JP2018004988A - Developing device, process cartridge, and image forming apparatus, and method for reproducing developing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a developing device that, when a resin molded part is broken and thereby a bearing member and a developing frame body are disassembled, can suppress a function of the resin molded part as a conductive route from being reduced when the bearing member and developing frame body are coupled again.SOLUTION: A resin member 40 is divided into a first resin member 40 to which power is supplied and a second resin member 40 electrically connected to a regulating member 24, and includes couling means 70 for coupling the first resin member 40 and the second resin member 40 to each other and electrically connecting the first resin member 40 and the second resin member 40 to each other.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a developing device that develops an electrostatic latent image formed on a photosensitive drum, and a process cartridge that forms a developer image on the photosensitive drum and is detachable from the apparatus main body. The present invention also relates to an image forming apparatus that forms an image on a recording medium using a developer, and a method for reproducing the developing apparatus.

  In an image forming apparatus using electrophotographic technology, first, a photosensitive drum is uniformly charged by a charging roller. Next, the charged photosensitive drum is selectively exposed to form an electrostatic latent image on the photosensitive drum. The electrostatic latent image formed on the photosensitive drum is developed as a toner image by a developing device. The toner image formed on the photosensitive drum is transferred to a recording material such as recording paper or a plastic sheet, and the toner image transferred onto the recording material is fixed to the recording material by being heated and pressurized. The toner remaining on the photosensitive drum after the toner image on the photosensitive drum is transferred to the recording material is removed by a cleaning blade.

  Such an image forming apparatus generally requires toner replenishment and maintenance of various process means. In order to facilitate toner replenishment and maintenance, a process cartridge in which process means such as a photosensitive drum, a charging roller, a developing device, and a cleaning blade are integrated as a cartridge has been put into practical use. Since the process cartridge is detachable from the main body of the image forming apparatus, the process means can be easily replaced and the toner can be replenished by replacing the process cartridge.

  According to this process cartridge system, the maintenance of the image forming apparatus can be performed by the user himself, so that the operability can be remarkably improved and an image forming apparatus with excellent usability can be provided. For this reason, the process cartridge system is widely used in image forming apparatuses.

  Here, a conventional process cartridge will be described. The photosensitive unit C includes a cleaning frame 13 that integrally supports the photosensitive drum 10, the charging roller 11, and the cleaning blade 12. Further, the developing unit D integrally supports the developing roller 23, the supply roller 22, and the developing blade 24 as a regulating member, and a developing device frame 21 constituting the developer containing unit 20 that contains the developer. have. The developing roller 23 is a roller that carries a developer for developing the electrostatic latent image formed on the photosensitive drum 10, and the supply roller 22 is a roller for supplying the developer to the developing roller 23. The developing blade 24 is a blade for regulating the layer thickness of the developer carried on the developing roller 23. The developing unit D includes a bearing member 31 and a bearing member 39 that support the developing roller 23 and the supply roller 22 at both ends of the developing frame 21 in the rotation center axis direction of the developing roller 23 and the supply roller 22.

Here, the technique disclosed in Patent Document 1 will be described. In the technique disclosed in Patent Document 1, a hole having an opening in the axial direction is provided at an end portion of the developing frame body 21 in the rotational center axial direction of the developing roller 23 and the supply roller 22. The developing blade 24 is fixed to the developing frame 21 with a screw 50, and the tip of the screw 50 projects into the hole. The bearing member 31 is provided with a through hole. Thus, in a state where the bearing member 31 is attached to the developing device frame 21, the hole of the developing device frame 21 and the through hole of the bearing member 31 are configured to communicate with each other. Then, in a state where the hole of the developing device frame 21 and the through hole of the bearing member 31 communicate with each other, the hole of the developing device frame 21 and the through hole of the bearing member 31 are formed from the through hole of the bearing member 31. A molten conductive resin is injected into the space and hardened. In the technique disclosed in Patent Document 1, the bearing member 31 and the developing device frame 21 are combined using the conductive resin in this manner. As a result, the productivity of the development unit D is improved. Further, the resin molding portion formed by the conductive resin solidifying is electrically connected to the developing blade 24. Therefore, power can be supplied to the developing blade 24 by supplying power to the power supply position in the resin molding portion.

