached from the main body of the image forming device.
With the above developing device
It has an image carrier on which a developer image is formed, and
The electrostatic latent image formed on the image carrier is developed by the developing apparatus, so that a developer image for forming an image on a recording medium is formed on the image carrier.

Further, in order to achieve the above object, the image forming apparatus of the present invention can be used.
With the above developing device
It has an image carrier on which a developer image is formed, and
The electrostatic latent image formed on the image carrier is developed by the developing apparatus to form a developer image on the image carrier.
The developer image formed on the image carrier is transferred to a recording medium to form an image on the recording medium.

Further, in order to achieve the above object, the reproduction method according to the present invention is:
A method for reproducing an electrostatic latent image formed on an image carrier, which is a method for reproducing a developing device that develops an electrostatic latent image with a developing agent.
The frame of the developing device, the developing agent carrier that supports the developing agent, and
A regulatory member that regulates the amount of developer carried on the developer carrier, and
A bearing member that rotatably supports the developer carrier and
It has a conductive resin member for supplying electric power to the regulating member, and has a resin member for fixing the bearing member to the frame body.
In a method for reproducing a developing device, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulation member.
The first resin member and the second resin member are connected by a connecting means, and the first resin member and the second resin member are electrically connected to each other.

According to the present invention, when the bearing member and the developing frame are disassembled due to the breakage of the resin molded portion, the function of the resin molded portion as a conductive path is reduced when the bearing member and the developing frame are reconnected. Provided is a developing device capable of suppressing the operation. Further, a process cartridge, an image forming apparatus, and a method for reproducing the developing apparatus, which can suppress deterioration of the function of the resin molded portion as a conductive path when the bearing member and the developing frame are reconnected, are used. provide.

Sectional drawing which shows the whole structure of the image forming apparatus which concerns on Example 1. Perspective view of the developing unit according to the first embodiment Perspective view showing how the developing blade is attached to the developing unit. Side view showing a state in which the developing blade is attached to the developing frame. Perspective view showing a state before the bearing member is attached to the developing frame. The figure which shows the state which the bearing member was positioned with respect to the developing frame body. Cross-sectional view showing how a molten conductive resin is injected into a joint. Cross-sectional view of the vicinity of the resin molding part after the molten resin has hardened A cross-sectional view showing a state in which the bearing member is removed from the developing frame. The figure which shows the state which combined the broken part of the resin molded part which concerns on Example 1. The figure which shows the state of connecting the broken part of the resin molded part which concerns on Example 2. The figure which shows the state of connecting the broken part of the resin molded part which concerns on Example 3.

Embodiments of the present invention will be illustrated below with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in the embodiments should be appropriately changed depending on the configuration of the apparatus to which the invention is applied, various conditions, and the like. It is not intended to limit the scope to the following embodiments.

(Example 1)
<Image forming device 100>
With reference to FIG. 1, a schematic configuration of the entire image forming apparatus 100 will be described along the flow of the recording medium P. FIG. 1 is a cross-sectional view showing the overall configuration of the image forming apparatus 100 according to the first embodiment. In the apparatus main body A of the image forming apparatus 100, a latent image is formed on the photosensitive drum 10 as an image carrier by the scanner unit 1 that has received the latent image data. Then, the developer on the peripheral surface of the developing roller 23 as the developer carrier is transferred to the photosensitive drum 10 according to the latent image, so that the latent image on the photosensitive drum 10 is visualized as a developer image. .. Further, the image forming apparatus 100 is provided with a paper feed cassette 2 capable of accommodating the recording medium P, and the paper feed unit 3 feeds the recording media P one by one. Then, the fed recording medium P is conveyed to the resist roller 4. The developer image on the photosensitive drum 10 is transferred by the transfer roller 5 to the recording medium P conveyed by the resist roller 4. Subsequently, the recording medium P is conveyed to the fixing unit 6, and the developer image is fixed by the fixing roller 7. After that, the recording medium P after the image is fixed is discharged to the paper ejection unit 9 by the ejection unit 8.

<Process cartridge B>
The process cartridge B according to the present embodiment is configured by integrally forming a photoconductor unit C and a developing unit D as a developing device into a cartridge, and is removable from the device main body A. The photoconductor unit C includes a photosensitive drum 10, a charging roller 11 as a charging means, a cleaning blade 12 as a cleaning means, a cleaning frame 13, and the like.

