JP4369991B2 - 一体化オルタノ−スタータ用コントロール・パワー・モジュール - Google Patents
一体化オルタノ−スタータ用コントロール・パワー・モジュール Download PDFInfo
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- JP4369991B2 JP4369991B2 JP2004518879A JP2004518879A JP4369991B2 JP 4369991 B2 JP4369991 B2 JP 4369991B2 JP 2004518879 A JP2004518879 A JP 2004518879A JP 2004518879 A JP2004518879 A JP 2004518879A JP 4369991 B2 JP4369991 B2 JP 4369991B2
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P9/00—Arrangements for controlling electric generators for the purpose of obtaining a desired output
- H02P9/14—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field
- H02P9/26—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field using discharge tubes or semiconductor devices
- H02P9/30—Arrangements for controlling electric generators for the purpose of obtaining a desired output by variation of field using discharge tubes or semiconductor devices using semiconductor devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N11/0859—Circuits or control means specially adapted for starting of engines specially adapted to the type of the starter motor or integrated into it
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/04—Starting of engines by means of electric motors the motors being associated with current generators
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P9/00—Arrangements for controlling electric generators for the purpose of obtaining a desired output
- H02P9/08—Control of generator circuit during starting or stopping of driving means, e.g. for initiating excitation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02D—CONTROLLING COMBUSTION ENGINES
- F02D2400/00—Control systems adapted for specific engine types; Special features of engine control systems not otherwise provided for; Power supply, connectors or cabling for engine control systems
- F02D2400/18—Packaging of the electronic circuit in a casing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N2011/0881—Components of the circuit not provided for by previous groups
- F02N2011/0896—Inverters for electric machines, e.g. starter-generators
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48229—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad protruding from the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- General Engineering & Computer Science (AREA)
- Control Of Eletrric Generators (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
- Power Conversion In General (AREA)
Description
−伝統的に二つのスリップ・リング706、707に結合されたインダクタを構成する、巻かれた構造のロータ743と、励磁電流をもたらす二つのブラシ。
−複数のコイルまたは巻回体を担持し、電機子507を構成する多相のステータ503であり、該多相のステータは、三相構造の最も多くの場合にはスター結線あるいはデルタ結線され、オルタネータとして作動するときには整流ブリッジに向けて、変換された電力を送り込むもの。
−複数の枝路の付いたトランジスタのブリッジを含むパワー・ユニットと、
−オルタネータ−スタータの相の電圧を基準電圧と比較し、比較結果の値にしたがってパワー・ユニットのトランジスタを指令制御するためのコントロール・ユニットを具備しており、
該コントロール・ユニットが、
−パワー・ユニットの枝路のトランジスタの近傍に接続さている、パワー・ユニットのトランジスタのブリッジの各枝路用のドライバ回路と、
−ドライバ回路を指令制御するための管理回路を含んでいることを特徴としている。
−ドライバ回路の左側に指示された信号で、これは管理回路から発せられた信号であり、そして、
−ドライバ回路の右側に指示された信号で、パワー・ユニットで受信した、またはそのパワー・ユニットへ送信された、つまりドライバ回路が操作するトランジスタへ送信された信号である。
2 管理回路 コントロール回路
3 オルタノ−スタータ オルタネータ−スタータ
10 ドライバ回路
