JP4233536B2 - 光学装置用モジュール - Google Patents
光学装置用モジュール Download PDFInfo
- Publication number
- JP4233536B2 JP4233536B2 JP2005103775A JP2005103775A JP4233536B2 JP 4233536 B2 JP4233536 B2 JP 4233536B2 JP 2005103775 A JP2005103775 A JP 2005103775A JP 2005103775 A JP2005103775 A JP 2005103775A JP 4233536 B2 JP4233536 B2 JP 4233536B2
- Authority
- JP
- Japan
- Prior art keywords
- translucent lid
- optical
- solid
- optical path
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Description
2 固体撮像素子
3 撮像面
5 接着部
6 透光性蓋体
7 配線基板
8 DSP(画像処理装置)
14 封止部
15 螺子部
20 光路画定器
21 レンズ
22 鏡筒(保持体)
23 位置決め爪(位置決め部)
24 弾性体
25 支持部
28 螺子穴部
Claims (7)
- 撮像面を有する固体撮像素子、前記撮像面に対向して配される透光性蓋体及び前記固体撮像素子に前記透光性蓋体を接着する接着部を有する撮像部と、光学部材及び該光学部材を保持する保持体を有し、前記撮像面への光路を画定する光路画定器とを備える光学装置用モジュールにおいて、
前記撮像部は、前記透光性蓋体の一部又は全部を露出させて、前記固体撮像素子及び前記透光性蓋体を樹脂により封止する封止部を有し、
前記光路画定器は、前記保持体に固定された弾性体と、該弾性体を支持する支持部とを有しており、
前記透光性蓋体の前記封止部からの露出部分に前記保持体を、前記弾性体の弾性により押圧した状態で接触させ、前記光路画定器を前記撮像部に固定する固定手段を備え、
該固定手段は、前記撮像部に設けられた螺子部と、前記光路画定器に設けられた螺子穴部とを有し、前記螺子部及び前記螺子穴部を螺嵌して、前記撮像部に前記光路画定器を固定するようにしてあること
を特徴とする光学装置用モジュール。 - 前記撮像部は、導体配線が形成された配線基板と、該配線基板に固定され、前記導体配線に電気的に接続される画像処理装置とを有し、
前記封止部は、前記固体撮像素子及び前記透光性蓋体と共に、前記配線基板及び前記画像処理装置を樹脂により封止するようにしてあること
を特徴とする請求項1に記載の光学装置用モジュール。 - 前記螺子部は、樹脂よりなり、前記封止部と一体的に形成してあること
を特徴とする請求項1又は請求項2に記載の光学装置用モジュール。 - 前記保持体は、前記保持体及び前記透光性蓋体の相対位置を決定する位置決め部を有すること
を特徴とする請求項1乃至請求項3のいずれか1つに記載の光学装置用モジュール。 - 前記透光性蓋体は板状をなし、前記封止部から一つの面と側面の一部又は全部とが露出しており、
前記位置決め部は、前記保持体を前記透光性蓋体の一つの面に接触させた場合に、前記透光性蓋体の側面の少なくとも2箇所に係合する爪部を有すること
を特徴とする請求項4に記載の光学装置用モジュール。 - 前記支持部は、前記弾性体が前記支持部に対して相対移動可能に、前記弾性体を支持するようにしてあること
を特徴とする請求項1乃至請求項5のいずれか1つに記載の光学装置用モジュール。 - 前記光路画定器を前記撮像部に固定した場合、前記保持体は前記封止部と接触しないようにしてあること
を特徴とする請求項1乃至請求項6のいずれか1つに記載の光学装置用モジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103775A JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
EP06251791A EP1708476A3 (en) | 2005-03-31 | 2006-03-30 | Optical device module |
TW095111290A TWI302209B (en) | 2005-03-31 | 2006-03-30 | Optical device module |
US11/396,427 US7294828B2 (en) | 2005-03-31 | 2006-03-30 | Distortion and shock resistant optical device module for image capture |
CNB2006100719797A CN100423562C (zh) | 2005-03-31 | 2006-03-31 | 光学装置模块 |
KR1020060029824A KR100758584B1 (ko) | 2005-03-31 | 2006-03-31 | 광학 장치용 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103775A JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006287533A JP2006287533A (ja) | 2006-10-19 |
JP4233536B2 true JP4233536B2 (ja) | 2009-03-04 |
Family
ID=36676455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005103775A Expired - Fee Related JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US7294828B2 (ja) |
EP (1) | EP1708476A3 (ja) |
JP (1) | JP4233536B2 (ja) |
KR (1) | KR100758584B1 (ja) |
CN (1) | CN100423562C (ja) |
TW (1) | TWI302209B (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7127793B2 (en) * | 2002-04-24 | 2006-10-31 | Fuji Photo Film Co., Ltd. | Method of producing solid state pickup device |
JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
CN1885909A (zh) * | 2005-06-24 | 2006-12-27 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
DE102005059161A1 (de) * | 2005-12-12 | 2007-06-21 | Robert Bosch Gmbh | Optisches Modul sowie Verfahren zur Montage eines optischen Moduls |
KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
JP4189769B2 (ja) * | 2006-10-18 | 2008-12-03 | 進展産業株式会社 | 撮像装置 |
US20080118241A1 (en) * | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
