JP4516926B2 - Injection compression molding method of disk substrate by toggle type mold clamping device - Google Patents

Description

  The present invention relates to a method for injection-molding a disk substrate by closing and clamping a mold attached to a mold placing plate and a movable plate by a toggle mechanism.

As shown in FIG. 10 , the normal toggle type mold clamping apparatus includes four corner tie bars 103 extending between the mold placing plate 101 and the pressure receiving plate 102, and the die placing plate 101 and the pressure receiving plate by inserting the tie bars into the four corners. A movable platen 104 provided between the movable platen 102 and a mold clamping toggle mechanism 105 connected to the movable platen 104 and the pressure receiving platen 102. The bending operation of the pair of upper and lower links 105a and 105b of the toggle mechanism 105 is provided. Thus, the movable platen 104 is moved back and forth with respect to the mold placement platen 101, and the mold placement platen 101, the fixed die 106 attached to the movable platen 104 and the movable die 107 are closed and clamped.

In this toggle mechanism 105, when the pair of upper and lower links 105a and 105b are extended and the mold clamping force is not applied, the links tend to move downward (black arrows) due to their own weight. As a result, the upper link 105a is slightly bent downward, and the lower link 105b is fully extended. This characteristic also affects the movable platen 104, and the movable platen 104 tends to be inclined in the direction in which the upper side is opened by receiving the tensile force by the link 105a and the pressing force by the link 105b, although it is slight.

  Further, the tie bars 103 at the four corners installed over the mold placing plate 101 and the pressure receiving plate 102 tend to bend downward from their own weight. Therefore, the movable platen 104 inserted through the tie bar 103 is in a positional relationship in which the mold clamping operation (molding operation) is performed on the mold placing plate 101 side from the lowest point of the tie bar 103 bending. Under the influence of the deflection, the upper side is further inclined to open.

  In the injection compression molding of a disk substrate that requires molding accuracy, a support device 108 is provided under the movable plate 104 in order to maintain mold clamping accuracy, and a shoe or a roller constituting the support device 108 is mounted on a machine base. The movable platen 104 is supported by a support device 108 and is kept horizontal by being grounded to a guide 110 laid on 109.

  However, in the injection compression molding of the disk substrate, even if the fixed mold 106 and the movable mold 107 are parallel and the deviation in the parallelism of the parting surface is in units of microns, Since the thickness deviation is required to be 10 μm or less, it is necessary to adjust and maintain the parallelism with high accuracy so that the thickness deviation is within the allowable range.

As a means for adjusting the parallelism in the toggle type mold clamping device, it is known to adjust the tie bar tension by individually rotating a tie bar tension adjusting mechanism provided for each of the four tie bars by a servo motor. It is also known that the position of the roller of the vertical adjustment mechanism provided on the lower side of the moving plate can be adjusted up and down by the rotation of the eccentric shaft to improve the accuracy of the platen parallelism between the moving plate and the fixed platen. It has been.
Japanese Patent No. 3527872 No. 1-339547

  In the above-mentioned prior art, in which the parallelism is adjusted by adjusting the tie bar tension, the inclination between the mold cavities facing each other or the error between the faces of the mold cavity is known from the parallelism of the molded product molded by test injection molding, and the error is calculated from the amount of the error. It is necessary to calculate the tension of the tie bar that eliminates the tie bar for each of the four tie bars, and adjust the parallelism by individually rotating the tie bar tension adjusting mechanism by a servo motor according to the calculated data. In addition, the tie bar tension is adjusted by adjusting the tension generated when the tie bar is clamped. Therefore, it is necessary to take into account the amount of bending of the fixed platen caused by the clamping force. In the formation of a disk substrate required for the above, a highly accurate tie bar tension adjusting mechanism is required.

  Further, in the above-described prior art, in which the vertical position of the roller is adjusted by rotating the eccentric shaft to adjust the parallelism of the platen, the tie bar is prevented from being bent by the support at the center of gravity and the tilting of the moving plate toward the end plate is corrected. Is performed by adjusting the vertical position of the roller, and this improves the parallelism of the platen. Therefore, the height adjustment of the movable platen only by the vertical movement of the roller also adjusts the deviation of the parallelism of the platen in microns. This is extremely difficult, and has a problem that is difficult to employ in compression molding of a disk substrate that requires a thickness deviation of 10 μm or less.

