JP6733199B2 - Inspection device, inspection method, and inspection program - Google Patents

Description

The present invention relates to an inspection device, an inspection method, and an inspection program.

In Patent Document 1, a collective board in which a plurality of boards to be inspected are assembled in a predetermined arrangement state, and a pseudo board different from the board to be inspected is arranged in place of at least one board to be inspected of the collective board. When inspecting the pseudo-assembled board, an inspection apparatus including a determination unit that determines whether an inspection target is a pseudo substrate, and an inspection unit that inspects a substrate to be inspected other than the pseudo substrate determined by the determination unit. Is disclosed.

Patent No. 5392430

The present invention provides an inspection apparatus and an inspection method capable of efficiently inspecting a collective substrate including a plurality of inspected substrates, including inspecting individualized inspected substrates, without increasing costs. , And to provide an inspection program.

In order to achieve the above-mentioned object, the inspection device according to claim 1 has a plurality of electric conductors that come into contact with each of the contact points arranged on each of the plurality of substrates to be inspected included in the collective substrate, and the plurality of electric conductors. run the detection using the current body, the electrical characteristics defined in advance by two or more of the plurality of the substrate to be inspected is detected, and the predetermined electric characteristics detected by one or more If not, all of the plurality of substrates to be inspected are inspected, and if the predetermined electrical characteristics are detected by only one substrate to be inspected, inspection to inspect the one substrate to be inspected And means.

The invention according to claim 2 is the invention according to claim 1, wherein the inspecting means uses the plurality of current-carrying bodies to detect a potential difference between each of the plurality of contact points and a reference potential of the inspecting device. Detection is performed, and the predetermined electrical characteristic is detected when the detected potential difference is within a predetermined range.

In the invention according to claim 3, in the invention according to claim 1, each of the contact points is connected to a terminal of a component mounted on the inspected substrate, and the inspecting means is The detection of the electrical characteristic at the terminal is performed using a plurality of electric conductors, and the predetermined electrical characteristic is detected when the detected electrical characteristic is within a predetermined range. ..

The invention according to claim 4 is the invention according to claim 1, wherein the contact point is a contact point pair including two contact points, and the current-carrying body is a current-carrying body pair including two current-carrying bodies. Then, the inspection means performs detection using the current-carrying body by bringing each of the plurality of current-carrying body pairs into contact with each of the plurality of contact point pairs.

In the invention according to claim 5, in the invention according to claim 4, each of the contact point pairs is connected to a terminal pair of a component mounted on the inspected substrate, and the inspection means is , Detecting the electrical characteristic of the terminal pair using a plurality of pairs of the current-carrying bodies, and detecting the predetermined electrical characteristic when the detected electrical characteristic is within a predetermined range To do.

The invention according to claim 6 is the invention according to claim 5, wherein the component is a resistor and the electrical characteristic is a resistance value.

Further, in the invention according to claim 7, in the invention according to any one of claims 1 to 6, a part of the plurality of current-carrying electrical conductors is one of the inspected substrates. While contacting the contact points arranged on the surface, the other conductors of the plurality of conductors contact the contact points arranged on the other surface of the substrate to be inspected, and the part of the conductors. And the current-carrying member of the other part do not face each other.

In order to achieve the above object, the inspection method according to claim 8 is an inspection apparatus including a plurality of electric conductors that come into contact with contact points arranged on each of a plurality of substrates to be inspected included in an aggregate substrate. an inspection method using, executes the detection using the energization of said plurality of electrical properties predetermined by two or more of the said plurality of the substrate to be inspected is detected, and one or more sheets If the predetermined electrical characteristics are not detected in, all of the plurality of inspected substrates are inspected, and if the predetermined electrical characteristics are detected by only one inspected substrate, The one substrate to be inspected is inspected.