  In the technique disclosed in Patent Document 2, a method of disassembling the bearing member 31 and the developing frame 21 is disclosed. Specifically, in the technique disclosed in Patent Document 2, a screw 50 is inserted from the outer wall of the developing device frame 21 toward a cylindrical hole formed at the end of the developing device frame 21. Thereby, the screw 50 protrudes in a direction orthogonal to the axial direction of the hole in the conductive resin molding portion formed in the hole of the developing device frame 21. In the technique disclosed in Patent Document 2, the conductive resin molded portion is fixed to the bearing member 31 and is fixed to the developing device frame 21 only by the screw 50. For this reason, the conductive resin molding part can be detached from the developing frame 21 simply by removing the screw 50, and the bearing member 31 and the developing frame 21 can be easily disassembled.

Japanese Patent No. 5460824 JP 2013-134299 A

  However, in the technique disclosed in Patent Document 2, when the bearing member 31 is to be removed without removing the screw 50 fixing the developing blade 24, the resin molded portion may be broken. Even when the bearing member 31 is removed after the screw 50 is removed, if the resin molded part has adhered to the developing frame 21, if the bearing member 31 is to be removed, the resin molded part is removed. May break. When the resin molded portion is broken, when the fracture surface is bonded with an adhesive or the like and the bearing member 31 and the developing device frame 21 are connected again, a conductive path from the feeding position to the developing blade 24 is formed. There was a possibility of becoming unstable.

  Therefore, the present invention provides a function as a conductive path of the resin molded part when the bearing member and the developing frame are reconnected when the resin molded part is broken and the bearing member and the developing frame are disassembled. It is an object of the present invention to provide a developing device that can suppress the decrease in the temperature. Also, there is provided a process cartridge, an image forming apparatus, and a developing apparatus remanufacturing method capable of suppressing a decrease in the function as a conductive path of the resin molding portion when the bearing member and the developing device frame are connected again. The purpose is to provide.

In order to achieve the above object, the developing device according to the present invention comprises:
A developing device for developing an electrostatic latent image formed on an image carrier with a developer,
A frame of the developing device;
A developer carrying member carrying the developer;
A regulating member for regulating the amount of developer carried on the developer carrying body;
A bearing member for rotatably supporting the developer carrier;
A resin member having electrical conductivity and supplying electric power to the regulating member, the resin member for fixing the bearing member to the frame,
In the developing device, the resin member is divided into a first resin member to which power is supplied and a second resin member electrically connected to the regulating member.
The first resin member and the second resin member are connected to each other, and connecting means is provided for electrically connecting the first resin member and the second resin member.

In order to achieve the above object, the process cartridge according to the present invention comprises:
A process cartridge that is detachable from the main body of the image forming apparatus,
The developing device;
An image carrier on which a developer image is formed,
The electrostatic latent image formed on the image carrier is developed by the developing device, so that a developer image for forming an image on a recording medium is formed on the image carrier.

In order to achieve the above object, an image forming apparatus according to the present invention includes:
The developing device;
An image carrier on which a developer image is formed,
The electrostatic latent image formed on the image carrier is developed by the developing device to form a developer image on the image carrier,
The developer image formed on the image carrier is transferred to a recording medium, whereby an image is formed on the recording medium.

In order to achieve the above object, the reproduction method according to the present invention includes:
A reproduction method of a developing device for developing an electrostatic latent image formed on an image carrier with a developer,
A developing device frame, a developer carrying member for carrying the developer,
A regulating member for regulating the amount of developer carried on the developer carrying body;
A bearing member for rotatably supporting the developer carrier;
A resin member having electrical conductivity and supplying electric power to the regulating member, the resin member for fixing the bearing member to the frame,
In the method of reproducing a developing device, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulating member.
The first resin member and the second resin member are coupled by a coupling means, and the first resin member and the second resin member are electrically connected.

  In the present invention, when the bearing member and the developing frame are disassembled due to the resin molded portion breaking, the function of the resin molded portion as a conductive path is reduced when the bearing member and the developing frame are reconnected. Provided is a developing device that can suppress this. Also, there is provided a process cartridge, an image forming apparatus, and a developing apparatus remanufacturing method capable of suppressing a decrease in the function as a conductive path of the resin molding portion when the bearing member and the developing device frame are connected again. provide.