  In injection compression molding of disk substrates, when the fixed mold and movable mold are slightly opened before they are completely closed, the cavity formed in the mold is filled with resin, and the mold is inserted during or after filling. Fully closed to compress the resin in the cavity. For this reason, in order to mold a disk substrate whose thickness deviation is in an allowable range, it is necessary that the parting surfaces at the opening position are parallel. Therefore, it is difficult for the toggle mechanism to adjust the parallelism at the open position due to the above characteristics.

  In the injection compression molding of the disk substrate, both the fixed mold and the movable mold are heated to a predetermined temperature, and the fixed plate and the movable plate are thermally expanded by heat transfer from the mold received during the molding operation. . The set temperature of the fixed type and the movable type is not the same. Normally, the temperature of the fixed type and the movable type are set differently due to the quality characteristics of the disc. There is also a difference, and this difference in thermal expansion is also a factor in the deviation in parallelism. Therefore, it is also necessary that the parallelism adjustment can be performed with high accuracy in a short time even if the height of the movable platen is displaced due to thermal expansion during molding.

  The present invention has been conceived in order to solve the above-described conventional problems, and the object thereof is to adjust the height of the movable platen by a support device provided in the movable platen, so that the thickness deviation is within an allowable range. It is an object of the present invention to provide an injection compression molding method using a toggle type mold clamping device that enables molding of a disk substrate.

According to the above-described object, the present invention provides a mounting base that is connected to the lower end surface of the movable board in parallel with the tie bar, and a roller at the front and rear ends of the mounting base that is inserted in the tie bar and facing the mold placement table. It is supported on the machine base by a support device equipped with an eccentric roller shaft that supports it, and the movable platen is moved by a toggle mechanism to close the mold, and between the mold placement plate and the parting surface of the mold attached to the movable platen When the resin is slightly opened, the cavity formed in the mold is filled with resin, and during or after filling, the mold is clamped and the resin is compression molded onto the disk substrate.
The movable platen is stopped at a position where the clamping force is not applied with the toggle mechanism extended, and the thickness of the movable plate and the disc substrate thickness deviation or parting surface corresponding to the height displacement amount of the movable platen The parallelism is detected and digitized, and the height of the movable platen is determined from the thickness deviation or the parallelism value, and the movable platen is stopped at the same position as the above detection, and the eccentric roller shaft is rotated. It is to adjust to an appropriate height.

Height adjustment of the movable platen by the supporting device is intended that performed by detecting the rotation amount or rotation angle of the upper Symbol eccentric roller shaft, also those that carried out by rotating the eccentric roller shaft by a servo motor But there is.

  In addition, the height of the movable platen by the support device can be adjusted by measuring the height of the movable platen and the amount of height displacement of the movable platen caused by the rotation of the eccentric roller shaft by the non-contact sensor. This is performed by detecting the distance between the parting surfaces of the mold by a non-contact sensor.

  The height of the movable platen by the support device is determined by detecting the height of the movable platen and the amount of displacement of the movable platen by the rotation of the eccentric roller shaft, and the load of the movable plate received by the support device by a pressure sensor. To do.

In the above arrangement, by stopping the movable platen to not apply clamping force while extending the toggle mechanism similar to the detection time of the position, the height adjustment of the movable platen so intends row, the clamping from the height adjustment position The moving stroke of the movable plate can be shortened, and even if the height of the movable plate is displaced during that time, the height displacement amount can be within the allowable range of the thickness deviation of the disk substrate. In addition, the injection compression molding of the disk substrate by the toggle type mold clamping device can be performed with high accuracy.

  In addition, since the height of the movable platen is adjusted by rotating the eccentric roller shaft of the roller provided in the support device, the adjustment operation is facilitated, and the adjustment is also performed by converting the height displacement amount into a numerical value and adjusting the rotation amount or rotation of the eccentric roller shaft. Since the moving angle is detected, the thickness and thickness of the disk substrate can be adjusted with high accuracy even in micron units, and the adjustment corresponding to the height displacement of the movable platen due to thermal expansion can be performed. Further, since the eccentric roller shaft can be rotated by a servo motor, the height of the movable platen during the molding operation can be adjusted.

