KR100758584B1 - 광학 장치용 모듈 - Google Patents
광학 장치용 모듈 Download PDFInfo
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- KR100758584B1 KR100758584B1 KR1020060029824A KR20060029824A KR100758584B1 KR 100758584 B1 KR100758584 B1 KR 100758584B1 KR 1020060029824 A KR1020060029824 A KR 1020060029824A KR 20060029824 A KR20060029824 A KR 20060029824A KR 100758584 B1 KR100758584 B1 KR 100758584B1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
Description
Claims (8)
- 촬상면을 갖는 고체 촬상 소자, 상기 촬상면에 대향하여 배치되는 투광성 덮개부, 및 상기 고체 촬상 소자에 상기 투광성 덮개부를 접착시키는 접착부를 갖는 촬상부와;광학 부재 및 그 광학 부재를 유지하는 홀더를 갖고, 상기 촬상면에 광로를 획정하는 광로 디리미터를 포함하는 광학 장치용 모듈에 있어서:상기 촬상부는 상기 투광성 덮개부의 일부 또는 전부가 노출되는 방식으로 상기 고체 촬상 소자 및 상기 투광성 덮개부를 수지로 밀봉하는 밀봉부를 갖고,상기 투광성 덮개부의 상기 밀봉부로부터의 노출 부분에 상기 홀더를 접촉시킴으로써 상기 광로 디리미터를 상기 촬상부에 고정하는 고정 수단이 구비되고,상기 고정 수단은 상기 촬상부에 제공된 나사부; 상기 광로 디리미터에 제공되고 상기 나사부와 맞물리는 나사 구멍부를 포함하고, 상기 나사부 및 상기 나사 구멍부가 함께 맞물려 상기 촬상부에 상기 광로 디리미터를 고정하는 것을 특징으로 하는 광학 장치용 모듈.
- 제 1 항에 있어서,상기 촬상부는 도체 배선이 형성된 배선 기판; 및 상기 배선 기판에 고정되고 상기 도체 배선에 전기적으로 접속되는 신호 처리 장치를 갖고,상기 밀봉부는 상기 배선 기판 및 상기 신호 처리 장치를 상기 고체 촬상 소 자 및 상기 투광성 덮개부와 함께 수지로 밀봉하는 것을 특징으로 하는 광학 장치용 모듈.
- 제 1 항 또는 제 2 항에 있어서,상기 나사부는 수지로 이루어지고, 상기 밀봉부와 일체 형성되어 있는 것을 특징으로 하는 광학 장치용 모듈.
- 제 1 항 또는 제 2 항에 있어서,상기 홀더는 상기 홀더 및 상기 투광성 덮개부의 상대 위치를 결정하는 위치 결정부를 갖는 것을 특징으로 하는 광학 장치용 모듈.
- 제 4 항에 있어서,상기 투광성 덮개부는 판상을 갖고, 상기 밀봉부로부터 그 하나의 면과 그 측면의 일부 또는 전부가 노출되고,상기 위치 결정부는 상기 홀더가 상기 투광성 덮개부의 하나의 면에 접촉된 경우에, 상기 투광성 덮개부의 측면 중 2이상의 부분과 맞물리는 클로를 갖는 것을 특징으로 하는 광학 장치용 모듈.
- 제 1 항 또는 제 2 항에 있어서,상기 광로 디리미터는 상기 홀더에 고정된 탄성 부재; 및 상기 탄성 부재를 지지하는 지지부를 갖고,상기 광로 디리미터가 상기 촬상부에 고정된 경우에, 상기 탄성 부재가 상기 홀더를 상기 투광성 덮개부에 누르도록 하는 것을 특징으로 하는 광학 장치용 모듈.
- 제 6 항에 있어서,상기 지지부는 상기 탄성 부재가 상기 지지부에 대하여 상대 이동되도록 상기 탄성체를 지지하는 것을 특징으로 하는 광학 장치용 모듈.