Sectional drawing which shows the whole structure of the image forming apparatus which concerns on Example 1. FIG. 1 is a perspective view of a developing unit according to Embodiment 1. FIG. The perspective view which shows a mode that a developing blade is attached to a developing unit. Side view showing a state where the developing blade is attached to the developing frame The perspective view which shows the state before a bearing member is attached to a image development frame. The figure which shows the state in which the bearing member was positioned with respect to the image development frame. Sectional drawing which shows a mode that the molten conductive resin is inject | poured in a junction part Sectional view of the vicinity of the resin molded part after the molten resin has hardened Sectional drawing which shows the state which removed the bearing member from the image development frame body The figure which shows the state which combined the fracture | rupture part of the resin molding part which concerns on Example 1. FIG. The figure which shows a mode that the fracture | rupture part of the resin molding part which concerns on Example 2 is couple | bonded. The figure which shows a mode that the fracture | rupture part of the resin molding part which concerns on Example 3 is couple | bonded.

  Embodiments of the present invention are illustrated below with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in the embodiments should be appropriately changed depending on the configuration of the apparatus to which the invention is applied and various conditions. This is not intended to limit the scope to the following embodiments.

Example 1
<Image forming apparatus 100>
With reference to FIG. 1, the schematic configuration of the entire image forming apparatus 100 will be described along the flow of the recording medium P. FIG. 1 is a cross-sectional view illustrating the overall configuration of the image forming apparatus 100 according to the first embodiment. In the apparatus main body A of the image forming apparatus 100, a latent image is formed on the photosensitive drum 10 as an image carrier by the scanner unit 1 that has received the latent image data. Then, the developer on the circumferential surface of the developing roller 23 as a developer carrying member is transferred to the photosensitive drum 10 in accordance with the latent image, so that the latent image on the photosensitive drum 10 is visualized as a developer image. . Further, the image forming apparatus 100 is provided with a paper feed cassette 2 that can store the recording medium P, and the recording medium P is fed one by one by the paper feeding unit 3. Then, the fed recording medium P is conveyed to the registration roller 4. The developer image on the photosensitive drum 10 is transferred to the recording medium P conveyed by the registration roller 4 by the transfer roller 5. Subsequently, the recording medium P is conveyed to the fixing unit 6, and the developer image is fixed by the fixing roller 7. Thereafter, the recording medium P after the image is fixed is discharged to the paper discharge unit 9 by the discharge unit 8.

<Process cartridge B>
The process cartridge B according to the present embodiment is configured by integrally forming a photosensitive unit C and a developing unit D as a developing device into a cartridge, and is attachable to and detachable from the apparatus main body A. The photosensitive unit C includes a photosensitive drum 10, a charging roller 11 as a charging unit, a cleaning blade 12 as a cleaning unit, a cleaning frame 13, and the like.

  The developing unit D includes a developing roller 23 as a developing unit, a supply roller 22, a developing blade 24, a developer accommodating unit 20, a developing frame 21 as a frame constituting the developer accommodating unit 20, and the like. In this embodiment, the developing means performs development as follows. First, the developer in the developer storage unit 20 is supplied to the developing roller 23 by the rotation of the supply roller 22, and the developing blade 24 as a regulating member regulates the layer thickness of the developer layer on the developing roller 23. Then, a developer image is formed on the photosensitive drum 10 by transferring the developer to the photosensitive drum 10 in accordance with the latent image. In the cleaning unit according to the present embodiment, the cleaning blade 12 removes the developer remaining on the photosensitive drum 10 after the developer image on the photosensitive drum 10 is transferred to the recording medium P.