In order to achieve the above object, the inspection program according to claim 9 is an inspection apparatus including a plurality of electric conductors that come into contact with respective contact points arranged on each of a plurality of substrates to be inspected included in a collective substrate. a control program, the computer executes the detection using the energization of said plurality of electrical properties predetermined by two or more of the said plurality of the substrate to be inspected is detected, and 1 If the predetermined electrical characteristic is not detected in one or more sheets, all of the plurality of inspected substrates are inspected, and the predetermined electrical characteristic is detected in only one inspected substrate. In this case, it serves as an inspection means for inspecting the one substrate to be inspected.

According to the first, seventh and eighth aspects of the present invention, the cost is increased by inspecting the collective substrate including a plurality of inspected substrates and inspecting the individual inspected substrates. It is possible to provide an inspection device, an inspection method, and an inspection program that can be efficiently performed without inviting them.
Further, according to the inventions of claim 1, claim 7, and claim 8, the board inspection is not executed even though the board to be inspected is present due to the contact failure of the current-carrying body. Occurrence is suppressed.

According to the second aspect of the invention, the effect that the detection system is simplified is obtained as compared with the case of detecting the potential difference between the current-carrying bodies.

According to the third aspect of the present invention, compared with the case where the contact points connected to the wiring pattern are used, in addition to the discrimination between the collective substrate and the individual substrate, the electrical characteristics of the component are inspected. The effect of, is obtained.

According to the invention as set forth in claim 4, as compared with the case where a single contact point and an electric conductor are used, not only electric characteristics with respect to a reference potential, but also a component such as a potential difference between arbitrary contact points and a resistance value. It is possible to obtain the effect that the characteristic value of 1 is detected.

According to the invention described in claim 5, the kind of the electric characteristic to be detected is further expanded as compared with the case where the electric characteristic of the single terminal of the component is detected by the single electric conductor. The effect is obtained.

According to the invention of claim 6, the resistance value is detected by measuring the voltage and the current, as compared with the case of using a component other than the resistor, so that it is not necessary to use a special measurement system. Is obtained.

According to the invention as set forth in claim 7, both sides of the inspected substrate are inspected at once, as compared with the case of using only an electric conductor which is in contact with a contact point arranged on one surface of the inspected substrate. It is also possible to obtain the effect that the erroneous determination in the detection of the inspection object is reduced as compared with the case where a part of the electric conductors and the other electric conductors face each other. ..

It is a schematic block diagram which shows an example of a structure of the inspection apparatus which concerns on embodiment. It is a block diagram which shows an example of an electric constitution of the inspection device which concerns on embodiment. It is a top view showing an example of an aggregate substrate and an individual substrate concerning an embodiment. It is a perspective view showing the arrangement state of the inspection device concerning an embodiment. 7 is a flowchart showing a processing flow of a board inspection processing program according to the embodiment.

Hereinafter, the inspection device, the inspection method, and the inspection program according to the present embodiment will be described in detail with reference to FIGS. 1 to 5. In the following description, an example in which the inspection apparatus according to the present embodiment is applied to a so-called in-circuit tester that inspects a printed wiring board on which components are mounted will be described.

(Schematic configuration of inspection device)
FIG. 1 shows a schematic configuration of an inspection device 12 according to this embodiment. As shown in the figure, the inspection device 12 according to the present embodiment includes a computer 18, an operation unit 20, a display unit 22, a cable 28, and an inspection jig 30. A portion including the computer 18, the operation unit 20, and the display unit 22 constitutes a main body portion of the inspection device 12. Details of the computer 18 will be described later.

The inspection jig 30 includes an upper inspection jig 30A and a lower inspection jig 30B. The upper inspection jig 30</b>A has a plurality of probe pins (electrical conductors) 32 whose tip portion expands and contracts, and the probe pins 32 are connected to the main body of the inspection device 12 by a cable 28.

The lower inspection jig 30B arranges and fixes the printed wiring board 40 (inspected board) as an inspection target on which the electronic components 42a, 42b and the like are mounted. In the inspection jig 30 according to the present embodiment, the printed wiring board 40 is arranged on the lower inspection jig 30B, and the probe pins 32 of the upper inspection jig 30A are attached to the inspection points (contact points: The inspection is performed by making contact with a point at which an electric signal is input/output for the inspection.