- 제 1 항 또는 제 2 항에 있어서,상기 광로 디리미터가 상기 촬상부에 고정된 경우, 상기 홀더는 상기 밀봉부와 접촉하지 않는 것을 특징으로 하는 광학 장치용 모듈.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103775A JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
JPJP-P-2005-00103775 | 2005-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060105677A KR20060105677A (ko) | 2006-10-11 |
KR100758584B1 true KR100758584B1 (ko) | 2007-09-13 |
Family
ID=36676455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060029824A KR100758584B1 (ko) | 2005-03-31 | 2006-03-31 | 광학 장치용 모듈 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7294828B2 (ko) |
EP (1) | EP1708476A3 (ko) |
JP (1) | JP4233536B2 (ko) |
KR (1) | KR100758584B1 (ko) |
CN (1) | CN100423562C (ko) |
TW (1) | TWI302209B (ko) |
Cited By (1)
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WO2019066128A1 (ko) * | 2017-09-27 | 2019-04-04 | 최도영 | 카메라 모듈 |
Families Citing this family (39)
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US7127793B2 (en) * | 2002-04-24 | 2006-10-31 | Fuji Photo Film Co., Ltd. | Method of producing solid state pickup device |
JP2006276463A (ja) * | 2005-03-29 | 2006-10-12 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
CN1885909A (zh) * | 2005-06-24 | 2006-12-27 | 鸿富锦精密工业(深圳)有限公司 | 数码相机模块 |
DE102005059161A1 (de) * | 2005-12-12 | 2007-06-21 | Robert Bosch Gmbh | Optisches Modul sowie Verfahren zur Montage eines optischen Moduls |
KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
JP4189769B2 (ja) * | 2006-10-18 | 2008-12-03 | 進展産業株式会社 | 撮像装置 |
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JP4324623B2 (ja) * | 2007-04-27 | 2009-09-02 | シャープ株式会社 | 固体撮像装置およびそれを備えた電子機器 |
JP4340698B2 (ja) | 2007-04-27 | 2009-10-07 | シャープ株式会社 | 光学ユニットおよびそれを備えた固体撮像装置並びに電子機器 |
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US9118825B2 (en) * | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP2009204721A (ja) * | 2008-02-26 | 2009-09-10 | Fujinon Corp | カメラモジュール及びカメラモジュールの実装方法 |
CN101592772A (zh) * | 2008-05-27 | 2009-12-02 | 鸿富锦精密工业(深圳)有限公司 | 镜头装置、用于收容该镜头装置的电子装置及摄像设备 |
JP5498684B2 (ja) * | 2008-11-07 | 2014-05-21 | ラピスセミコンダクタ株式会社 | 半導体モジュール及びその製造方法 |
US8654215B2 (en) | 2009-02-23 | 2014-02-18 | Gary Edwin Sutton | Mobile communicator with curved sensor camera |
US8248499B2 (en) * | 2009-02-23 | 2012-08-21 | Gary Edwin Sutton | Curvilinear sensor system |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
CN102036004B (zh) * | 2009-09-30 | 2013-07-03 | 鸿富锦精密工业(深圳)有限公司 | 成像模组 |
JP5261548B2 (ja) | 2011-07-29 | 2013-08-14 | シャープ株式会社 | カメラモジュール |
CN104094405B (zh) * | 2012-02-07 | 2019-05-17 | 株式会社尼康 | 拍摄单元及拍摄装置 |
US20130271790A1 (en) * | 2012-04-14 | 2013-10-17 | Shinten Sangyo Co., Ltd. | Imaging Module Unit for Copier |
DE102012210818A1 (de) * | 2012-06-26 | 2014-01-02 | Robert Bosch Gmbh | Kameramodul für ein Fahrzeug und Verfahren zu dessen Herstellung |
TWI650016B (zh) | 2013-08-22 | 2019-02-01 | 新力股份有限公司 | 成像裝置、製造方法及電子設備 |
US9429750B2 (en) * | 2013-09-12 | 2016-08-30 | Sunming Technologies (Hk) Limited | Dust-free lens driving apparatus |