<Developing unit D>
The developing unit D according to this embodiment will be described with reference to FIGS. FIG. 2 is a perspective view of the developing unit D, and FIG. 3 is a perspective view showing how the developing blade 24 is attached to the developing unit D. As described above, the development unit D includes the developer, the developer storage unit 20 that stores the developer, the supply roller 22, the development roller 23, the development blade 24, the development frame body 21, and the like. The developing blade 24 includes a contact portion 26 that contacts the developing roller 23 and a metal support sheet metal 25 that supports the contact portion 26. The contact portion 26 is made of elastic material such as rubber or thin metal. Here, in the present embodiment and the conventional example, as the contact portion 26, a stainless steel material having a thickness of 0.08 mm is used. The developing blade 24 composed of these components is fixed to the developing frame 21 with screws 50 (screws 50a and 50b) as fixing members made of a conductive material. The developing roller 23 and the supply roller 22 are supported by a bearing member 31. As described above, the developing unit D may constitute a part of the process cartridge B, or may be detachable from the apparatus main body A of the image forming apparatus 100 independently.

  Next, the configuration of the developing unit D according to the first embodiment will be described with reference to FIGS. Here, in particular, the method for coupling the bearing member 31 to the developing frame 21 and the configuration of the conductive path for supplying power to the developing blade 24 are in accordance with the order of the assembly operation of the developing blade 24 and the bearing member 31. Will be described in detail. Here, FIGS. 3 to 8 are explanatory views showing how the developing unit D according to the present embodiment is assembled. Here, the components are assembled to the developing frame 21 in a state where the developer is charged into the developing frame 21 and the supply roller 22 is assembled to the developing frame 21.

<Assembly of developing blade 24>
FIG. 3 is a perspective view showing a state before the developing blade 24 is assembled to the developing frame 21. In this state, the bearing member 31 (see FIG. 2) is not yet attached to the developing device frame 21. FIG. 4 is a side view showing a state where the developing blade 24 is attached to the developing frame 21. In this state, the bearing member 31 is not yet attached to the developing device frame 21.

  When the developing blade 24 is assembled to the developing frame 21, first, the developing blade 24 is fixed to the two seat surfaces 27 provided on the developing frame 21 with screws 50. Here, as shown in FIG. 3, one screw hole 27 a (through hole) penetrates the developing device frame 21 so as to communicate with a joint portion 32 provided on a joint surface with the bearing member 31. For this reason, when the tightening of the screw 50 is completed, the screw tip 51 protrudes into the space of the joint portion 32 as shown in FIG. Here, the assembly of the developing blade 24 to the developing frame 21 is a very important process for realizing stable image formation. Therefore, the developing blade 24 may be assembled while adjusting the position of the developing blade 24 so that the developing blade 24 is attached to a predetermined attachment position.

<Assembly of bearing member 31>
FIG. 5 is a perspective view showing a state before the bearing member 31 is attached to the developing device frame 21. FIG. 6 is a view showing a state in which the bearing member 31 is positioned with respect to the developing device frame 21. Specifically, FIG. 6A is a side view of the developing unit D in a state where the bearing member 31 is attached to the developing device frame 21. FIG. 6B is a partial cross-sectional view of the developing unit D in a state where the bearing member 31 is positioned with respect to the developing device frame 21. Here, the bearing member 31 includes a bearing portion 31d that rotatably supports the end portion of the rotation shaft of the developing roller 23, and a bearing portion 31e that rotatably supports the end portion of the rotation shaft of the supply roller 22. ing. The bearing member 31 includes a positioning portion 31a for positioning the bearing member 31 with respect to the developing device frame 21, a positioning portion 31b, a positioning portion 31c, and an injection portion 33 for injecting molten resin. Is provided.

  Here, as the material of the bearing member 31, a resin (for example, polyacetal resin) having excellent slidability is used. In the present embodiment, a material that is incompatible with the material of the bearing member 31 is selected as the molten resin to be injected into the injection portion 33. Further, as shown in FIG. 6, the injection portion 33 provided in the bearing member 31 includes an injection port 33a, a resin flow passage portion 33b, a step portion 35 for reducing the inner diameter of the resin flow passage portion 33b, and an injection nozzle portion. 34 (see FIG. 6B).