More specifically, a plurality of solder portions 44 as contact points are formed on the printed wiring board 40, the probe pins 32 are brought into contact with the solder portions 44, and an electric signal is transmitted via the probe pins 32. Various tests are performed by applying or detecting.

As the contents of the inspection, as an example, the power supply voltage on the printed wiring board 40 is checked, solder open, short circuit failure, failure due to mistaken constants such as resistors and capacitors, defect of parts such as resistors and capacitors, IC, Examples include poor floating of leads such as connectors, operation confirmation of diodes, etc. (function test). Although the present embodiment has been described by exemplifying the mode in which the solder portion 44 is applied as the contact point, the contact point is not limited to this, and the contact point may be, for example, a pad, a through hole, or a wiring formed on the printed wiring board 40. It may be a pattern or the like.

Here, in the present embodiment, the mode in which the probe pin 32 is provided in the upper inspection jig 30A has been described as an example, but the present invention is not limited to this, and the lower inspection jig 30B may be used in addition to the upper inspection jig 30A. The probe pin 32 may be provided and contacted from below the printed wiring board 40, and further, a pressing device that presses and closely contacts the upper inspection jig 30A and the lower inspection jig 30B may be applied. Good.

However, in the present embodiment, when the probe pins 32 are provided on the upper inspection jig 30A and the lower inspection jig 30B, the probe pins of the upper inspection jig 30A and the probe pins of the lower inspection jig 30B do not face each other. It is desirable to do so. In the present embodiment, as will be described later, when the probe pin of the upper inspection jig 30A and the probe pin of the lower inspection jig 30B face each other, the inspection device 12 detects a short circuit and the substrate to be inspected does not exist. Nevertheless, it may be erroneously determined to exist.

(Electrical structure of inspection device)
Next, the electrical configuration of the inspection device 12 will be described with reference to FIG. FIG. 2 is a block diagram illustrating the outline of the electrical configuration of the inspection device 12. As shown in the figure, the inspection device 12 includes a computer 18.

The computer 18 includes a CPU (Central Processing Unit) 18A, a ROM (Read Only Memory) 18B, a RAM (Random Access Memory) 18C, a nonvolatile memory 18D, and an input/output interface (I/O) 18E via a bus 18F. Each is connected.

The CPU 18A controls the operation of the entire inspection device 12. The ROM 18B functions as a storage unit that stores in advance a control program for controlling the operation of the inspection device 12, a board inspection processing program described later, various parameters for inspection, and the like. The RAM 18C is used as a work area when various programs are executed, a temporary storage of inspection data, and the like. The non-volatile memory 18D stores various information that must be retained even when the power switch of the device is turned off.

The I/O 18E includes an operation unit 20 including operation buttons and the like (keyboard, mouse, etc.) for performing an inspection operation, a display unit 22 including a liquid crystal display for performing an inspection display, and a print. An inspection jig 30 or the like for contacting the wiring board 40 is connected.

By the way, the inspection target (inspected board) of the inspection device 12 is not limited to the single printed wiring board 40, and the printed wiring boards 40 as a plurality of inspected boards can be easily divided by connecting pieces such as V-grooves. It is also attempted to improve the efficiency of inspection by collectively inspecting the collective substrate connected to the above as an inspection target.

On the other hand, even when an inspection line for inspecting a collective board is constructed, for example, a specific one of the collective boards (hereinafter, “individual board”) may need to be inspected. After the inspection is finished in the state of the aggregate substrate and the aggregate substrate that has been inspected is divided, the specific printed wiring board 40 is suspected to be defective in the next step, for example, the assembly step of the device, and the reinspection is necessary. When it becomes.

In this case, conventionally, two board inspection processing programs, that is, a board inspection processing program for collective boards and a board inspection processing program for individual boards are used as board inspection processing programs for executing board inspection processing in the inspection apparatus 12. Was there. Therefore, in a conventional collective board inspection, there are a plurality of board inspection processing programs. Therefore, for example, a sensor or the like is used to discriminate between the collective board and the individual board, and the operator switches the programs. However, this method inevitably increases costs due to the addition of sensors and the like. Further, when debugging or changing the inspection content, the plurality of board inspection processing programs must be changed, resulting in a large amount of work and management of the board inspection processing programs.