The developing unit D includes a developing roller 23 as a developing means, a supply roller 22, a developing blade 24, a developing agent storage unit 20, a developing frame body 21 as a frame body constituting the developing agent storage unit 20, and the like. In this embodiment, the developing means develops as follows. First, the developer in the developer storage unit 20 is supplied to the developing roller 23 by the rotation of the supply roller 22, and the developing blade 24 as a regulating member regulates the layer thickness of the developer layer on the developing roller 23. Then, the developer image is formed on the photosensitive drum 10 by transferring the developer to the photosensitive drum 10 according to the latent image. Further, in the cleaning means according to the present embodiment, the cleaning blade 12 removes the developer remaining on the photosensitive drum 10 after the developer image on the photosensitive drum 10 is transferred to the recording medium P.

<Development unit D>
The developing unit D according to this embodiment will be described with reference to FIGS. 1, 2, and 3. FIG. 2 is a perspective view of the developing unit D, and FIG. 3 is a perspective view showing how the developing blade 24 is attached to the developing unit D. As described above, the developing unit D includes a developing agent, a developing agent storage unit 20 for storing the developing agent, a supply roller 22, a developing roller 23, a developing blade 24, a developing frame 21, and the like. The developing blade 24 is composed of an abutting portion 26 that abuts on the developing roller 23 and a metal support sheet metal 25 that supports the abutting portion 26. As the contact portion 26, an elastic one such as rubber or thin metal is used. Here, in the present embodiment and the conventional example, a stainless steel material having a thickness of 0.08 mm is used as the contact portion 26. The developing blade 24 composed of these parts is fixed to the developing frame 21 by screws 50 (screws 50a and 50b) as fixing members made of a conductive material. Further, the developing roller 23 and the supply roller 22 are supported by the bearing member 31. As described above, the developing unit D may form a part of the process cartridge B, or may be independently detachable from the device main body A of the image forming apparatus 100.

Next, the configuration of the developing unit D according to the first embodiment will be described with reference to FIGS. 2 to 8. Here, in particular, the method of connecting the bearing member 31 to the developing frame 21 and the configuration of the conductive path for supplying electric power to the developing blade 24 are in line with the order of assembling the developing blade 24 and the bearing member 31. Will be explained in detail. Here, FIGS. 3 to 8 are explanatory views showing how the developing unit D according to the present embodiment is assembled, respectively. Here, the components are assembled to the developing frame 21 in a state where the developing frame 21 is filled with the developer and the supply rollers 22 are assembled to the developing frame 21.

<Assembly of developing blade 24>
FIG. 3 is a perspective view showing a state before assembling the developing blade 24 to the developing frame 21. In this state, the bearing member 31 (see FIG. 2) has not yet been attached to the developing frame 21. Further, FIG. 4 is a side view showing a state in which the developing blade 24 is attached to the developing frame 21. In this state, the bearing member 31 is not yet attached to the developing frame 21.

When assembling the developing blade 24 to the developing frame 21, first, the developing blade 24 is fixed to the two seating surfaces 27 provided on the developing frame 21 with screws 50, respectively. Here, as shown in FIG. 3, one screw hole 27a (through hole) penetrates the developing frame body 21 so as to communicate with the joint portion 32 provided on the joint surface with the bearing member 31. Therefore, when the tightening of the screw 50 is completed, the screw tip 51 protrudes into the space of the joint portion 32 as shown in FIG. Here, assembling the developing blade 24 to the developing frame 21 is a very important step for realizing stable image formation. Therefore, the developing blade 24 may be assembled while adjusting the position of the developing blade 24 so that the developing blade 24 can be mounted at a predetermined mounting position.

<Assembly of bearing member 31>
FIG. 5 is a perspective view showing a state before the bearing member 31 is attached to the developing frame body 21. Further, FIG. 6 is a diagram showing a state in which the bearing member 31 is positioned with respect to the developing frame body 21. Specifically, FIG. 6A is a side view of the developing unit D in a state where the bearing member 31 is attached to the developing frame 21. Further, FIG. 6B is a partial cross-sectional view of the developing unit D in a state where the bearing member 31 is positioned with respect to the developing frame body 21. Here, the bearing member 31 has a bearing portion 31d that rotatably supports the end of the rotating shaft of the developing roller 23, and a bearing portion 31e that rotatably supports the end of the rotating shaft of the supply roller 22. ing. Further, the bearing member 31 includes a positioning unit 31a for positioning the bearing member 31 with respect to the developing frame 21, a positioning unit 31b, a positioning unit 31c, and an injection unit 33 for injecting molten resin. It is provided.