JP4324623B2 (ja) * | 2007-04-27 | 2009-09-02 | シャープ株式会社 | 固体撮像装置およびそれを備えた電子機器 |
JP4340698B2 (ja) | 2007-04-27 | 2009-10-07 | シャープ株式会社 | 光学ユニットおよびそれを備えた固体撮像装置並びに電子機器 |
KR101366251B1 (ko) * | 2007-05-28 | 2014-02-21 | 삼성전자주식회사 | 전자기기의 충격 흡수 장치 |
WO2009057436A1 (ja) * | 2007-11-01 | 2009-05-07 | Konica Minolta Holdings, Inc. | 撮像装置 |
US9118825B2 (en) * | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP2009204721A (ja) * | 2008-02-26 | 2009-09-10 | Fujinon Corp | カメラモジュール及びカメラモジュールの実装方法 |
CN101592772A (zh) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业(深圳)有限公司 | 镜头装置、用于收容该镜头装置的电子装置及摄像设备 |
JP5498684B2 (ja) * | 2008-11-07 | 2014-05-21 | ラピスセミコンダクタ株式会社 | 半導体モジュール及びその製造方法 |
US8654215B2 (en) | 2009-02-23 | 2014-02-18 | Gary Edwin Sutton | Mobile communicator with curved sensor camera |
US8248499B2 (en) * | 2009-02-23 | 2012-08-21 | Gary Edwin Sutton | Curvilinear sensor system |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
CN102036004B (zh) * | 2009-09-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
JP5261548B2 (ja) | 2011-07-29 | 2013-08-14 | シャープ株式会社 | カメラモジュール |
CN104094405B (zh) * | 2012-02-07 | 2019-05-17 | 株式会社尼康 | 拍摄单元及拍摄装置 |
US20130271790A1 (en) * | 2012-04-14 | 2013-10-17 | Shinten Sangyo Co., Ltd. | Imaging Module Unit for Copier |
DE102012210818A1 (de) * | 2012-06-26 | 2014-01-02 | Robert Bosch Gmbh | Kameramodul für ein Fahrzeug und Verfahren zu dessen Herstellung |
TWI650016B (zh) | 2013-08-22 | 2019-02-01 | 新力股份有限公司 | 成像裝置、製造方法及電子設備 |
US9429750B2 (en) * | 2013-09-12 | 2016-08-30 | Sunming Technologies (Hk) Limited | Dust-free lens driving apparatus |
JP6268856B2 (ja) * | 2013-09-24 | 2018-01-31 | 三菱電機株式会社 | 光モジュールおよびその製造方法 |
JP6197538B2 (ja) * | 2013-09-27 | 2017-09-20 | 三菱電機株式会社 | 光モジュール、光モジュール用レンズキャップ |
EP2887637B1 (en) * | 2013-12-19 | 2015-11-04 | Axis AB | Image collector device having a sealed sensor space, and method of sealing a sensor space in an image collector device |
KR102380064B1 (ko) * | 2014-02-18 | 2022-03-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 초점 길이 조정 및/또는 기울기의 축소를 위한 고객 맞춤화 가능한 스페이서를 포함하는 광학 모듈, 및 광학 모듈의 제조 |
US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
US9769361B2 (en) * | 2015-08-31 | 2017-09-19 | Adlink Technology Inc. | Assembly structure for industrial cameras |
US10750071B2 (en) | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
KR102152516B1 (ko) * | 2016-03-28 | 2020-09-04 | 닝보 써니 오포테크 코., 엘티디. | 카메라 모듈과 성형 감광성 어셈블리 및 그 제조 방법, 및 전자 장치 |
EP3493517B1 (en) * | 2016-08-01 | 2023-05-31 | Ningbo Sunny Opotech Co., Ltd. | Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
TWI647828B (zh) | 2017-07-10 | 2019-01-11 | 海華科技股份有限公司 | 可攜式電子裝置及其影像擷取模組與影像感測組件 |
TWI699118B (zh) * | 2017-09-11 | 2020-07-11 | 大陸商寧波舜宇光電信息有限公司 | 攝像模組及其感光元件、電子設備、成型模具和製造方法 |
CN207184660U (zh) * | 2017-09-15 | 2018-04-03 | 南昌欧菲光电技术有限公司 | 摄像模组 |
KR102050739B1 (ko) * | 2017-09-27 | 2019-12-02 | 최도영 | 카메라 모듈 |
JPWO2022270633A1 (ja) * | 2021-06-24 | 2022-12-29 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1003315C2 (nl) * | 1996-06-11 | 1997-12-17 | Europ Semiconductor Assembly E | Werkwijze voor het inkapselen van een geïntegreerde halfgeleiderschake- ling. |
JP2002134725A (ja) * | 2000-10-23 | 2002-05-10 | Htt:Kk | 固体撮像装置 |
KR100422040B1 (ko) | 2001-09-11 | 2004-03-11 | 삼성전기주식회사 | 촬상소자 모듈 패키지 |
JP3787765B2 (ja) * | 2001-11-30 | 2006-06-21 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
JP2003264274A (ja) * | 2002-03-11 | 2003-09-19 | Seiko Instruments Inc | カメラモジュール |