On the other hand, in order to eliminate the complexity of using a different board inspection processing program, a pseudo board is placed in a portion of the individual boards that are the boards to be inspected that are insufficient for the collective board. There is also a method of inspecting with one substrate inspection processing program by introducing a configuration for determining whether the substrate is a substrate. However, in this method, the cost for preparing the pseudo substrate is high, and the number of steps for setting the pseudo substrate in the inspection device is also required during the inspection.

Therefore, in the present invention, in each of the inspected substrates included in the collective substrate, the electrical characteristics of the terminals (contact points) whose electrical characteristics are known in advance in terms of the circuit operation of the inspected substrates are measured by the probe pin. Thus, it is determined whether the inspection target is a collective board or an individual board, and the program is switched. That is, a probe pin is brought into contact with each contact point to be inspected, and when predetermined electrical characteristics are detected at a plurality of contact points (that is, a plurality of substrates to be inspected), a substrate inspection process for the collective substrate is performed. When a program is selected and the predetermined electrical characteristic is detected only at one contact point, the board inspection processing program for the individual board is selected.

Thus, since the carrier substrate nothing selection of programs without the need to add hardware, including also be automated, the inspection of the collective substrate including a plurality of inspected substrate, the inspection of the inspection substrate which is diced An inspection apparatus, an inspection method, and an inspection program that can be efficiently performed without increasing the cost are provided.

(Inspection method)
Hereinafter, an inspection method using the inspection device 12 according to the present embodiment will be described in detail with reference to FIGS. 3 to 5.

FIG. 3A shows an example of the aggregate substrate 80 according to the present embodiment, and FIG. 3B shows an example of the individual substrate 100 according to the present embodiment.

As shown in FIG. 3A, the collective substrate 80 is configured by connecting a plurality of ( 12 in FIG. 3A) the substrates to be inspected 82 with the connecting pieces 52. The form of the connecting piece 52 is not particularly limited, but in the present embodiment, it is a V groove as an example. An electric component is mounted on each of the inspected substrates 82, and FIG. 3A shows an example in which the resistor 102, the semiconductor element 104, and the capacitor 106 are mounted. In the present embodiment, the resistor 102, the semiconductor element 104, and the capacitor 106 are all surface-mounted components, but the present invention is not limited to this. A form using parts may be used.

As shown in FIG. 3B, in the individual substrate 100, one of the substrates 82 to be inspected in the collective substrate 80 shown in FIG. 3A is separated by the connecting piece 52. Like the inspection board 82, the resistor 102, the semiconductor element 104, and the capacitor 106 are mounted. As shown in FIG. 3B, in the present embodiment, a pair of pads (contact point pairs) 56 are provided via wiring patterns 54 connected to both ends of the resistor 102. In the present embodiment, the probe pin 32 is brought into contact with the pad 56 to detect the electrical characteristic. In this embodiment, the resistor 10 2 is not provided on the substrate inspection only, are diverted those used in the original circuit operation of the test board 82. Details of detection of the electrical characteristics by the probe pin 32 will be described later. The surface of the pad 56 may be provided with a solder leveler (solder coat) so that the pad 56 has the same form as the solder portion 44.

In the present embodiment, a description will be given by exemplifying a mode in which all the substrates to be inspected 82 included in the collective substrate 80 are the same substrate, but the present invention is not limited to this, and a plurality of types of substrates to be inspected may be provided in the collective substrate 80. It may be included. In this case, the positions of the pads 56 with which the probe pins 32 come into contact may be made common between a plurality of types of substrates to be inspected. Further, in the present embodiment, the case where the number of the substrates 82 to be inspected included in the collective substrate 80 is 12 has been described as an example, but the present invention is not limited to this, and any number of substrates may be used. Good.