11、12 スイッチング素子 パワートランジスタ
20 ドライバ回路
21、22 スイッチング素子 パワートランジスタ
30 ドライバ回路
31、32 スイッチング素子 パワートランジスタ
50 コントロール・ユニット
100 コントロール・パワー・モジュール
113 放熱器
200 パワー・サブ・モジュール
504 後部軸受体
506 軸受
511 カバー
515 送風ファン
600 トラック
630 コネクタ
Claims (21)
- 自動車用の多相のオルタネータ−スタータのコントロール・パワー・モジュール(100)であり、該モジュールは、自動車用のオルタネータ−スタータ(3)の各相と、車載電源網(Ua)と、アース線(GND)との間に接続され、
−複数の枝路(B1〜B3)の付いたパワートランジスタのブリッジを含むとともに該各枝路は前記オルタネータ−スタータの一つの相にそれぞれ対応するパワー・ユニット(1)と、
−オルタネータ−スタータの相(φ)の電圧を基準電圧(Ua、GND)と比較し、比較結果の値に応じてパワートランジスタを指令制御するためのコントロール・ユニット(50)を具備するものであって、
第一ステージ(100b)であって、前記オルタネータースタータ(3)に一体化され、複数の一体化、小型化された電子・パワー・サブ・モジュール(100b、200)によって形成されており、該電子・パワー・サブ・モジュール(100b、200)の各々は、オルタネータースタータのステータ巻線の各相(φ1、φ2、φ3)の出力位置に配置されている第一ステージと、
第二ステージ(100a)であって、前記電子・パワー・サブ・モジュール(100b、200)とは異なるケースによって形成され、管理回路(2)を備える第二ステージとを含んでおり、
該電子・パワー・サブ・モジュール(100b、200)の各々は、パワー・トランジスタのブリッジの枝路(B1、B2、B3)および該枝路(B1、B2、B3)の全部のパワー・トランジスタ(11、12;21、22;31、32)を操作し、該パワー・トランジスタの最短位置に設置されたドライバ回路(10、20、30)を一体化し、該管理回路(2)は各ドライバ回路(10、20、30)の全体の作動を制御し、該ドライバ回路とともにコントロール・ユニット(50)を形成することを特徴とする、コントロール・パワー・モジュール。 - 前記オルタネータ−スタータの後方に一体化されることを特徴とする、請求項1に記載のコントロール・パワー・モジュール。
- 前記第二ステージが前記オルタネータ−スタータのケースの外部にあることを特徴とする、請求項1又は請求項2に記載のコントロール・パワー・モジュール。
- 前記オルタネータ−スタータが三相で、各相の三つの枝路(B1,B2,B3)の一つがそれぞれ前記パワーユニットに接続され、かつ該三つの枝路が同じものであることを特徴とする、請求項1〜3のいずれか一つに記載にコントロール・パワー・モジュール。
- 前記管理回路(2)の指令制御が、すべてのドライバ回路に共通であることを特徴とする、請求項1〜4のいずれか一つに記載のコントロール・パワー・モジュール。
- 各パワートランジスタが、並列に接続されたパワートランジスタの集合であることを特徴とする、請求項1〜5のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、管理回路(2)から発せられたさまざまな信号(ALG、SC、UA、VD)を、入力で、受信することを特徴とする、請求項1〜6のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、測定信号である、車載電源網の供給電位(UA)と、アース(GND)電位と、相(PH)の電位とのそれぞれの測定信号(MUA、MGND、MPH)を、入力で、受信することを特徴とする、請求項1〜7のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記、各ドライバ回路は、測定すべき電位(PH、VA、GND)の近傍に位置しており、各測定入力(MPH、MVA、MGND)は、縮小された長さの接続線を用い、このことにより、これらの接続線をスルーしうる擾乱に対するこれらの入力の感度を減少させることになることを特徴とする、請求項8に記載のコントロール・パワー・モジュール。
- 前記測定信号(MPH、MVA、MGND)の各接続線が、パワートランジスタ(12、22、32)のアース(GND)の電位と、パワートランジスタ(11、21、31)の供給電圧(UA)と、パワートランジスタ(11、12、21、22、31、32)の相(PH)の電圧とに接続されることを特徴とする、請求項8又は請求項9に記載のコントロール・パワー・モジュール。
- 前記パワー回路からの各測定信号が、前記各ドライバ回路(10、11、12)の二つのコンパレータ(C11、C12)に接続されることを特徴とする、請求項8〜10のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、同一の管理回路(2)によってコントロールされることを特徴とする、請求項1〜11のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、同一枝路(B1、B2、B3)の各パワートランジスタ(11、12、21、22、31、32)を操作することを特徴とする、請求項1〜12のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記ブリッジの各枝路が、ゲートを持つパワートランジスタを少なくとも二つ有し、かつ、前記各ドライバ回路(10、20、30)が、同一の枝路のパワートランジスタ(11、12;21、22;31、32)の各ゲートに接続されることを特徴とする、請求項13に記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、相(φ1、φ2、φ3)の電位をパワートランジスタ(12、22、32)の一つを指令制御するために整流ブリッジのアースの電位と比較し、そして、他のパワートランジスタ(11、21、31)を指令制御するために前記整流ブリッジの出力電圧(Ua)の電位と比較することを特徴とする、請求項14に記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、パワートランジスタ(11、12、21、22、31、32)のゲートの供給信号電圧(ALG)を管理回路(2)から受信することを特徴とする、請求項14又は請求項15に記載のコントロール・パワー・モジュール。
- 前記信号電圧(ALG)が、補助電源によって供給されることを特徴とする、請求項16に記載のコントロール・パワー・モジュール。