  In the present embodiment, the entire area from the injection port 33a to the injection nozzle portion 34 is a flow path for molten resin. Further, the injection port 33 a to the injection nozzle portion 34 penetrate the bearing member 31 and communicate with a joint portion 32 that is a recess provided in the developing device frame 21. A space filled with the molten resin is formed by the flow path (from the injection port 33a to the injection nozzle portion 34), the joint portion 32, and the screw tip 51 of the screw 50 protruding into the joint portion 32. . In addition, the assembly of the developing device frame 21 and the bearing member 31 is related to the positioning portions 31a to 31c (see FIG. 5) in the bearing member 31 and the positioning portions 21a to 21c (see FIG. 3) in the developing device frame 21. This is done by combining them.

<Method of coupling the bearing member 31 to the developing device frame 21>
FIG. 7 is a cross-sectional view showing how molten conductive resin is injected into the joint portion 32. FIG. 8 is a cross-sectional view of the vicinity of the resin molded portion 40 after the molten resin has hardened. When the molten conductive resin is injected into the joint portion 32, the nozzle tip 52 of a resin injection device (not shown) for injecting the molten resin is brought into contact with the injection port 33a of the injection portion 33. Then, an appropriate amount of molten conductive resin is injected into the space of the joint portion 32 of the developing device frame 21 via the resin flow path portion 33b of the bearing member 31. The direction of the molten resin flow is the arrow Y direction. The injected conductive resin is solidified (cured) immediately after the injection to form the resin molded portion 40 (FIG. 8). Thereby, the operation | work which couple | bonds the image development frame 21 and the bearing member 31 is completed.

  As shown in FIG. 8, the resin molding portion 40 is coupled to the screw 50 by the resin being cooled and solidified around the screw tip 51 of the screw 50 at the joint portion 32 in the developing frame 21. Thereby, the resin molding part 40 is fixed to the developing device frame 21. This is because the screw tip 51 functions as a stopper for preventing the resin molded portion 40 from coming off. In addition, since the screw 50 is fastened to the developing frame 21, the resin molding portion 40 is also fixed to the developing frame 21. On the other hand, the resin molding portion 40 is molded into a shape having a step corresponding to the step portion 35 of the bearing member 31. The step shape in the resin molding portion 40 is engaged with the step portion 35 of the bearing member 31 so that the resin molding portion 40 is in a direction opposite to the direction in which the bearing member 31 is assembled to the developing frame 21. This prevents the bearing member 31 from coming off.

  In the present embodiment, as described above, in the space filled with the molten resin material, the size of the portion (the inner diameter of the hole in the vicinity of the stepped portion 35) that connects the injection port 33a and the joint portion 32 is the injection port 33a. Are smaller than the width (inner diameter) and the width (inner diameter) of the joint portion 32. Thereby, the resin molding part 40 is fixed to the developing device frame 21 and the resin molding part 40 is not detached from the bearing member 31. Further, as described above, the resin molding portion 40 is fixed to the developing device frame 21 with the screws 50. Therefore, the developing device frame 21 and the bearing member 31 are coupled.

  In addition, when the resin molding part 40 cools and solidifies, it shrinks only a trace amount. Due to this property, after the resin molding portion 40 is solidified, the resin around the screw 50 presses the screw 50. Further, in a state where the resin molding portion 40 is solidified, the resin around the step portion 35 and the injection nozzle portion 34 moves the step portion 35 and the injection nozzle portion 34 in the direction in which the step portion 35 and the injection nozzle portion 34 approach each other. Pressing. Thereby, the resin molding part 40 is firmly fixed to the bearing member 31. Further, a force acts on the developing device frame 21 in a direction in which the bearing member 31 and the developing device frame 21 approach each other. Therefore, the bearing member 31 is in a state of pressing the developing device frame 21, and the adhesion between the bearing member 31 and the developing device frame 21 is increased. In particular, in the space filled with the molten resin, the screw 50 protrudes in a direction intersecting (orthogonal) with the direction in which the resin molded portion 40 comes out of the joint portion 32, so that the bearing member 31 and the developing device frame 21 are connected. It can be fixed more firmly.