FIG. 4 shows an arrangement state of the inspection device 12 according to the present embodiment, and FIG. 4A shows an arrangement state of the probe pins 32 on the same aggregate substrate 80 as in FIG. 3A. 3B shows the arrangement state of the probe pins 32 on the same individual substrate 100 as in FIG. 3B. However, in FIG. 4A, four inspected substrates 82 are extracted from the twelve inspected substrates 82 in FIG. 3A. Note that in FIG. 4, only the probe pin 32 of the inspection jig 30 is shown and the main body is omitted in order to avoid complication.

As shown in FIG. 4A, the collective board 80 includes four boards 82 to be inspected 82-1 to 82-4, and each board 82 to be inspected has a pair of probes. The pin 32 can contact the pair of pads 56. That is, the pair of probe pins 32-1 and 32-2 can be brought into contact with the pads 56-1 and 56-2 on the inspected substrate 82-1 and the pair of probe pins 32-1 and 32-2 can be in contact on the inspected substrate 82-2. The probe pins 32-3 and 32-4 can be brought into contact with the pads 56-3 and 56-4, and in the board 82-3 to be inspected, the pair of probe pins 32-5 and 32-6 are the pads 56-. 5 and 56-6, the pair of probe pins 32-7 and 32-8 can be brought into contact with the pads 56-7 and 56-8 on the board 82-4 to be inspected. Therefore, in the example of FIG. 4A, the inspection jig 30 is provided with at least eight probe pins 32. Similar electrical signals are output from the probe pins 32 of each pair and applied to each of the inspected substrates 82-1 to 82-4, and the same inspection is performed.

In this embodiment, the inspection jig used for the substrate inspection of the collective substrate 80 and the inspection jig used for the substrate inspection of the individual substrate 100 are shared. Therefore, as shown in FIG. 4B, when the inspection target is the individual substrate 100, a pair of the probe pins 32 out of the eight inspection jigs 30 (in the example of FIG. 4B, , Probe pins 32-1 and 32-2) can be brought into contact with the individual substrate 100. Since there is no inspection target for the remaining six (3 pairs) probe pins 32-3 to 32-8, the probe pins 32 remain open.

In this embodiment, the position of the individual substrate 100 arranged on the inspection jig 30 is set to a position corresponding to the position of the substrate 82-1 to be inspected in the collective substrate 80. The present invention is not limited to this, and may be a position corresponding to any of the other inspection target substrates 82-2 to 82-4. Further, in the present embodiment, it is not necessary to fix the position where the individual substrate 100 is arranged.

Under the arrangement state of the inspection device 12 as described above, in the substrate inspection process according to the present embodiment, an electric signal (voltage, current, etc.) is output from the pair of probe pins 32 to the pair of pads 56, The electric signal obtained by applying the electric signal is sent to the computer 18 via the pair of probe pins 32, and the electric characteristic is detected (measured). The electrical characteristics to be detected are not particularly limited, such as voltage (potential difference), current, and values of elements of electric parts, but in the present embodiment, the resistance value of the resistor 102 is detected.

In the board inspection processing of the collective board 80, as shown in FIG. 4A, the pair of probe pins 32-1 and 32-2 are connected to the pair of pads 56- arranged on the board 82-1 to be inspected. The resistance value of the resistor 102 is measured by contacting with 1, 56-2. Then, when the measured resistance value is within a predetermined range (for example, 100Ω or more, 120Ω or less, etc., hereinafter “expected value”), it is determined that the inspected substrate 82-1 is present. Similarly, the resistance value of the resistor 102 is also measured on the inspected substrates 82-2 to 82-4, and when the measured resistance value is within the range of the expected value, the inspected substrates 82-2 to 82-4. It is determined that each of the. The predetermined range of the resistance value of the resistor 102 may be set in consideration of manufacturing variations of the resistor 102.

In the board inspection process of the collective board 80, since the resistors 102 mounted on the boards 82-1 to 82-4 are the same for each board to be inspected, basically the boards 82-1 to 82-4 to be inspected are present. Then it is judged. Therefore, when it is determined that the inspection target is the collective substrate 80, the resistance value of the resistor 102 may be within the range of the expected value in all the inspection target substrates 82-1 to 82-4.