- 前記管理回路(2)から送り込まれる信号電圧(ALG)が、16V±1Vの電圧であることを特徴とする、請求項16又は請求項17に記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、管理回路(2)から、信号(SC)、すなわち、オルタネータ−スタータが具備する、オルタネータ−スタータのロータの位置用のセンサによって供給される情報を示す信号を、受信することを特徴とする、請求項7〜18のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記、各ドライバ回路(10、20、30)が、管理回路(2)から、オルタネータ−スタータについて、スタータ・モードの認証情報(VD)か、又は、オルタネータ・モードの認証情報(VA)かを受信することを特徴とする、請求項7〜18のいずれか一つに記載のコントロール・パワー・モジュール。
- 前記各ドライバ回路(10、20、30)が、前記各ドライバ回路の入力に受信された信号に応じて、前記パワートランジスタの各ゲートを指令制御するため、論理回路(13)と電流源(S11、S12)とを備えることを特徴とする、請求項14に記載のコントロール・パワー・モジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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FR0208420A FR2842041B1 (fr) | 2002-07-04 | 2002-07-04 | Module de controle et de puissance d'un alterno-demarreur integrable |
FR0307378A FR2842042A1 (fr) | 2002-07-04 | 2003-06-18 | Module de controle et de puissance d'un alterno-demarreur integrale |
PCT/FR2003/002092 WO2004006423A2 (fr) | 2002-07-04 | 2003-07-04 | Module de controle et de puissance d'une alterno-demarreur integrable |
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JP2005532025A JP2005532025A (ja) | 2005-10-20 |
JP4369991B2 true JP4369991B2 (ja) | 2009-11-25 |
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JP2004518879A Expired - Fee Related JP4369991B2 (ja) | 2002-07-04 | 2003-07-04 | 一体化オルタノ−スタータ用コントロール・パワー・モジュール |
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US (1) | US7224145B2 (ja) |
EP (1) | EP1523803B1 (ja) |
JP (1) | JP4369991B2 (ja) |
KR (1) | KR20050012892A (ja) |
CN (1) | CN100347948C (ja) |
AT (1) | ATE487269T1 (ja) |
DE (1) | DE60334800D1 (ja) |
FR (1) | FR2842042A1 (ja) |
MX (1) | MXPA05000189A (ja) |
PL (1) | PL210932B1 (ja) |
WO (1) | WO2004006423A2 (ja) |
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- 2003-06-18 FR FR0307378A patent/FR2842042A1/fr not_active Withdrawn
- 2003-07-04 DE DE60334800T patent/DE60334800D1/de not_active Expired - Lifetime
- 2003-07-04 PL PL375199A patent/PL210932B1/pl unknown
- 2003-07-04 KR KR10-2005-7000176A patent/KR20050012892A/ko not_active Application Discontinuation
- 2003-07-04 AT AT03748202T patent/ATE487269T1/de not_active IP Right Cessation
- 2003-07-04 EP EP03748202A patent/EP1523803B1/fr not_active Expired - Lifetime
- 2003-07-04 WO PCT/FR2003/002092 patent/WO2004006423A2/fr active Application Filing
- 2003-07-04 MX MXPA05000189A patent/MXPA05000189A/es active IP Right Grant
- 2003-07-04 US US10/519,081 patent/US7224145B2/en not_active Expired - Lifetime
- 2003-07-04 CN CNB038155575A patent/CN100347948C/zh not_active Expired - Lifetime
- 2003-07-04 JP JP2004518879A patent/JP4369991B2/ja not_active Expired - Fee Related
Also Published As
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CN1666405A (zh) | 2005-09-07 |
PL210932B1 (pl) | 2012-03-30 |
EP1523803A2 (fr) | 2005-04-20 |
ATE487269T1 (de) | 2010-11-15 |
MXPA05000189A (es) | 2005-04-08 |
FR2842042A1 (fr) | 2004-01-09 |
KR20050012892A (ko) | 2005-02-02 |
US20050253457A1 (en) | 2005-11-17 |
WO2004006423A2 (fr) | 2004-01-15 |
PL375199A1 (en) | 2005-11-28 |
JP2005532025A (ja) | 2005-10-20 |
DE60334800D1 (de) | 2010-12-16 |
EP1523803B1 (fr) | 2010-11-03 |
US7224145B2 (en) | 2007-05-29 |
CN100347948C (zh) | 2007-11-07 |
WO2004006423A3 (fr) | 2004-04-15 |
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