  In the present embodiment, the developing frame body 21 and the bearing member 31 are coupled by the resin molding portion 40 in which the conductive resin injected into the joint portion 32 is solidified and molded as described above. By this connection, the support metal plate 25 and the metal screw 50 are electrically connected, and the screw 50 and the resin molding portion 40 are electrically connected, so that the resin molding portion is supported from the support metal plate 25. Electrical paths are formed up to 40. At this time, the conductive resin around the screw tip 51 is cooled and solidified, and the resin molded portion 40 contracts. Thereby, the resin molding part 40 adheres with respect to the screw 50, and the screw 50 and the resin molding part 40 are stably electrically connected.

<Reproduction method of development unit D>
FIG. 9 is a cross-sectional view illustrating a state where the bearing member 31 according to the first embodiment is detached from the developing device frame 21. FIG. 10 is a diagram illustrating a state in which the fracture portions 41a and 41b of the resin molded portion 40 according to the first embodiment are coupled. When the development unit D is remanufactured (reused), at least when the development roller 23 and the development blade 24 are replaced and cleaned, at least the bearing member 31 is removed from the development frame 21 and the development roller 23 is removed from the development unit D. It needs to be removable. Here, the developing frame 21 and the bearing member 31 are fixed by the resin molding portion 40. Therefore, as shown in FIG. 9, if the resin molded portion 40 fixed to the screw 50 is broken in the middle (broken into the first conductive resin member 40a and the second conductive resin member 40b), the bearing member 31 is It can be removed from the developing device frame 21. Further, when the bearing member 31 is to be removed without removing the screw 50 that fixes the developing blade 24, the resin molded portion may be broken. Even when the bearing member 31 is removed after the screw 50 is removed, if the resin molded part has adhered to the developing frame 21, if the bearing member 31 is to be removed, the resin molded part is removed. There is a possibility that 40 will break. In this case, the resin molding portion 40 that serves as a conductive path from a power supply member (not shown) to the developing blade 24 is broken halfway. Therefore, for example, the conductive path from the power supply member to the developing blade 24 becomes unstable only by connecting the fracture surfaces of the resin molded portion 40 with an adhesive. After the development unit D is reproduced, the conductive path from the power supply member to the development blade 24 becomes unstable, and there is a possibility that a good image cannot be formed on the recording medium P.

  Therefore, in this embodiment, as shown in FIG. 10, the conductive member 70 (screw in this embodiment) as a connecting member is passed through the first conductive resin member 40a on the bearing member 31 side, and the developing device frame body. It is engaged (screwed) with the second conductive resin member 40b on the 21 side. Thereby, in this embodiment, the conductive path from the power supply member to the developing blade 24 can be stabilized. At that time, it is desirable to use a screw having conductivity on the surface as the conductive member 70. When a screw is used as the conductive member 70, the bearing member 31 can be fastened to the developing frame 21 by stabilizing the conductive path and connecting the broken resin molded portion 40. However, the conductive member 70 is not necessarily limited to a screw, and may be a member having conductivity on the surface thereof. The developing frame 21 and the bearing member 31 may be coupled by other methods.

  Here, when the position where the resin molded portion 40 is broken is in the vicinity of the screw 50, it may be difficult to place the conductive member 70 through the broken portion 41. Therefore, in the present embodiment, in the resin molded portion 40, the width (outer diameter) of the portion corresponding to the injection nozzle portion 34 is made thinner than the other portions. That is, in the resin molding part 40, a weak part is provided in the vicinity of the boundary between the bearing member 31 and the developing device frame 21. Thereby, the resin molding part 40 can be made to fracture | rupture in a predetermined place, and it can suppress that it fractures | ruptures in the vicinity of the screw | thread 50. FIG.

As described above, in this embodiment, the conductive member 70 (screw) is passed through the fractured surface of the fractured resin molded part 40 so that the fractured resin molded part 40 is coupled and the fractured resin molded part 40 is joined. Are electrically connected. Thereby, it can suppress that the function as a conductive path of the resin molding part 40 falls.

(Example 2)
The second embodiment is the same as the first embodiment until the step of removing the bearing member 31 in order to reproduce the developing unit D. Here, in the present embodiment, portions having the same functions as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, the method for restoring the conductivity of the fractured portion 41 (41a, 41b) generated in the resin molded portion 40 by removing the bearing member 31 is different from that in the first embodiment.