However, in the present embodiment, the resistance value of the resistor 102 is not limited to be within the range of the expected value for the four test substrates 82, and the resistance for the plurality of test substrates 82, that is, two to four test substrates 82 is not limited. The fact that the resistance value of 102 is within the range of the expected value is a condition for determining that the inspection target is the collective substrate 80. This exists even though the collective substrate 80 exists because the resistance value of the resistor 102 becomes larger than an expected value or becomes an open state due to poor contact between the probe pin 32 and the pad 56. This is a consideration to prevent an erroneous determination that it is not. As a result, in the present embodiment, the occurrence of so-called inspection skip, in which the substrate inspection is not executed even though the inspection target substrate 82 exists, is suppressed.
In addition, in the present embodiment, since the individual substrate 100 is one inspected substrate 82, as long as a plurality of inspected substrates 82 are recognized in the substrate inspection process of the collective substrate 80, the inspection target is There is no erroneous determination as an individual substrate.

On the other hand, in the substrate inspection process of the individual substrate 100, only the pair of probe pins 32-1 and 32-2 contact the pair of pads 56-1 and 56-2, and the resistance value of the resistor 102 is measured. To be done. For each other pair of probe pins 32, namely 32-3 and 32-4, 32-5 and 32-6, 32-7 and 32-8, the measured resistance is close to infinity, that is, open. Therefore, it is determined that the inspection target does not exist at the position corresponding to the pair of probe pins 32. Therefore, it is determined that the inspection target is the individual substrate 100.

(Substrate inspection process)
Next, with reference to FIG. 5, a board inspection process executed by the inspection device 12 will be described. FIG. 5 is a flowchart showing a processing flow of the board inspection processing program according to the present embodiment. In the process shown in FIG. 5, the user connects and sets the collective substrate 80 or the individual substrate 100 to be inspected to the inspection jig 30 of the inspection device 12, and operates the operation unit 20 or the like to start the inspection. By giving an instruction, the CPU 18A reads the board inspection processing program stored in the ROM 18B or the non-volatile memory 18D and is executed. That is, when the user operates the operation unit 20 or the like of the inspection device 12 to start the inspection (executes the substrate inspection processing program), the inspection device 12 causes the probe pins 32 to the pads 56 of the collective substrate 80 or the individual substrate 100. Are brought into contact with each other to check the operation of the collective substrate 80 or the individual substrate 100.

Although the present embodiment has been described by exemplifying a mode in which the board inspection processing program is stored in the ROM 18B or the like in advance, the present invention is not limited to this, and the board inspection processing program can be stored in a computer-readable storage medium. A form provided in a stored state, a form delivered via wired or wireless communication means, and the like may be applied.

Further, in the present embodiment, the board inspection process is realized by a software configuration using a computer by executing a program, but the present invention is not limited to this. For example, it may be realized by a hardware configuration that adopts an ASIC (Application Specific Integrated Circuit) or a combination of a hardware configuration and a software configuration.

As shown in FIG. 5, first, in step S100, detection of electrical characteristics by the pair of probe pins 32 is performed. More specifically, each pair of probe pins 32 is moved to a position where it can come into contact with the corresponding pair of pads 56, and a required signal is applied to the pair of pads 56 from each pair of probe pins 32, so that Perform detection of electrical properties between pairs. Since the electrical characteristic according to the present embodiment is the resistance value of the resistor 102, for example, a current is caused to flow between each pair of probe pins 32, the voltage generated at both ends of the resistor 102 is measured, and the current value and the voltage value are The resistance value of the resistor 102 is calculated.

In the next step S102, it is determined whether or not only one resistance value (electrical characteristic) detected in step S100 is within the expected value range. If the determination is negative, the process proceeds to step S104, and if the determination is positive, the process proceeds to step S106.

In step S104, a collective board inspection program is executed. This is because it is determined that the inspection target is the collective substrate 80 because a plurality of resistance values within the expected value range are confirmed in step S102.

In step S106, the individual board inspection program is executed. This is because it is determined in step S102 that the resistance value within the expected value range is one , and it is determined that the inspection target is the individual substrate 100.