  In the figure, reference numeral 1 denotes a mold platen, and 2 denotes a movable platen. Like the toggle type mold clamping device shown in FIG. 10, a horizontal tie bar 3 is inserted over the mold platen 1 and a pressure platen (not shown) at four corners. Thus, it is provided so as to be able to advance and retreat with respect to the mold placing plate 1. The mold placing plate 1 and the movable platen 2 are installed on the machine base 4 together with the pressure receiving plate, and a mold clamping link mechanism (not shown) is provided between the movable platen 2 and the pressure receiving plate. A support device 5 having a pair of front and rear rollers for supporting the movable platen 2 is attached to both sides of the lower end of the movable platen 2 so as to be in contact with the upper surface of the machine base. I have.

  The support device 5 includes a mounting base 6 connected to the lower end surface of the movable plate 2 in parallel with the tie bar 3, and bearing portions 6a and 6b provided on both the inner and outer sides of the front and rear ends of the mounting base 6, as shown in FIG. An eccentric roller shaft 7 horizontally and rotatably inserted in the bearing portions 6a and 6b, and a perfect circle (for example, diameter 44 mm) roller 8 inserted in the eccentric roller shaft 7 and rotatably provided between the bearing portions; The roller 8 contacts the guide base 4a laid on the upper surface of the machine base and supports the movable platen 2 at a set height.

  In the eccentric roller shaft 7, the central axis C ′ of the central shaft portion 71 that receives the roller 8 is slightly eccentric (for example, 0.5 mm) from the axial centers C of the support shaft portions 72 and 73 on both sides. The center of the roller 8 is also eccentric from the axis C. Accordingly, when the eccentric roller shaft 7 is rotated, the height position of the bearing portion 6a with respect to the guide base 4a on the machine base changes as shown by a chain line in FIG.

  3A shows a state where the axis C ′ of the roller 8 is located directly above (height adjustment upper limit), and FIG. 3B shows a state where the axis C ′ is located directly below the axis C ′ (height adjustment lower limit). Is shown. Table 1 shows the amount of displacement of the movable platen in the range of the roller support shaft angle from 15 ° to 180 ° (however, the roller diameter is 44 mm).

  At the shaft end of the support shaft portion 72 outside the eccentric roller shaft 7, a square shaft 74 extends with the same shaft center C. A circular plate 9 for fixing the eccentric roller shaft 7 at predetermined angles is fitted to the angular shaft 74. Six long holes 9a concentric with the support shaft portion 72 are formed at equal intervals in the fixed plate 9, and the eccentric roller shaft 7 is attached to the mounting base 6 by a bolt 10 screwed into the bearing portion 6a from the long hole 9a. It can be fixed to.

  Further, the rotary shaft 11a of the rotary encoder 11 attached to the bearing portion 6b is fitted into and connected to the shaft end of the inner support shaft portion 73. The rotary encoder 11 is connected to a control device 12 that detects the rotation angle (rotation amount) of the eccentric roller shaft 7 and digitally displays the detected value as the height displacement amount of the movable platen 2.

  The height of the movable platen 2 is adjusted by detecting the distance from the upper surface of the machine base by a non-contact sensor 15 attached to the side surface of the mounting base 6 toward the upper surface of the machine base. The opening L between the parting surfaces of the fixed mold 13 for the disk substrate attached to the mold placing plate 1 and the movable mold 14 attached to the movable platen 2 is that of one of the molds (movable mold 14 in the figure). It is detected by four non-contact sensors 14a embedded in the top and bottom (upper and lower) and left and right (both sides) of the parting surface, and the parallelism of the parting surface can be confirmed from the detected values. This parallelism is affected by the height of the movable platen 2 with respect to the mold placement platen 1, and also by the load. Especially the parallelism of the top and bottom is easily affected.

  For detecting the parallelism of the parting surfaces, the non-contact sensor 14a is not embedded in the mold, and the detection members 13 'and 14' are disposed along the parting surfaces outside the two molds as indicated by the chain line. They can be mounted in parallel and provided on either one of them, or in some cases, the arrangement of the non-contact sensor 14a may be used only for the top and bottom, and the left and right sides may be omitted.

  7 (A) and 7 (B) show that the movable platen 2 is stopped at a position (L = 0.35 mm) immediately before the mold closing where the link mechanism is not extended and the mold clamping force is not applied, and the eccentric roller shaft 7 is rotated. The graph shows the change in torque when moved and the change in parallelism between parting surfaces.

  When the eccentric roller shaft 7 is rotated little by little in the direction of increasing the height of the roller 8 together with the fixed plate 9, the amount of rotation is small and the torque is low (whether the height of the roller 8 is low, 7), the parallelism between the parting surfaces is wide on the top side and narrow on the ground side, as shown in FIG. 7A, from the characteristics of the toggle mechanism shown in FIG. 10 (black arrow). .