JP6268856B2 (ja) * | 2013-09-24 | 2018-01-31 | 三菱電機株式会社 | 光モジュールおよびその製造方法 |
JP6197538B2 (ja) * | 2013-09-27 | 2017-09-20 | 三菱電機株式会社 | 光モジュール、光モジュール用レンズキャップ |
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KR102380064B1 (ko) * | 2014-02-18 | 2022-03-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 초점 길이 조정 및/또는 기울기의 축소를 위한 고객 맞춤화 가능한 스페이서를 포함하는 광학 모듈, 및 광학 모듈의 제조 |
US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
US9769361B2 (en) * | 2015-08-31 | 2017-09-19 | Adlink Technology Inc. | Assembly structure for industrial cameras |
US10750071B2 (en) | 2016-03-12 | 2020-08-18 | Ningbo Sunny Opotech Co., Ltd. | Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof |
KR102152516B1 (ko) * | 2016-03-28 | 2020-09-04 | 닝보 써니 오포테크 코., 엘티디. | 카메라 모듈과 성형 감광성 어셈블리 및 그 제조 방법, 및 전자 장치 |
EP3493517B1 (en) * | 2016-08-01 | 2023-05-31 | Ningbo Sunny Opotech Co., Ltd. | Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods |
US20180315894A1 (en) * | 2017-04-26 | 2018-11-01 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
TWI647828B (zh) | 2017-07-10 | 2019-01-11 | 海華科技股份有限公司 | 可攜式電子裝置及其影像擷取模組與影像感測組件 |
TWI699118B (zh) * | 2017-09-11 | 2020-07-11 | 大陸商寧波舜宇光電信息有限公司 | 攝像模組及其感光元件、電子設備、成型模具和製造方法 |
CN207184660U (zh) * | 2017-09-15 | 2018-04-03 | 南昌欧菲光电技术有限公司 | 摄像模组 |
JPWO2022270633A1 (ko) * | 2021-06-24 | 2022-12-29 |
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2005
- 2005-03-31 JP JP2005103775A patent/JP4233536B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/396,427 patent/US7294828B2/en not_active Expired - Fee Related
- 2006-03-30 TW TW095111290A patent/TWI302209B/zh not_active IP Right Cessation
- 2006-03-30 EP EP06251791A patent/EP1708476A3/en not_active Withdrawn
- 2006-03-31 CN CNB2006100719797A patent/CN100423562C/zh not_active Expired - Fee Related
- 2006-03-31 KR KR1020060029824A patent/KR100758584B1/ko not_active IP Right Cessation
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JP2004297282A (ja) * | 2003-03-26 | 2004-10-21 | Mitsubishi Electric Corp | カメラモジュール |
JP2004301938A (ja) * | 2003-03-28 | 2004-10-28 | Sharp Corp | 光学装置用モジュール及び光学装置用モジュールの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019066128A1 (ko) * | 2017-09-27 | 2019-04-04 | 최도영 | 카메라 모듈 |
KR20190036281A (ko) * | 2017-09-27 | 2019-04-04 | 최도영 | 카메라 모듈 |
KR102050739B1 (ko) * | 2017-09-27 | 2019-12-02 | 최도영 | 카메라 모듈 |
US11650390B2 (en) | 2017-09-27 | 2023-05-16 | Do Young Choi | Camera module |
Also Published As
Publication number | Publication date |
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JP2006287533A (ja) | 2006-10-19 |
TWI302209B (en) | 2008-10-21 |
EP1708476A2 (en) | 2006-10-04 |
US20060219885A1 (en) | 2006-10-05 |
TW200641430A (en) | 2006-12-01 |
CN1842139A (zh) | 2006-10-04 |
US7294828B2 (en) | 2007-11-13 |
JP4233536B2 (ja) | 2009-03-04 |
EP1708476A3 (en) | 2008-01-16 |
CN100423562C (zh) | 2008-10-01 |
KR20060105677A (ko) | 2006-10-11 |
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