Here, as the material of the bearing member 31, a resin having excellent slidability (for example, polyacetal resin or the like) is used. Further, in this embodiment, a material that is incompatible with the material of the bearing member 31 is selected as the molten resin to be injected into the injection unit 33. Further, as shown in FIG. 6, the injection portion 33 provided in the bearing member 31 includes an injection port 33a, a resin flow path portion 33b, a step portion 35 for reducing the inner diameter of the resin flow path portion 33b, and an injection nozzle portion. It has 34 (see FIG. 6B).

In this embodiment, the injection port 33a to the injection nozzle portion 34 are all flow paths of the molten resin. Further, the injection port 33a to the injection nozzle portion 34 penetrate the bearing member 31 and communicate with the joint portion 32 which is a recess provided in the developing frame body 21. Then, a space filled with the molten resin is formed by this flow path (from the injection port 33a to the injection nozzle portion 34), the joint portion 32, and the screw tip 51 of the screw 50 protruding into the joint portion 32. .. The assembling of the developing frame body 21 and the bearing member 31 is related to the positioning portions 31a to 31c (see FIG. 5) of the bearing member 31 and the positioning portions 21a to 21c (see FIG. 3) of the developing frame body 21. It is done by matching.

<Method of connecting the bearing member 31 to the developing frame 21>
FIG. 7 is a cross-sectional view showing how the molten conductive resin is injected into the joint portion 32. Further, FIG. 8 is a cross-sectional view of the vicinity of the resin molding portion 40 after the molten resin has hardened. When injecting the molten conductive resin into the joint portion 32, the nozzle tip 52 of the resin injection device (not shown) for injecting the molten resin is brought into contact with the injection port 33a of the injection portion 33. Then, an appropriate amount of the molten conductive resin is injected into the space of the joint portion 32 of the developing frame 21 via the resin flow path portion 33b of the bearing member 31. The direction of the flow of the molten resin is the arrow Y direction. Immediately after the injection, the injected conductive resin solidifies (cures) and becomes the resin molded portion 40 (FIG. 8). As a result, the work of connecting the developing frame 21 and the bearing member 31 is completed.

Then, as shown in FIG. 8, the resin molding portion 40 is bonded to the screw 50 at the joint portion 32 of the developing frame 21 by cooling and solidifying the resin around the screw tip 51 of the screw 50. As a result, the resin molding portion 40 is fixed to the developing frame body 21. This is because the screw tip 51 functions as a stopper for preventing the resin molded portion 40 from coming off. Further, since the screw 50 is fastened to the developing frame body 21, the resin molding portion 40 is also fixed to the developing frame body 21. On the other hand, the resin molded portion 40 is molded into a shape having a step corresponding to the step portion 35 of the bearing member 31. Then, the step shape of the resin molding portion 40 is such that the resin molding portion 40 engages with the step portion 35 of the bearing member 31 in a direction opposite to the direction in which the bearing member 31 is assembled to the developing frame body 21. Suppresses the bearing member 31 from coming off.

In this embodiment, as described above, in the space filled with the molten resin material, the width of the portion where the injection port 33a and the joint portion 32 communicate with each other (the inner diameter of the hole in the vicinity of the step portion 35) is the injection port 33a. It is narrower than the width (inner diameter) of the joint portion 32 and the width (inner diameter) of the joint portion 32. As a result, the resin molding portion 40 is fixed to the developing frame body 21 so that the resin molding portion 40 does not come off from the bearing member 31. Further, as described above, the resin molding portion 40 is fixed to the developing frame 21 by the screws 50. Therefore, the developing frame 21 and the bearing member 31 are coupled.

The resin molded portion 40 shrinks only a small amount when it cools and solidifies. Due to this property, after the resin molding portion 40 is solidified, the resin around the screw 50 is in a state of pressing the screw 50. Further, in the state where the resin molding portion 40 is solidified, the resin around the step portion 35 and the injection nozzle portion 34 makes the step portion 35 and the injection nozzle portion 34 approach each other in the direction in which the step portion 35 and the injection nozzle portion 34 approach each other. Pressing. As a result, the resin molded portion 40 is firmly fixed to the bearing member 31. Further, a force acts on the developing frame 21 in the direction in which the bearing member 31 and the developing frame 21 approach each other. Therefore, the bearing member 31 is in a state of pressing the developing frame body 21, and the adhesion between the bearing member 31 and the developing frame body 21 is improved. In particular, in the space filled with the molten resin, the screw 50 protrudes in the direction in which the resin molding portion 40 exits the joint portion 32 and intersects (orthogonally) the direction in which the bearing member 31 and the developing frame 21 are formed. It can be fixed more firmly.