  Further, if the amount of rotation is increased and the allowance of the roller 8 is increased, the torque of the eccentric roller shaft 7 is also increased, the ground side of the movable platen 2 is spread, and the difference in the top and bottom is reduced. Will become parallel. When the height of the movable platen 2 is further increased by turning, the top side is narrow and the ground side is wide as shown in FIG. 7B.

  This is because when the height of the movable platen 2 is increased, the height of the central portion of the movable platen 2 changes, so the portions of the toggle links 105a and 105b shown in FIG. The upper toggle link 105a in the bent state is stretched straight from the characteristics of the link mechanism (black arrow), and the lower toggle link 105b in the fully extended state is on the upper side. And bending due to the weight of the tie bar 3 installed over the mold placing plate 1 and the pressure receiving plate (see FIG. 10) is reduced by pushing up, and the tie bar 3 and the tie bar bush (not shown) in the movable plate From this relation, it is assumed that the movable platen 2 is vertically displaced together with the movable mold 14 and that the top side is narrow and the ground side is widened by a synergistic action due to the parallelism between the parting surfaces. Along with the change in parallelism due to the height displacement of the movable platen 2, the thickness and thickness of the disk substrate to be injection-molded are also changed.

  As described above, since the height of the movable platen 2 and the thickness deviation or parallelism of the disk substrate are in correlation, the height deviation of the movable platen 2 and the thickness deviation or parallelism corresponding to the height displacement amount are prototyped. If the molding is repeated, measured, digitized, and digitally controlled, the height adjustment amount of the movable platen 2 can be known from the thickness deviation or parallelism, and the accuracy of the disk substrate is allowed by injection compression molding. It is possible to maintain the thickness within the range of thickness. On the other hand, since the parallelism can be known from the height of the movable platen 2 before molding, it is possible to set and maintain the appropriate parallelism by adjusting the height even when uneven thickness occurs on the top and bottom. It becomes.

  In addition, the fixed mold 13 and the movable mold 14 during the molding operation are temperature-controlled, and the mold table 1 and the movable board 2 are thermally expanded by heat transfer received from the mold. The expansion in the vertical direction of the fixed mold 13 and the movable mold 14 due to this thermal expansion occurs upward because both are supported by the machine base 4, and the temperature of the fixed mold 13 is changed to the temperature of the movable mold 14. When set higher than this, the amount of elongation upward of the mold placing plate 1 is larger than that of the movable platen 2 due to the temperature difference generated there, and the tie bar 3 is also displaced upward accordingly.

  For this reason, the load on the movable platen 2 by the tie bar 3 is increased, and the load on the movable platen 2 received by the support device 5 is reduced. Moreover, since the movable platen 2 also extends upward, the height of the central part changes. Due to the upward displacement of the central portion and the increased load caused by the tie bar 3, the link mechanism is in the state of the black arrow shown in FIG. Damaged.

  However, there is no change in the correlation between the height of the movable platen 2 and the thickness deviation of the disk substrate and the parallelism even if both boards are thermally expanded. Therefore, the thickness deviation detected when the mold is heated and temperature-controlled. Alternatively, the height of the movable platen 2 can be adjusted to an appropriate height by the support device 5 from the numerical value of parallelism. Thereby, even during molding operation, the height of the movable platen 2 is adjusted, and the injection compression molding of the disk substrate whose thickness deviation is in an allowable range is possible.

The following table shows numerical values of torque (rotation amount), movable plate height displacement amount, roller shaft rotation angle, and uneven thickness (upside-down difference). FIG. 8 is a graph showing the deviation of the disk substrate corresponding to the height displacement of the movable plate (however, the fixed mold temperature is 119 ° C., the movable mold temperature is 110 ° C., L = 0.35 mm).

  The height of the movable platen 2 in the support device 5 is fixed by fixing the eccentric roller shaft 7 to the bearing portion 6a by stopping the movable platen 2 at a position where no mold clamping force is applied with the toggle mechanism extended. The bolt 10 of the plate 9 is loosened, and a rotating tool (not shown) is fitted to the square shaft 74 and rotated in the setting direction. The angle of the eccentric roller shaft 7 that changes due to the rotation is sequentially detected by the rotary encoder 11, and the detected angle is converted into a height by the control device 12 and is digitally displayed as a height displacement amount of the movable platen 2. .