  Example 2 will be described in detail with reference to FIG. FIG. 11 is a diagram illustrating a state in which the fracture portion 41a and the fracture portion 41b of the resin molded portion 40 according to the second embodiment are coupled. In this embodiment, the conductive grease 60 is applied to both or one of the rupture portions 41 generated in the resin molded portion 40, and the conductive grease 60 is interposed (attached) to a part of the rupture portion 41 so that the resin is broken. The molding part 40 is joined. In the present embodiment, an adhesive is applied to a region of the fractured portion 41 where the conductive grease 60 is not applied, and the fractured resin molded portion 40 is bonded with the adhesive. Note that the method of joining the fractured resin molded portion 40 is not necessarily limited to this. For example, the fractured resin molded part 40 may not be bonded to the resin molded part 40 but may be performed near the resin molded part 40. Further, the conductive grease 60 may be applied to the fractured portion 41, and the fractured resin molded portion 40 may be coupled with a screw. In such a configuration, after the fractured resin molded part 40 is joined, the conductive grease 60 is interposed between the fractured parts 41. By applying the conductive grease 60, when the developing unit D is reproduced, it is possible to maintain electrical conductivity between the fractured portion 41a and the fractured portion 41b in the resin molded portion 40. In the present embodiment, the conductive grease 60 is applied to the rupture portion 41a and the rupture portion 41b in the resin molded portion 40, but the present invention is not necessarily limited thereto. For example, instead of the conductive grease 60, a thin metal sheet such as an aluminum foil may be used. What is interposed between the fracture | rupture part 41a and the fracture | rupture part 41b will not be specifically limited if it can deform | transform and has electroconductivity on the surface. In addition, although the example which used the electrically-conductive grease 60 and the adhesive agent was demonstrated in the present Example, it adhere | attaches simultaneously, taking the conduction | electrical_connection of the 1st conductive resin member 40a and the 2nd conductive resin member 40b using a conductive adhesive. May be.

  As described above, in this embodiment, in the step of regenerating the developing unit D, the broken resin molded portion 40 is bonded to the broken portion 41 generated in the resin molded portion 40 by applying the conductive grease 60. Yes. Thereby, even if the resin molding part 40 is fractured, the conductive path from the power supply member to the developing blade 24 can be stabilized by an easy method.

(Example 3)
Next, Example 3 will be described with reference to FIG. FIG. 12 is a diagram illustrating a state in which the fracture portion 41a and the fracture portion 41b of the resin molded portion 40 according to the third embodiment are coupled. The third embodiment is the same as the first embodiment until the step of removing the bearing member 31 in order to reproduce the developing unit D. Here, in the present embodiment, portions having the same functions as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. In the present embodiment, the method for restoring the conductivity of the fractured portion 41 in the resin molded portion 40 is different from that in the first and second embodiments.

In the present embodiment, unlike the first embodiment, the broken resin molded portion 40 is joined using a rod-shaped metal member 80 that can be heated instead of a conductive screw (conductive member 70). ing. Specifically, the heated metal member 80 is moved from the first conductive resin member 40a to the second in a state where the broken portion 41a and the broken portion 41b are combined and the first conductive resin member 40a and the second conductive resin member 40b are in contact with each other. It inserts toward the conductive resin member 40b. As a result, the resin constituting the first conductive resin member 40a and the resin constituting the second conductive resin member 40b are melted to penetrate the metal member 80 through the first conductive resin member 40a and reach the second conductive resin member 40b. Let At this time, the resin constituting the first conductive resin member 40a melted by the metal member 80 and the second
The conductive resin member 40b (corresponding to the first molten resin and the second molten resin) integrally forms a welded portion. By this welding part, the 1st conductive resin member 40a and the 2nd conductive resin member 40b are connected, and the resin molding part 40 which fractured | ruptured can be combined. In this embodiment, after forming the welded portion, a step of extracting the metal member 80 from the resin molded portion 40 was performed.

  As described above, in the third embodiment, similarly to the first embodiment, even when the resin molding portion 40 is broken, the conductive path from the power supply member to the developing blade 24 is stabilized by an easy method. Can do. Moreover, in Example 3, the metal member 80 can be reproduced after being extracted. That is, the fractured resin molded portion 40 can be joined without preparing a new member. For this reason, the cost required for the reproduction of the developing unit D can be reduced.