In this embodiment, the developing frame 21 and the bearing member 31 are coupled by the resin molding portion 40 formed by solidifying the conductive resin injected into the joint portion 32 in this way. Then, by this coupling, the support sheet metal 25 and the metal screw 50 are electrically connected, and the screw 50 and the resin molding portion 40 are electrically connected, so that the support sheet metal 25 is connected to the resin molding portion. Up to 40 electrical paths are formed. At this time, the conductive resin around the screw tip 51 cools and solidifies, and the resin molding portion 40 shrinks. As a result, the resin molding portion 40 is brought into close contact with the screw 50, and the screw 50 and the resin molding portion 40 are stably and electrically connected.

<Reproduction method of developing unit D>
FIG. 9 is a cross-sectional view showing a state in which the bearing member 31 according to the first embodiment is removed from the developing frame body 21. Further, FIG. 10 is a diagram showing a state in which the fractured portions 41a and 41b of the resin molding portion 40 according to the first embodiment are combined. When the developing unit D is reproduced (reused), at least the bearing member 31 is removed from the developing frame 21 when the developing roller 23 and the developing blade 24 are replaced and cleaned, and the developing roller 23 is removed from the developing unit D. It needs to be removable. Here, the developing frame 21 and the bearing member 31 are fixed by the resin molding portion 40. Therefore, as shown in FIG. 9, if the resin molding portion 40 fixed to the screw 50 is broken in the middle (broken into the first conductive resin member 40a and the second conductive resin member 40b), the bearing member 31 can be broken. It can be removed from the developing frame 21. Further, if the bearing member 31 is to be removed without removing the screw 50 fixing the developing blade 24, the resin molded portion may be broken. Further, even when the bearing member 31 is to be removed after removing the screw 50, if the resin molded portion adheres to the developing frame 21, the resin molded portion is attempted to be removed. There is a risk that 40 will break. In this case, the resin molding portion 40, which serves as a conductive path from the power supply member (not shown) to the developing blade 24, is broken in the middle. Therefore, for example, simply connecting the fracture surface of the resin molding portion 40 with an adhesive makes the conductive path from the power supply member to the developing blade 24 unstable. After the development unit D is reproduced, the conductive path from the power supply member to the development blade 24 becomes unstable, which may make it impossible to form an image well on the recording medium P.

Therefore, in this embodiment, as shown in FIG. 10, the conductive member 70 (screw in this embodiment) as a connecting member is passed through the first conductive resin member 40a on the bearing member 31 side, and the developing frame is formed. It is engaged (screwed) with the second conductive resin member 40b on the 21 side. Thereby, in this embodiment, the conductive path from the power supply member to the developing blade 24 can be stabilized. At that time, it is desirable to use a screw having a conductive surface as the conductive member 70. When a screw is used as the conductive member 70, the bearing member 31 can be fastened to the developing frame 21 by stabilizing the conductive path and connecting the broken resin molded portion 40. However, the conductive member 70 is not necessarily limited to a screw, and may be a member having conductivity on its surface. The developing frame 21 and the bearing member 31 may be coupled by another method.

Here, when the position where the resin molded portion 40 breaks is near the screw 50, it may be difficult to arrange the conductive member 70 so as to penetrate the broken portion 41. Therefore, in this embodiment, in the resin molding portion 40, the width (outer diameter) of the portion corresponding to the injection nozzle portion 34 is made smaller than the other portions. That is, in the resin molding portion 40, a portion having low strength is provided near the boundary between the bearing member 31 and the developing frame 21. As a result, the resin molding portion 40 can be prevented from breaking at a predetermined location, and the resin molding portion 40 can be prevented from breaking near the screw 50.

As described above, in the present embodiment, the broken resin molded portion 40 is bonded to the broken resin molded portion 40 by penetrating the conductive member 70 (screw) through the fracture surface of the broken resin molded portion 40, and the broken resin molded portion 40 is formed. Is electrically connected. As a result, it is possible to prevent the resin molding portion 40 from deteriorating its function as a conductive path.