  The eccentric roller shaft 7 can be rotated by a servo motor 16 provided with a rotary encoder 11 as shown in FIG. The servo motor 16 attached to the main body on the bearing portion 6 b and fitted with the drive shaft 16 a in the shaft of the support shaft portion 73 and connected to the eccentric roller shaft 7 is controlled to rotate by the control device 17. The control unit 17 is inputted with the parallelism corresponding to the height of the movable platen 2 detected by the non-contact sensor 15 or the thickness deviation of the disk substrate in numerical form, and the detected height of the movable platen 2. Is determined to be outside the allowable thickness deviation range, the servo motor 16 is driven to rotate the eccentric roller shaft 7 in accordance with a command from the control device 17.

  The rotary encoder 11 detects the rotation amount of the eccentric roller shaft 7, and the rotation amount of the servo motor 16 is confirmed from the detected value, whereby the height of the movable platen 2 is adjusted. In the height adjustment by the servo motor 16, the servo motor is subjected to molding every time when the height of the movable platen 2 varies, the variation of the opening L between the parting surfaces by the non-contact sensor 14a, and the variation of the measured thickness. It is possible to automatically adjust the height of the movable platen 2 by driving 16 and maintain the tolerance of the disc substrate thickness deviation of 10 μm or less within a range.

  Further, the height of the movable platen 2 can be adjusted by detecting the load of the movable platen 2 received by the support device 5 by the load cell 18, as shown in FIG. In this case, the movable platen 2 is mounted and fixed on a pedestal 19 which is fitted to the upper part of the mounting base 6 with front and rear lower edges to be movable up and down, and the mounting base 6 is positioned with the base 19 and the gap 19a. The load cell 18 is embedded in the upper part of the base plate with the detection terminal in contact with the lower surface of the base.

  In the load cell 18 that receives the load of the movable platen 2 via the detection terminal, the tie bar 3 bears the movable platen 2 when the support height of the movable platen 2 by the support device 5 becomes low. The load of is reduced. On the other hand, when the support height increases, the load on the movable platen 2 by the tie bar 3 decreases, and the load on the movable platen 2 in the load cell 18 increases. Therefore, a change in the load detected by the load cell 18 is detected as a height displacement of the movable platen 2.

  Further, the rotation of the front and rear eccentric roller shafts provided in the support devices 5 on both lower sides of the movable platen 2 can simultaneously rotate the pair of front and rear eccentric roller shafts one side by using a link mechanism. As shown in FIG. 6, the link mechanism 20 has link arms 22, 22 pivotally attached to both ends of a link bar 21, an operation terminal 23 on one link arm 22, and an opposite link arm. The stopper 24 is provided on the link bar surface in the vicinity of the belt 22, and the lower ends of the link arms 22 and 22 are fitted and fixed to the square shaft 74 and connected to a pair of front and rear eccentric roller shafts. . As a result, when one of the front and rear eccentric roller shafts is rotated, the other eccentric roller shaft is also rotated simultaneously, and the height of the movable platen 2 is adjusted. Accordingly, the time required for the adjustment work is shortened compared with the case where the eccentric roller shafts are individually rotated, and the number of motors is reduced when the servomotor is rotated.

FIG. 9 is a flowchart showing a case where the deviation L of the disk substrate is automatically adjusted by detecting the distance L between the parting surfaces.
First, the movable mechanism is stopped at a position immediately before closing the mold by extending the link mechanism and applying no mold clamping force. “Detect the distance between the top side Xa and the ground side Xb between the parting surfaces at the start of molding, and calculate the top and bottom difference Xc (thickness) (Xa, Xb, Xc = Xa−Xb)” (ST1) − “Start disk substrate molding automatic operation” (ST2)-“Check number of set shots” (ST3)-“Detect the distance between the top side Xa ′ and the ground side Xb ′ between the current parting surfaces, Calculate difference (wall thickness) Xc ′ (Xa ′, Xb ′, Xc ′ = Xa′−Xb ′) ”(ST4) —Compare the top and bottom difference Xc ′ with the threshold Yc of the top and bottom difference (thickness). "(ST5)-" Determine the amount of displacement of the movable platen in the case of a top-to-bottom difference corresponding to the top-to-bottom difference Xc ', and obtain the roller shaft rotation angle "(ST6)-" Drive the servo motor to generate pulses from the rotary encoder "Detect"(ST7)-"Check whether the obtained rotation angle has been reached or not (ST8). When the rotation angle is not reached, the process returns to ST7, and when the rotation angle is reached, the thickness adjustment is finished.