JP4061936B2 (ja) * | 2002-03-22 | 2008-03-19 | コニカミノルタホールディングス株式会社 | 撮像装置 |
JP4285966B2 (ja) * | 2002-09-27 | 2009-06-24 | 三洋電機株式会社 | カメラモジュール |
US6940058B2 (en) * | 2003-02-04 | 2005-09-06 | Kingpak Technology, Inc. | Injection molded image sensor module |
JP2004296453A (ja) | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
JP3768487B2 (ja) | 2003-03-26 | 2006-04-19 | 三菱電機株式会社 | カメラモジュール |
JP4204368B2 (ja) | 2003-03-28 | 2009-01-07 | シャープ株式会社 | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
US7199438B2 (en) * | 2003-09-23 | 2007-04-03 | Advanced Semiconductor Engineering, Inc. | Overmolded optical package |
US6870208B1 (en) * | 2003-09-24 | 2005-03-22 | Kingpak Technology Inc. | Image sensor module |
JP2004266844A (ja) * | 2004-03-26 | 2004-09-24 | Mitsubishi Electric Corp | 撮像装置及びその製造方法 |
JP4446773B2 (ja) * | 2004-03-26 | 2010-04-07 | 富士フイルム株式会社 | 撮影装置 |
-
2005
- 2005-03-31 JP JP2005103775A patent/JP4233536B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/396,427 patent/US7294828B2/en not_active Expired - Fee Related
- 2006-03-30 TW TW095111290A patent/TWI302209B/zh not_active IP Right Cessation
- 2006-03-30 EP EP06251791A patent/EP1708476A3/en not_active Withdrawn
- 2006-03-31 CN CNB2006100719797A patent/CN100423562C/zh not_active Expired - Fee Related
- 2006-03-31 KR KR1020060029824A patent/KR100758584B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2006287533A (ja) | 2006-10-19 |
KR100758584B1 (ko) | 2007-09-13 |
TWI302209B (en) | 2008-10-21 |
EP1708476A2 (en) | 2006-10-04 |
US20060219885A1 (en) | 2006-10-05 |
TW200641430A (en) | 2006-12-01 |
CN1842139A (zh) | 2006-10-04 |
US7294828B2 (en) | 2007-11-13 |
EP1708476A3 (en) | 2008-01-16 |
CN100423562C (zh) | 2008-10-01 |
KR20060105677A (ko) | 2006-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4233536B2 (ja) | 光学装置用モジュール | |
JP4233535B2 (ja) | 光学装置用モジュール、光路画定器及び光学装置用モジュールの製造方法 | |
CN100420275C (zh) | 光学装置模块及光学装置模块的制造方法 | |
CN100534148C (zh) | 摄像装置和便携式终端设备以及摄像装置的制造方法 | |
CN101281286B (zh) | 固体摄像装置及具有该固体摄像装置的电子设备 | |
TWI392337B (zh) | 晶圓為主之攝影機模組及其製造方法 | |
US7391458B2 (en) | Image sensor module | |
JP4324623B2 (ja) | 固体撮像装置およびそれを備えた電子機器 | |
JP2009003073A (ja) | カメラモジュール、台座マウント及び撮像装置 | |
KR20060046412A (ko) | 촬상장치 및 전자기기 | |
JP2007158751A (ja) | 撮像装置及びその製造方法 | |
JP2009186756A (ja) | レンズモジュール及びカメラモジュール | |
JP2007110594A (ja) | カメラモジュール | |
JP2009005328A (ja) | 撮像装置及びその製造方法、並びに該撮像装置を搭載した携帯情報端末及び撮像機器 | |
WO2003015400A1 (en) | Camera module | |
JP2009044494A (ja) | 撮像デバイス | |
JP2008289096A (ja) | 固体撮像モジュール、撮像装置、撮像機器、および固体撮像モジュールの製造方法 | |
JP2006106716A (ja) | カメラモジュール | |
JP4696192B2 (ja) | 固体撮像素子ユニット及びその製造方法並びに撮像装置 | |
JP2006126800A (ja) | カメラモジュール | |
JP2008310049A (ja) | カメラモジュール、台座マウント及び撮像装置 | |
JP2009003058A (ja) | カメラモジュール、台座マウント及び撮像装置 | |
JP2006078941A (ja) | 撮像装置 | |
JP2005072998A (ja) | 撮像装置及び撮像装置の製造方法 | |
JP2006128931A (ja) | 撮像装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080916 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081112 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20081209 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081209 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111219 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111219 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121219 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121219 Year of fee payment: 4 |
|
LAPS | Cancellation because of no payment of annual fees |