In step S108, it is determined whether the board inspection is completed. If the determination is negative, the process returns to step S100 to continue the substrate inspection process. On the other hand, when the determination is affirmative, the board inspection processing program is terminated. The determination as to whether or not the board inspection is completed may be made based on whether or not the user inputs an instruction to end the board inspection through the operation unit 20, for example.

As is clear from the above description, according to the inspection device and the inspection method according to the present embodiment, the inspection of the collective substrate 80 and the inspection of the individual substrate 100 are shared by the substrate inspection processing program. Both tests are performed.

As described above in detail, according to the inspection device and the inspection method according to the present embodiment, the cost of the inspection of the collective substrate including the plurality of inspection substrates, including the inspection of the individual inspection substrates is reduced. Provided are an inspection device, an inspection method, and an inspection program that can be efficiently performed without causing an increase.

In the above-described embodiment, the mode in which the electrical characteristics are detected using the pair of pads 32 has been described as an example, but the present invention is not limited to this, and the mode in which the electrical characteristics are detected using the single pad 32. May be In this case, for example, the potential difference between the pad 32 of each substrate 82 to be inspected and the reference potential (eg, ground) of the inspection device 12 may be used as the electrical characteristic for detecting.

In addition, in the above-described embodiment, an example in which one pair of contact points is arranged on each inspected substrate 82 (individual substrate 100) has been described, but the present invention is not limited to this, and the electrical characteristics to be detected may be different. A plurality of contact point pairs may be arranged accordingly.

Further, in the above-described embodiment, the mode in which the pad connected to the terminal of the component is used as the contact point has been described as an example, but the present invention is not limited to this, and the terminal itself of the component may be used as the contact point. In this case, there is no need to provide an inspection wiring pattern or the like on the substrate to be inspected, and the positions of the contact points can be flexibly changed.

Further, in the above-described embodiment, the resistance is exemplified as the component for detecting the electrical characteristic by the pad 32, but the present invention is not limited to this, and other components such as the capacitance value of the capacitor 106 or the semiconductor element 104 can be specified. It may be the terminal voltage of the terminal of.
Moreover, the components for detecting the electrical characteristics of the respective substrates to be inspected may be different. Explaining in detail with reference to FIG. 4, a pair of probe pins 32-1 and 32-2 can be brought into contact with the pads 56-1 and 56-2 on the inspected substrate 82-1. On the board 82-2 to be inspected, the pair of probe pins 32-3 and 32-4 are brought into contact with the pair of terminals of the capacitor 106, respectively. On the board 82-3 to be inspected, a pair of probe pins 32-5 and 32-6 are brought into contact with two specific terminals of the semiconductor element 104, respectively. On the inspection board 82-4, the pair of probe pins 32-7 and 32-8 are brought into contact with a pair of terminals of other components (for example, a resistor other than the resistor 102) not shown. Then, for the inspected boards 82-1 to 82-4, the electrical characteristics of different components are detected, and it is determined whether or not there is one that is within the range of the expected value (different for each component). You may do it. By doing so, when a mounting error occurs in all of the specific components whose electrical characteristics are detected (for example, when a different resistor is mounted at the position of the resistor 102 and the resistance value is outside the expected value). It is possible to prevent the inspection device 12 from malfunctioning.
Further, the target for detecting the electrical characteristic is not limited to the component, and for example, the electrical characteristic of the wiring pattern provided between the pair of pads 32 may be detected. In this case, the expected value may be set such that the resistance value detected by the pair of pads 32 is a specified value or less, for example, 5Ω or less.

Further, the configuration of the inspection device 12 described in the above embodiment (see FIGS. 1 and 2) is an example, and unnecessary portions may be deleted or new portions may be added without departing from the scope of the present invention. You may

For example, in each of the above-described embodiments, the inspection device in which the inspection jig 30 provided with the probe pin 32 is used has been described as an example. However, the present invention is not limited to this, and the probe pin includes the collective substrate 80, Alternatively, it may be applied to a so-called fixtureless type inspection apparatus that moves to each contact point of the individual substrate 100 to execute the inspection.