It is a principal part side view of the toggle type mold clamping apparatus which can implement the injection compression molding method of the disc substrate concerning this invention. It is a vertical front view of the roller site | part of a support apparatus. It is explanatory drawing which shows the height adjustment lower limit (A) and height adjustment upper limit (B) by rotation of an eccentric roller axis | shaft. It is a vertical front view of the roller site | part of the support apparatus provided with the servomotor. It is a partially vertical side view of a support device having a load cell for height detection and a lower part of the movable platen. It is a side view of the roller site | part of the support apparatus provided with the link mechanism. It is explanatory drawing which shows the change of the top opening amount between the parting surfaces accompanying the torque change when rotating an eccentric roller axis | shaft with a graph. It is explanatory drawing which shows the relationship between movable board height displacement and thickness deviation in a graph. It is a flowchart of automatic thickness adjustment. It is a side view of a toggle type mold clamping apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Type mounting board 2 Movable board 3 Tie bar 4 Machine base 5 Movable board support apparatus 6 Support apparatus mounting base 7 Eccentric roller shaft 8 Roller 9 Fixed plate 11 Rotary encoder 12 Control apparatus 13 Fixed mold 14 Movable mold 14a, 15 Non-contact Sensor 16 Servo motor 17 Controller 20 Link mechanism 71 Center shaft portion 72 of eccentric roller shaft Support shaft portion 73 outside the eccentric roller shaft 73 Support shaft portion 74 inside the eccentric roller shaft Angular axis of the eccentric roller shaft

Claims (6)

A mounting base that is inserted through the tie bar and is opposed to the mold placement plate, and is connected to the lower end surface of the movable base in parallel with the tie bar, and an eccentric roller shaft that rotatably supports the rollers at the front and rear ends of the mounting base. When the movable platen is supported on the machine base by the support device, and the movable platen is moved by the toggle mechanism to close the mold, and the parting surface of the mold mounted on the platen plate and the movable platen is slightly open. In addition, the resin formed in the cavity is filled with resin, and the mold is clamped during or after filling to compress the resin onto the disk substrate.
The movable platen is stopped at a position where the clamping force is not applied with the toggle mechanism extended, and the thickness of the movable plate and the disc substrate thickness deviation or parting surface corresponding to the height displacement amount of the movable platen The parallelism is detected and digitized, and the height of the movable platen is determined from the thickness deviation or the parallelism value, and the movable platen is stopped at the same position as the above detection, and the eccentric roller shaft is rotated. A method of injection compression molding of a disk substrate by a toggle type mold clamping device, wherein the height is adjusted to an appropriate height. Height adjustment of the movable platen by the rotation of the eccentric roller shafts of the support device, a toggle type mold clamping apparatus according to claim 1, characterized in that by detecting the rotation amount or rotation angle of the eccentric roller shaft A method for injection compression molding of a disk substrate. Height adjustment of the movable platen by the rotation of the eccentric roller shafts of the support device, the disk substrate by a toggle type mold clamping apparatus according to claim 1, wherein the performed the eccentric roller shaft rotates by a servo motor Injection compression molding method. The height adjustment of the movable platen by the rotation of the eccentric roller shaft of the support device is performed by adjusting the height of the movable platen and the amount of displacement of the movable platen by the rotation of the eccentric roller shaft using a non-contact sensor. injection compression molding method for a disk substrate by a toggle type mold clamping apparatus according to claim 1, wherein the distance and performs detect and between the pedestal. The height adjustment of the movable platen by the rotation of the eccentric roller shaft of the support device is performed by adjusting the height of the movable platen and the amount of displacement of the movable platen by the rotation of the eccentric roller shaft using a non-contact sensor. injection compression molding method for a disk substrate by a toggle type mold clamping apparatus according to claim 1, characterized in that by detecting the distance between the ring surface. Height adjustment of the movable platen by the rotation of the eccentric roller shafts of the support device, the height displacement of the movable platen by the rotation of the height and the eccentric roller shaft movable base, a load of the movable platen to which the support device receives injection compression molding method for a disk substrate by a toggle type mold clamping apparatus according to claim 1, characterized in that is detected by the pressure sensor.

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