JP5937778B2 - 電子部品および電子部品の接続構造 - Google Patents
電子部品および電子部品の接続構造 Download PDFInfo
- Publication number
- JP5937778B2 JP5937778B2 JP2010218451A JP2010218451A JP5937778B2 JP 5937778 B2 JP5937778 B2 JP 5937778B2 JP 2010218451 A JP2010218451 A JP 2010218451A JP 2010218451 A JP2010218451 A JP 2010218451A JP 5937778 B2 JP5937778 B2 JP 5937778B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode terminal
- holder
- terminal
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 42
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000005452 bending Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Resistors (AREA)
Description
一端が前記回路基板と電気的に接続されるとともに、他端が前記電極面に接合される可撓性導体と、を備えることを特徴とする電子部品の接続構造を提供する。
110…電子部品本体
120…電極端子
121…上面(電極面)
122…下面
125,126,128…先端部(規制部)
127…折り曲げ部(規制部)
130…ホルダ
131…端子挿通穴
132…端子挿通溝(規制部)
133…端子差込部(規制部)
134…端子封止部(規制部)
135…端子係合溝(規制部)
200,210…接着剤
300…回路基板(放電点灯制御用の回路基板)
400…金属リボン(可撓性導体)
500…金属ベース(取付板)
1000…接合用ツール
1100…リボンガイド
Claims (3)
- 電子部品本体と、
前記電子部品本体から突出し、電極面に可撓性導体を接合した状態で前記電子部品本体と外部電極とを電気的に接続する電極端子と、
絶縁性材料により形成され、前記電子部品本体に接合されたホルダと、
を備える電子部品であって、
前記ホルダは、前記電子部品が取付板に取り付けられた際に前記取付板と前記電子部品
本体との間に介在し、前記電極端子における前記電極面と反対側の面と当接し、
前記ホルダは、前記電極端子を前記電極面が露出した状態で保持して前記電極端子が前記ホルダから離れる方向へ移動するのを規制する第1規制部を有することを特徴とする電子部品。 - 前記電極端子は、前記電極端子が前記ホルダから離れる方向へ移動するのを規制するように前記ホルダに係止する第2規制部を有することを特徴とする請求項1に記載の電子部品。
- 請求項1又は2に記載の電子部品と、
前記電子部品が取り付けられる取付板と、
前記取付板における前記電子部品と異なる位置に取り付けられる回路基板と、
一端が前記回路基板と電気的に接続されるとともに、他端が前記電極面に接合される可撓性導体と、
を備えることを特徴とする電子部品の接続構造。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010218451A JP5937778B2 (ja) | 2010-09-29 | 2010-09-29 | 電子部品および電子部品の接続構造 |
US13/246,903 US8705246B2 (en) | 2010-09-29 | 2011-09-28 | Electronic part and connection structure of the electronic part |
CN201110353115.5A CN102568759B (zh) | 2010-09-29 | 2011-09-29 | 电子元件和电子元件的连接结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010218451A JP5937778B2 (ja) | 2010-09-29 | 2010-09-29 | 電子部品および電子部品の接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012074551A JP2012074551A (ja) | 2012-04-12 |
JP5937778B2 true JP5937778B2 (ja) | 2016-06-22 |
Family
ID=45870470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010218451A Expired - Fee Related JP5937778B2 (ja) | 2010-09-29 | 2010-09-29 | 電子部品および電子部品の接続構造 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8705246B2 (ja) |
JP (1) | JP5937778B2 (ja) |
CN (1) | CN102568759B (ja) |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6214664Y2 (ja) * | 1979-02-22 | 1987-04-15 | ||
JPS567372U (ja) * | 1979-06-26 | 1981-01-22 | ||
US4862245A (en) * | 1985-04-18 | 1989-08-29 | International Business Machines Corporation | Package semiconductor chip |
JPH05217749A (ja) * | 1992-01-31 | 1993-08-27 | Toko Inc | コイル素子およびその製造方法 |
JPH07106202A (ja) * | 1993-10-06 | 1995-04-21 | Rohm Co Ltd | 固体電解コンデンサの基板実装構造 |
JPH08213270A (ja) * | 1995-02-07 | 1996-08-20 | Alps Electric Co Ltd | ケース収納型電子部品 |
US5742484A (en) * | 1997-02-18 | 1998-04-21 | Motorola, Inc. | Flexible connector for circuit boards |
US5993247A (en) * | 1997-12-01 | 1999-11-30 | General Motors Corporation | Electrical connection for flex circuit device |
