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JP5211493B2 - 配線基板及び半導体装置 - Google Patents

配線基板及び半導体装置 Download PDF

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Publication number
JP5211493B2
JP5211493B2 JP2007020081A JP2007020081A JP5211493B2 JP 5211493 B2 JP5211493 B2 JP 5211493B2 JP 2007020081 A JP2007020081 A JP 2007020081A JP 2007020081 A JP2007020081 A JP 2007020081A JP 5211493 B2 JP5211493 B2 JP 5211493B2
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Japan
Prior art keywords
semiconductor element
wiring board
dam
external connection
semiconductor device
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JP2007020081A
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English (en)
Japanese (ja)
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JP2008187054A5 (zh
JP2008187054A (ja
Inventor
隆雄 西村
和之 合葉
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Fujitsu Semiconductor Ltd
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Fujitsu Semiconductor Ltd
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Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Priority to JP2007020081A priority Critical patent/JP5211493B2/ja
Priority to TW097100158A priority patent/TWI373835B/zh
Priority to US11/969,402 priority patent/US7880276B2/en
Priority to CN2008100032539A priority patent/CN101236946B/zh
Priority to KR1020080008433A priority patent/KR100938408B1/ko
Publication of JP2008187054A publication Critical patent/JP2008187054A/ja
Publication of JP2008187054A5 publication Critical patent/JP2008187054A5/ja
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Publication of JP5211493B2 publication Critical patent/JP5211493B2/ja
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2007020081A 2007-01-30 2007-01-30 配線基板及び半導体装置 Active JP5211493B2 (ja)

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Application Number Priority Date Filing Date Title
JP2007020081A JP5211493B2 (ja) 2007-01-30 2007-01-30 配線基板及び半導体装置
TW097100158A TWI373835B (en) 2007-01-30 2008-01-03 Wiring board and semiconductor device
US11/969,402 US7880276B2 (en) 2007-01-30 2008-01-04 Wiring board and semiconductor device
CN2008100032539A CN101236946B (zh) 2007-01-30 2008-01-28 布线板和半导体器件
KR1020080008433A KR100938408B1 (ko) 2007-01-30 2008-01-28 배선 기판 및 반도체 장치

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US20080179738A1 (en) 2008-07-31
KR100938408B1 (ko) 2010-01-22
KR20080071497A (ko) 2008-08-04
CN101236946A (zh) 2008-08-06
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US7880276B2 (en) 2011-02-01
JP2008187054A (ja) 2008-08-14

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