(Example 2)
In the second embodiment, the steps up to the step of removing the bearing member 31 in order to reproduce the developing unit D are the same as those in the first embodiment. Here, in the present embodiment, the parts having the same functions as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. In this embodiment, the method of restoring the conductivity of the fractured portions 41 (41a, 41b) generated in the resin molded portion 40 by removing the bearing member 31 is different from that of the first embodiment.

The second embodiment will be described in detail with reference to FIG. FIG. 11 is a diagram showing how the broken portion 41a and the broken portion 41b of the resin molding portion 40 according to the second embodiment are joined. In this embodiment, the conductive grease 60 is applied to both or one of the broken portions 41 generated in the resin molded portion 40, and the conductive grease 60 is interposed (adhered) to a part of the broken portion 41 to cause the broken resin. The molding parts 40 are combined. In this embodiment, an adhesive is applied to the region of the broken portion 41 where the conductive grease 60 is not applied, and the broken resin molded portion 40 is bonded by the adhesive. The method of joining the broken resin molded portion 40 is not necessarily limited to this. For example, the broken resin molding portion 40 may not be bonded at the resin molding portion 40, or may be performed near the resin molding portion 40. Further, the conductive grease 60 may be applied to the broken portion 41, and the broken resin molded portion 40 may be joined by a screw. In such a configuration, after the broken resin molded portion 40 is bonded, the conductive grease 60 is interposed between the broken portions 41. By applying the conductive grease 60, when the developing unit D is reproduced, conductivity can be maintained between the broken portion 41a and the broken portion 41b in the resin molding portion 40. In this embodiment, the conductive grease 60 is applied to the broken portion 41a and the broken portion 41b in the resin molding portion 40, but the present invention is not necessarily limited to this. For example, instead of the conductive grease 60, a thin metal sheet such as aluminum foil may be used. What is interposed between the broken portion 41a and the broken portion 41b is not particularly limited as long as it is deformable and has conductivity on the surface. In addition, in this embodiment, an example using the conductive grease 60 and the adhesive has been described, but the conductive resin member 40a and the second conductive resin member 40b are electrically connected and bonded at the same time by using the conductive adhesive. You may.

As described above, in the present embodiment, in the step of reproducing the developing unit D, the broken resin molded portion 40 is bonded by applying the conductive grease 60 to the broken portion 41 generated in the resin molded portion 40. There is. As a result, even if the resin molding portion 40 is broken, the conductive path from the power supply member to the developing blade 24 can be stabilized by an easy method.

(Example 3)
Next, Example 3 will be described with reference to FIG. FIG. 12 is a diagram showing how the broken portion 41a and the broken portion 41b of the resin molding portion 40 according to the third embodiment are joined. In the third embodiment, the steps up to the step of removing the bearing member 31 in order to reproduce the developing unit D are the same as those in the first embodiment. Here, in the present embodiment, the parts having the same functions as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. In this embodiment, the method of restoring the conductivity of the fractured portion 41 in the resin molded portion 40 is different from that of the first and second embodiments.

In this embodiment, unlike the first embodiment, the broken resin molded portion 40 is bonded by using a rod-shaped metal member 80 that can be heated instead of a conductive screw (conductive member 70). ing. Specifically, in a state where the broken portion 41a and the broken portion 41b are combined and the first conductive resin member 40a and the second conductive resin member 40b are in contact with each other, the heated metal member 80 is moved from the first conductive resin member 40a to the second. It is inserted toward the conductive resin member 40b. As a result, the resin constituting the first conductive resin member 40a and the resin constituting the second conductive resin member 40b are melted so that the metal member 80 penetrates the first conductive resin member 40a and reaches the second conductive resin member 40b. Let me. At this time, the resin constituting the first conductive resin member 40a melted by the metal member 80 and the second resin.
The conductive resin member 40b (corresponding to the first molten resin and the second molten resin) integrally forms a welded portion. Through this welded portion, the first conductive resin member 40a and the second conductive resin member 40b are connected, and the broken resin molded portion 40 can be bonded. In this embodiment, after the welded portion was formed, the metal member 80 was removed from the resin molded portion 40.