JPH11167971A (ja) * | 1997-12-05 | 1999-06-22 | Olympus Optical Co Ltd | 電子機器 |
US6335225B1 (en) * | 1998-02-20 | 2002-01-01 | Micron Technology, Inc. | High density direct connect LOC assembly |
US6031730A (en) * | 1998-11-17 | 2000-02-29 | Siemens Automotive Corporation | Connector for electrically connecting circuit boards |
US6594152B2 (en) * | 1999-09-30 | 2003-07-15 | Intel Corporation | Board-to-board electrical coupling with conductive band |
DE10029925C1 (de) * | 2000-06-17 | 2002-01-10 | Harting Kgaa | Leiterplattensteckverbindung |
JP2003168609A (ja) | 2001-11-30 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 表面実装型トランスの実装方法 |
US6684499B2 (en) * | 2002-01-07 | 2004-02-03 | Xerox Corporation | Method for fabricating a spring structure |
GB2405724B (en) * | 2002-06-24 | 2006-02-08 | Samsung Electronics Co Ltd | Memory module having a path for transmitting high-speed data and a path for transmitting low-speed data and memory system having the memory module |
JP4357868B2 (ja) * | 2003-04-25 | 2009-11-04 | シャープ株式会社 | 表示装置 |
TWI240819B (en) * | 2003-08-21 | 2005-10-01 | Toppoly Optoelectronics Corp | Flexible printed circuit board (FPC) for liquid crystal display (LCD) module |
US7358446B2 (en) * | 2003-10-14 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Power distribution system |
US6950314B2 (en) * | 2004-02-27 | 2005-09-27 | Infineon Technologies Ag | Arrangement for the electrical connection of an optoelectronic component to an electrical component |
CN2731905Y (zh) * | 2004-08-07 | 2005-10-05 | 鸿富锦精密工业(深圳)有限公司 | 电路板连接界面 |
US7148428B2 (en) * | 2004-09-27 | 2006-12-12 | Intel Corporation | Flexible cable for high-speed interconnect |
JP2006179732A (ja) * | 2004-12-24 | 2006-07-06 | Hitachi Ltd | 半導体パワーモジュール |
JP2006179821A (ja) * | 2004-12-24 | 2006-07-06 | Toshiba Corp | プリント回路基板 |
JP4562516B2 (ja) * | 2004-12-24 | 2010-10-13 | 京セラ株式会社 | 電子部品収納用パッケージおよび電子装置 |
JP4457026B2 (ja) * | 2005-02-21 | 2010-04-28 | 日立オートモティブシステムズ株式会社 | モールド部品及びそれを用いた電子装置 |
US7254038B2 (en) * | 2005-04-21 | 2007-08-07 | Barracuda Networks, Inc. | Low profile expansion card for a system |
JP2007007774A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 微小電気機械装置用パッケージおよびその製造方法 |
JP4483738B2 (ja) * | 2005-08-19 | 2010-06-16 | セイコーエプソン株式会社 | デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置 |
US20090315162A1 (en) * | 2008-06-20 | 2009-12-24 | Yong Liu | Micro-Modules with Molded Passive Components, Systems Using the Same, and Methods of Making the Same |
JP2010050445A (ja) * | 2008-07-22 | 2010-03-04 | Panasonic Corp | 基板の接合構造および基板の接合方法 |
-
2010
- 2010-09-29 JP JP2010218451A patent/JP5937778B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-28 US US13/246,903 patent/US8705246B2/en not_active Expired - Fee Related
- 2011-09-29 CN CN201110353115.5A patent/CN102568759B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102568759B (zh) | 2015-02-11 |
CN102568759A (zh) | 2012-07-11 |
US8705246B2 (en) | 2014-04-22 |
JP2012074551A (ja) | 2012-04-12 |
US20120075819A1 (en) | 2012-03-29 |
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