  In each embodiment, the method of joining the fractured resin molded portion 40 is not necessarily limited to the joining method in each embodiment. The joining method is not limited as long as the fractured resin molded part 40 is joined and the fractured resin molded part 40 is electrically connected.

DESCRIPTION OF SYMBOLS 10 ... Photosensitive drum, 21 ... Developing frame, 23 ... Developing roller, 24 ... Developing blade,
31 ... Bearing member, 40 ... Resin molded part, 41a ... Broken part, 41b ... Broken part,
70: Conductive member, D ... Developing unit

Claims (12)

A developing device for developing an electrostatic latent image formed on an image carrier with a developer,
A frame of the developing device;
A developer carrying member carrying the developer;
A regulating member for regulating the amount of developer carried on the developer carrying body;
A bearing member for rotatably supporting the developer carrier;
A resin member having electrical conductivity and supplying electric power to the regulating member, the resin member for fixing the bearing member to the frame,
In the developing device, the resin member is divided into a first resin member to which power is supplied and a second resin member electrically connected to the regulating member.
A developing device comprising: a connecting means for connecting the first resin member and the second resin member and electrically connecting the first resin member and the second resin member.   The connecting means is a conductive screw that connects the first resin member and the second resin member by penetrating through the first resin member and engaging with the second resin member. The developing device according to claim 1, wherein:   The connecting means is an electrically conductive grease that connects the first resin member and the second resin member by interposing between the adhesive and the first resin member and the second resin member. The developing device according to claim 1.   The connecting means is a conductive adhesive that connects the first resin member and the second resin member by being interposed between the first resin member and the second resin member. The developing device according to claim 1. A fixing member having conductivity, fixing the regulating member to the frame;
5. The developing device according to claim 1, wherein the second resin member is electrically connected to the regulating member via the fixing member. 6. A process cartridge that is detachable from the main body of the image forming apparatus,
A developing device according to any one of claims 1 to 5,
An image carrier on which a developer image is formed,
The electrostatic latent image formed on the image carrier is developed by the developing device, whereby a developer image for forming an image on a recording medium is formed on the image carrier. cartridge. A developing device according to any one of claims 1 to 5,
An image carrier on which a developer image is formed,
The electrostatic latent image formed on the image carrier is developed by the developing device to form a developer image on the image carrier,
An image forming apparatus, wherein an image is formed on a recording medium by transferring the developer image formed on the image carrier onto the recording medium. A reproduction method of a developing device for developing an electrostatic latent image formed on an image carrier with a developer,
A developing device frame, a developer carrying member for carrying the developer,
A regulating member for regulating the amount of developer carried on the developer carrying body;
A bearing member for rotatably supporting the developer carrier;
A resin member having electrical conductivity and supplying electric power to the regulating member, the resin member for fixing the bearing member to the frame,
In the method of reproducing a developing device, the resin member is divided into a first resin member to which electric power is supplied and a second resin member electrically connected to the regulating member.
A developing apparatus reproduction method, wherein the first resin member and the second resin member are coupled by a coupling means, and the first resin member and the second resin member are electrically connected. The connecting means is a screw having conductivity,
9. The first resin member and the second resin member are connected by causing the screw to penetrate the first resin member and engaging the second resin member. A reproduction method of the developing device. The connecting means is an adhesive and conductive grease,
The grease is interposed between the first resin member and the second resin member, and the first resin member and the second resin member are coupled with each other using the adhesive. 9. The developing device reproduction method according to claim 8, wherein one resin member and the second resin member are connected to each other. The connecting means is a conductive adhesive,
The development according to claim 8, wherein the first resin member and the second resin member are connected by interposing the adhesive between the first resin member and the second resin member. How to regenerate the equipment.   With the first resin member and the second resin member in contact with each other, a heated metal rod is inserted from the first resin member toward the second resin member, and the rod is inserted into the first resin member. The first resin member and the second resin member are formed as the welding means by forming the weld portion where the first resin member and the second resin member are welded. The method for remanufacturing a developing device according to claim 8, wherein a resin member is connected.

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