The processing flow of the substrate inspection processing program described in each of the above embodiments (see FIG. 5) is also an example, and unnecessary steps may be deleted or new steps may be added without departing from the spirit of the present invention. You may add or may change the process order.

12 Inspection device 18 Computer 18A CPU
18B ROM
18C RAM
18D non-volatile memory 18E I/O
18F Bus 20 Operation part 22 Display part 28 Cable 30 Inspection jig 30A Upper side inspection jig 30B Lower side inspection jig 32, 32-1 to 32-8 Probe pin 40 Printed wiring board 42a, 42b Electronic component 44 Solder part 52 Connection Piece 54 Wiring pattern 56 Pad 80 Assembly board 82 Inspected board 100 Piece board 102 Resistor 104 Semiconductor element 106 Capacitor

Claims (9)

A plurality of electric conductors that come into contact with each of the contact points arranged on each of the plurality of substrates to be inspected included in the collective substrate;
Run the detection using the energization of said plurality of, said plurality of the predetermined electrical characteristics are detected by two or more of the inspected substrate, and electrically defined the advance in one or more When no characteristic is detected, all of the plurality of inspected substrates are inspected, and when the predetermined electrical characteristic is detected by only one inspected substrate, the one inspected substrate is inspected. Inspection means to inspect,
Inspection device including. The inspection means performs detection of a potential difference between each of the plurality of contact points and the reference potential of the inspection device using the plurality of electric conductors, and the detected potential difference is within a predetermined range. The inspection apparatus according to claim 1, wherein the predetermined electrical characteristic is detected in such a case. Each of the contact points is connected to a terminal of a component mounted on the board to be inspected,
The inspecting means performs detection of an electrical characteristic at the terminal using the plurality of electric conductors, and the predetermined electrical characteristic is detected when the detected electrical characteristic is within a predetermined range. The inspection device according to claim 1. The contact point is a pair of contact points including two contact points, and the electric conductor is a pair of electric conductors including two electric conductors,
The inspection device according to claim 1, wherein the inspection unit performs detection by using each of the plurality of electric conductor pairs by contacting each of the plurality of electric conductor pairs with each of the plurality of contact point pairs. Each of the contact point pairs is connected to a terminal pair of components mounted on the board to be inspected, and the inspecting means detects the electrical characteristics of the terminal pair by using a plurality of the pairs of electric conductors. The inspection apparatus according to claim 4, which is executed and detects the predetermined electrical characteristic when the detected electrical characteristic is within a predetermined range. The inspection device according to claim 5, wherein the component is a resistor, and the electrical characteristic is a resistance value. A part of the plurality of electric conductors contacts a contact point disposed on one surface of the inspected substrate, and the other electric conductors of the plurality of electric conductors are inspected. The inspection device according to any one of claims 1 to 6, which is in contact with a contact point arranged on the other surface of the substrate, and the part of the electric conductor and the other part of the electric conductor do not face each other. .. A test method using a test apparatus including a plurality of electric conductors that come into contact with each of the contact points arranged on each of the plurality of substrates to be inspected included in the collective substrate,
Performing detection using the plurality of electric conductors,
The electrical properties predetermined by two or more of the plurality of the substrate to be inspected is detected and inspected the plurality of cases the electrical characteristics defined the advance in one or more is not detected An inspection method of inspecting all of the substrates, and inspecting the one inspected substrate when the predetermined electrical characteristic is detected in only one inspected substrate. A program for controlling an inspection apparatus including a plurality of electric conductors that come into contact with each of contact points arranged on each of a plurality of inspected boards included in an aggregate board,
Computer,
Run the detection using the energization of said plurality of, said plurality of the predetermined electrical characteristics are detected by two or more of the inspected substrate, and electrically defined the advance in one or more When no characteristic is detected, all of the plurality of inspected substrates are inspected, and when the predetermined electrical characteristic is detected by only one inspected substrate, the one inspected substrate is inspected. An inspection program that functions as an inspection means for inspection.