As described above, in the third embodiment, as in the first embodiment, even if the resin molding portion 40 is broken, the conductive path from the power supply member to the developing blade 24 is stabilized by an easy method. Can be done. Further, in the third embodiment, the metal member 80 can be extracted and then reproduced. That is, the broken resin molded portion 40 can be bonded without preparing a new member. Therefore, the cost for reproducing the developing unit D can be reduced.

In each example, the method of binding the broken resin molded portion 40 is not necessarily limited to the bonding method in each example. The bonding method is not limited as long as the broken resin molded portion 40 is bonded and the broken resin molded portion 40 is electrically connected.

10 ... Photosensitive drum, 21 ... Development frame, 23 ... Development roller, 24 ... Development blade,
31 ... Bearing member, 40 ... Resin molded part, 41a ... Broken part, 41b ... Broken part,
70 ... Conductive member, D ... Development unit

Claims (12)

A developing device that develops an electrostatic latent image formed on an image carrier with a developing agent.
The frame of the developing device and
A developer carrier that supports a developer and a developer
A regulatory member that regulates the amount of developer carried on the developer carrier, and
A bearing member that rotatably supports the developer carrier and
It has a conductive resin member for supplying electric power to the regulating member, and has a resin member for fixing the bearing member to the frame body.
In a developing apparatus, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulation member.
A developing apparatus comprising a connecting means for connecting the first resin member and the second resin member and electrically connecting the first resin member and the second resin member. The connecting means is a screw having conductivity that connects the first resin member and the second resin member by penetrating the first resin member and engaging with the second resin member. The developing apparatus according to claim 1. The connecting means is a conductive grease that connects the first resin member and the second resin member by interposing between the adhesive and the first resin member and the second resin member. The developing apparatus according to claim 1. The connecting means is a conductive adhesive that connects the first resin member and the second resin member by interposing between the first resin member and the second resin member. The developing apparatus according to claim 1. Having a conductive fixing member for fixing the regulating member to the frame body,
The developing apparatus according to any one of claims 1 to 4, wherein the second resin member is electrically connected to the regulating member via the fixing member. A process cartridge that can be attached to and detached from the main body of the image forming device.
The developing apparatus according to any one of claims 1 to 5.
It has an image carrier on which a developer image is formed, and
A process characterized in that an electrostatic latent image formed on the image carrier is developed by the developing apparatus to form a developer image for forming an image on a recording medium on the image carrier. cartridge. The developing apparatus according to any one of claims 1 to 5.
It has an image carrier on which a developer image is formed, and
The electrostatic latent image formed on the image carrier is developed by the developing apparatus to form a developer image on the image carrier.
An image forming apparatus, characterized in that an image is formed on a recording medium by transferring a developer image formed on the image carrier to a recording medium. A method for reproducing an electrostatic latent image formed on an image carrier, which is a method for reproducing a developing device that develops an electrostatic latent image with a developing agent.
The frame of the developing device, the developing agent carrier that supports the developing agent, and
A regulatory member that regulates the amount of developer carried on the developer carrier, and
A bearing member that rotatably supports the developer carrier and
It has a conductive resin member for supplying electric power to the regulating member, and has a resin member for fixing the bearing member to the frame body.
In a method for reproducing a developing device, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulation member.
A method for reproducing a developing apparatus, which comprises connecting the first resin member and the second resin member by a connecting means, and electrically connecting the first resin member and the second resin member. The connecting means is a conductive screw.
8. The eighth aspect of the present invention is characterized in that the first resin member and the second resin member are connected by penetrating the screw through the first resin member and engaging the second resin member. The method for reproducing a developing device according to the description. The connecting means is an adhesive and a conductive grease.
The first as between the resin member and the second resin member Ru is interposed the grease, using the adhesive, by coupling the second resin member and the first resin member, wherein The method for reproducing a developing apparatus according to claim 8, wherein the first resin member and the second resin member are connected to each other. The connecting means is a conductive adhesive and
In Rukoto the adhesive is interposed between the first resin member and the second resin member, according to claim 8, characterized in that for connecting the second resin member and the first resin member Reproduction method of developing equipment. In a state where the first resin member and the second resin member are in contact with each other, a heated metal rod is inserted from the first resin member toward the second resin member, and the rod is inserted into the first resin member. causes penetrate into, by reaching the second resin member, a pre-SL and the first resin member and the second resin member forms the welded portion was welded and the second resin member and the first resin member The method for reproducing a developing apparatus according to claim 8, wherein the developing apparatus is connected.

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