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CN203026500U - 堆叠封装器件 - Google Patents

堆叠封装器件 Download PDF

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Publication number
CN203026500U
CN203026500U CN2012207245400U CN201220724540U CN203026500U CN 203026500 U CN203026500 U CN 203026500U CN 2012207245400 U CN2012207245400 U CN 2012207245400U CN 201220724540 U CN201220724540 U CN 201220724540U CN 203026500 U CN203026500 U CN 203026500U
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Prior art keywords
components
parts
base plate
utility
model
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Expired - Lifetime
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CN2012207245400U
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Inventor
陈羽
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Huawei Device Co Ltd
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Huawei Device Co Ltd
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Priority to CN2012207245400U priority Critical patent/CN203026500U/zh
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Publication of CN203026500U publication Critical patent/CN203026500U/zh
Priority to PCT/CN2013/088913 priority patent/WO2014101648A1/zh
Priority to US14/133,005 priority patent/US20140175674A1/en
Priority to EP13199289.3A priority patent/EP2750189A1/en
Anticipated expiration legal-status Critical
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Abstract

本实用新型提供一种堆叠封装器件，包括：至少两个元器件，相互顺序焊接，位于下方的元器件底板的尺寸大于位于上方的元器件的边缘尺寸。本实用新型提供的堆叠封装器件，通过采用位于下方的元器件底板的尺寸大于位于上方的元器件的边缘尺寸，从而保证在位于下方的元器件底板上进行点胶，加固位于上方的元器件，进而保证上方的元器件的稳固性。

Description

堆叠封装器件
技术领域
本实用新型涉及封装技术，尤其涉及一种堆叠封装器件。
背景技术
堆叠封装（Package on package，简称PoP）技术应用在元器件封装过程中，通常需要在单板上堆叠多层。例如通常包括至少两个元器件，每个元器件均包括底板以及底板上连接的焊盘、焊球和电子器件等。相邻两个元器件的底板扣合在一起，将电子器件与焊球等进行焊接，将芯片封装于其中。
在实际应用中，为了固定底部元器件在底板上的位置，焊接之后还需要在底板上底部元器件的边缘点胶，利用胶水的流体性，渗透到各元器件的内部，从而起到加强固定元器件内电子器件的作用。
但是由于元器件堆叠的高度较高，底板上的胶水不能累积到位于上方的元件器的内部，因此位于上方的元器件的可靠性不能得到保证。
实用新型内容
本实用新型提供一种堆叠封装器件，用以解决现有技术中位于上层的元器件稳固的问题。
第一方面，本实用新型提供一种堆叠封装器件，包括：至少两个元器件，相互顺序焊接，位于下方的元器件底板的尺寸大于位于上方的元器件的边缘尺寸。
在第一方面的第一种可能的实现方式中，所述下方的元器件底板的边缘朝上形成有凸起。
根据第一方面的第一种可能实现的方式，在第二种可能的实现方式中，所述凸起的高度与所述位于上方的元件器的底板平齐。
结合第一方面、第一方面的第一种可能的实现方式以及第二种可能的实现方式，在第三种可能的实现方式中，所述元器件的数量为两个，位于下方的元器件是接入节点算数处理芯片；位于上方的元器件为记忆存储芯片。
本实用新型提供的堆叠封装器件，通过采用位于下方的元器件底板的尺寸大于位于上方的元器件的边缘尺寸，从而保证在位于下方的元器件底板上进行点胶，加固位于上方的元器件，进而保证上方的元器件的稳固性。
附图说明
图1是本实用新型堆叠封装器件实施例一的结构示意图；
图2为本实用新型堆叠封装器件实施例二的结构示意图。
具体实施方式
为使本实用新型实施例的目的、技术方案和优点更加清楚，下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本实用新型一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
图1是本实用新型堆叠封装器件实施例一的结构示意图，如图1所示，本实用新型提供的堆叠封装器件，包括至少两个元器件，相互顺序焊接，并且位于下方的元器件11的底板11a的尺寸大于位于上方的元器件12的边缘尺寸。
具体地，位于下方的元器件包括底板11a和位于底板11a下方的锡球11b，锡球11b与底板11a之间通过焊盘11c连接，位于上方的元器件12包括底板12a和位于底板12a下方的锡球12b，锡球12b与底板12a之间通过焊盘12c连接。位于下方的元器件11的底板11a和位于上方的元器件12的底板12a通过加热使锡球融化，从而完成两个元器件的顺次焊接，并且由于位于下方的元器件11的底板11a的尺寸大于位于上方的元器件12的边缘的尺寸，所以可以将胶水点在位于下方的元器件11的底板11a上，利用胶水的流体性可以将胶水渗透到位于上方的元件器12的底板12a下。
进一步地，位于下方的元器件11的底板11a的尺寸大于位于上方的元器件12的边缘尺寸，可以为位于下方的元器件11的底板11a宽于位于上方的元器件12的边缘尺寸，可以是位于下方的元器件11的底板11a的一条边宽于位于上方的元器件12的边缘尺寸，也可以是位于下方的元器件11的底板11a的多条边宽于位于上方的元器件12的边缘尺寸。
本实用新型提供的堆叠封装器件，采用位于下方的元器件的底板尺寸大于位于下方的元器件的边缘的尺寸，使得位于下方的元器件提供了点胶空间，通过在位于下方的元器件的底板上点胶的方式稳固位于上方的元器件。
优选地，如上所述的堆叠封装器件，下方的元器件11的底板11a的边缘朝上形成有凸起，如图2所示，图2为本实用新型堆叠封装器件实施例二的结构示意图。
在上述实施例的基础上，结合图2进行进一步的说明，位于下方的元器件11的底板11a的边缘形成有凸起13，优选地，凸起13的高度与位于上方的元件器12的底板12a平齐。具体地，位于下方的元器件11的底板11a的边缘形成凸起13，凸起13可以保证点上的胶水不会四处流散，有效固定位于上方的元器件12，形成的凸起13与位于上方的元器件12的底板12a平齐，可以进一步精确位于下方的元器件11的底板11a所盛的胶水的高度不会超过位于上方的元器件12的底板12a，保证了位于上方的元器件12的可靠性。
在上述实施例的基础上，优选地，所述元器件的数量为两个，位于下方的元器件是接入节点算数处理芯片；位于上方的元器件为记忆存储芯片。
具体地，可以通过在接入节点算数处理芯片的底板上点胶，实现对位于接入节点算数处理芯片上方的记忆存储芯片的固定。
当然，元器件的数量并不限制，当元器件数量超过两个时，各层元器件的底板可以逐层扩大，以便保证其上层元器件的胶水渗透保持。
最后应说明的是：以上各实施例仅用以说明本实用新型的技术方案，而非对其限制；尽管参照前述各实施例对本实用新型进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本实用新型各实施例技术方案的范围。

Claims (4)

1.一种堆叠封装器件，包括：至少两个元器件，相互顺序焊接，其特征在于：
位于下方的元器件底板的尺寸大于位于上方的元器件的边缘尺寸。
2.根据权利要求1所述的堆叠封装器件，其特征在于：所述位于下方的元器件底板的边缘朝上形成有凸起。
3.根据权利要求2所述的堆叠封装器件，其特征在于：所述凸起的高度与所述位于上方的元件器的底板平齐。
4.根据权利要求1-3任一项所述的堆叠封装器件，其特征在于：所述元器件的数量为两个，位于下方的元器件是接入节点算数处理芯片；位于上方的元器件为记忆存储芯片。
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